HiSilicon Kirin 810
Benchmarks & Specs
Last updated:
| Property | Value |
|---|---|
| Family | HiSilicon Kirin (29) |
| CPU group | HiSilicon Kirin 810/820 (3) |
| Architecture | Cortex-A76 / Cortex-A55 |
| Technology | 7 nm |
| Segment | Smartphone / Tablet |
| Socket | |
| Generation | 6 |
| Predecessor | |
| Successor |
| Property | Value |
|---|---|
| CPU Cores / Threads | 8 / 8 |
| Hyperthreading / SMT | ✗ |
| Core architecture | hybrid (big.LITTLE) |
| Core Cluster 1: | 2x Cortex-A76 2.20 GHz |
| Core Cluster 2: | 6x Cortex-A55 1.90 GHz |
| L2-Cache | |
| L3-Cache | 1.00 MB |
| Overclocking | No |
| Property | Value |
|---|---|
| GPU name | ARM Mali-G52 MP6 |
| GPU frequency | 0.85 GHz |
| CUs / Shader | 16 / 288 |
| Raytracing | ✗ |
| Max. displays | 2 |
| Max. GPU Memory | 4 GB |
| Technology | 12 nm |
| Release date | Q1/2018 |
| Memory type | Memory bandwidth |
|---|---|
| LPDDR4X-2133 | -- |
| Property | Value |
| Max. Memory | 6 GB |
| Memory channels | 4 |
| ECC | ✗ |
| PCIe | |
| PCIe Bandwidth |
| Property | Value |
|---|---|
| TDP | 5 W |
| TDP (PL2) | |
| TDP up | |
| TDP down | |
| T. junction max. |
| Property | Value |
|---|---|
| Chip design | Chiplet |
| AES-NI | ✗ |
| Operating systems | Android |
| Instruction set | Armv8-A (64 bit) |
| ISA extensions | |
| Release date | Q2/2019 |
| Release price | |
| Documents |