HiSilicon Kirin 810

HiSilicon Kirin 810
Benchmarks & Specs

Last updated:
The HiSilicon Kirin 810 is a mobile processor noted for its balanced design. Particularly noteworthy is its manufacture using the 7-nanometer process; this then-advanced technology enabled remarkable energy efficiency. This was crucial for long battery life in the devices in which it was used.

Its architecture was based on an intelligent combination of two powerful Cortex-A76 cores for more demanding tasks and six efficient Cortex-A55 cores for everyday use. This well-thought-out division ensured convincing overall performance. An ARM Mali-G52 MP6 graphics unit was also integrated, offering competent rendering for numerous graphical applications and the then-common games.

To this day, the HiSilicon Kirin 810 provides a solid foundation for many basic smartphone functions and moderate applications. It demonstrated how much performance and efficiency a processor of this class could offer. We believe its original design still holds up well.
  • 7 nm manufacturing process
  • Balanced Cortex-A76 / Cortex-A55 architecture
  • Integrated ARM Mali-G52 MP6 graphics unit

Performance Overview
Average performance across multiple benchmarks

Single-core performance
Rank 92 / 176
In segment Smartphone / Tablet
Multi-core performance
Rank 85 / 177
In segment Smartphone / Tablet
Geekbench 6 Single-Core

Geekbench 6 Single-Core
Single-core performance

Qualcomm Snapdragon 690 5G
8C / 8T · 2.00 GHz
779
Qualcomm Snapdragon 765
8C / 8T · 2.30 GHz
774
HiSilicon Kirin 810
8C / 8T · 2.20 GHz
772
Apple A9X
Apple A9X 99 %
2C / 2T · 2.26 GHz
763
MediaTek Dimensity 800U
8C / 8T · 2.40 GHz
753
Geekbench 6 Multi-Core

Geekbench 6 Multi-Core
Multi-core performance

Samsung Exynos 9825
8C / 8T · 2.73 GHz
2,069
Qualcomm Snapdragon 695 5G
8C / 8T · 2.20 GHz
2,044
HiSilicon Kirin 810
8C / 8T · 2.20 GHz
2,035
Qualcomm Snapdragon 845
8C / 8T · 2.80 GHz
2,022
Qualcomm Snapdragon 480 Plus 5G
8C / 8T · 2.20 GHz
2,011
Geekbench 5, 64bit Single-Core

Geekbench 5, 64bit Single-Core
Single-core performance

MediaTek Dimensity 1000C
8C / 8T · 2.00 GHz
598
MediaTek Dimensity 800U
8C / 8T · 2.40 GHz
593
HiSilicon Kirin 810
8C / 8T · 2.20 GHz
592
Qualcomm Snapdragon 690 5G
8C / 8T · 2.00 GHz
585
MediaTek Dimensity 810
8C / 8T · 2.40 GHz
564
Geekbench 5, 64bit Multi-Core

Geekbench 5, 64bit Multi-Core
Multi-core performance

Qualcomm Snapdragon 750G
8C / 8T · 2.20 GHz
1,922
Samsung Exynos 9810
8C / 8T · 2.90 GHz
1,913
HiSilicon Kirin 810
8C / 8T · 2.20 GHz
1,898
MediaTek Dimensity 7020
8C / 8T · 2.20 GHz
1,877
Samsung Exynos 1280
8C / 8T · 2.40 GHz
1,855
iGPU - FP32 Performance (Single-precision GFLOPS)

iGPU - FP32 Performance (Single-precision GFLOPS)

HiSilicon Kirin 950
ARM Mali-T880 MP4
122
HiSilicon Kirin 955
ARM Mali-T880 MP4
122
HiSilicon Kirin 810
ARM Mali-G52 MP6
122
MediaTek Helio X27
ARM Mali-T880 MP4
119
MediaTek Helio X25
ARM Mali-T880 MP4
116
AnTuTu 9 Benchmark

AnTuTu 9 Benchmark
Multi-core performance

Qualcomm Snapdragon 690 5G
8C / 8T · 2.00 GHz
345,622 pts
MediaTek Helio G95
8C / 8T · 2.05 GHz
341,270 pts
HiSilicon Kirin 810
8C / 8T · 2.20 GHz
338,464 pts
MediaTek Dimensity 810
8C / 8T · 2.40 GHz
334,641 pts
Qualcomm Snapdragon 720G
8C / 8T · 2.30 GHz
332,605 pts
AnTuTu 8 Benchmark

AnTuTu 8 Benchmark

Samsung Exynos 9810
8C / 8T · 2.90 GHz
313,877 pts
MediaTek Dimensity 800
8C / 8T · 2.00 GHz
308,468 pts
HiSilicon Kirin 810
8C / 8T · 2.20 GHz
301,946 pts
MediaTek Helio G95
8C / 8T · 2.05 GHz
296,193 pts
Apple A11 Bionic
6C / 6T · 2.39 GHz
295,465 pts

More benchmarks

At a glance

PropertyValue
FamilyHiSilicon Kirin (29)
CPU groupHiSilicon Kirin 810/820 (3)
ArchitectureCortex-A76 / Cortex-A55
Technology7 nm
SegmentSmartphone / Tablet
Socket
Generation6
Predecessor
Successor

CPU Cores and Base Frequency

PropertyValue
CPU Cores / Threads8 / 8
Hyperthreading / SMT
Core architecturehybrid (big.LITTLE)
Core Cluster 1: 2x Cortex-A76
2.20 GHz
Core Cluster 2: 6x Cortex-A55
1.90 GHz
L2-Cache
L3-Cache1.00 MB
OverclockingNo

Integrated graphics (iGPU)

PropertyValue
GPU nameARM Mali-G52 MP6
GPU frequency0.85 GHz
CUs / Shader16 / 288
Raytracing
Max. displays2
Max. GPU Memory4 GB
Technology12 nm
Release dateQ1/2018

Memory & PCIe

Memory typeMemory bandwidth
LPDDR4X-2133
--
PropertyValue
Max. Memory6 GB
Memory channels4
ECC
PCIe
PCIe Bandwidth

Thermal Management

PropertyValue
TDP5 W
TDP (PL2)
TDP up
TDP down
T. junction max.

Technical details

PropertyValue
Chip designChiplet
AES-NI
Operating systemsAndroid
Instruction setArmv8-A (64 bit)
ISA extensions
Release dateQ2/2019
Release price
Documents
HiSilicon Kirin 810
HiSilicon Kirin 810
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