Name: | HiSilicon Kirin 810 |
---|---|
Family: | HiSilicon Kirin (29) |
CPU group: | HiSilicon Kirin 810/820 (3) |
Architecture: | Cortex-A76 / Cortex-A55 |
Technology: | 7 nm |
Segment: | Smartphone / Tablet |
Generation: | 6 |
Predecessor: | -- |
Successor: | -- |
CPU Cores / Threads: | 8 / 8 |
---|---|
Core architecture: | hybrid (big.LITTLE) |
A-Core: | 2x Cortex-A76 |
B-Core: | 6x Cortex-A55 |
Hyperthreading / SMT: | No |
---|---|
Overclocking: | No |
A-Core Frequency: | 2.20 GHz |
B-Core Frequency: | 1.90 GHz |
GPU name: | ARM Mali-G52 MP6 |
---|---|
GPU frequency: | 0.85 GHz |
GPU (Turbo): | No turbo |
Compute units: | 16 |
Shader: | 288 |
Hardware Raytracing: | No |
Release date: | Q1/2018 |
Max. displays: | 2 |
---|---|
Generation: | Bifrost 2 |
Direct X: | 12 |
Technology: | 12 nm |
Max. GPU Memory: | 4 GB |
Frame Generation: | No |
h265 / HEVC (8 bit): | Decode / Encode |
---|---|
h265 / HEVC (10 bit): | Decode / Encode |
h264: | Decode / Encode |
VP8: | Decode / Encode |
VP9: | Decode / Encode |
AV1: | No |
---|---|
AVC: | Decode / Encode |
VC-1: | Decode / Encode |
JPEG: | Decode / Encode |
Memory & PCIeThe processor can use up to 6 GB memory in 4 (Quad Channel) memory channels. The maximum memory bandwidth is --. The memory type as well as the amount of memory can greatly affect the speed of the system. |
|
Memory type: | Memory bandwidth: |
---|---|
LPDDR4X-2133 | -- |
Max. Memory: | 6 GB |
Memory channels: | 4 (Quad Channel) |
ECC: | No |
PCIe: | |
PCIe Bandwidth: | -- |
Thermal ManagementThe thermal design power (TDP for short) of the processor is 5 W. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. The TDP usually gives a rough idea of the actual power consumption of the CPU. |
|
---|---|
TDP (PL1 / PBP): | 5 W |
TDP (PL2): | -- |
TDP up: | -- |
TDP down: | -- |
Tjunction max.: | -- |
Technology: | 7 nm |
---|---|
Chip design: | Chiplet |
Socket: | -- |
L2-Cache: | -- |
L3-Cache: | 1.00 MB |
AES-NI: | No |
Operating systems: | Android |
Virtualization: | None |
---|---|
Instruction set (ISA): | Armv8-A (64 bit) |
ISA extensions: | -- |
Release date: | Q2/2019 |
Release price: | -- |
Part Number: | -- |
Documents: | -- |
Qualcomm Snapdragon 765G
8C 8T @ 2.40 GHz |
|||
Qualcomm Snapdragon 690 5G
8C 8T @ 2.00 GHz |
|||
Qualcomm Snapdragon 765
8C 8T @ 2.30 GHz |
|||
HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
|||
Apple A9X
2C 2T @ 2.26 GHz |
|||
MediaTek Dimensity 800U
8C 8T @ 2.40 GHz |
|||
MediaTek Dimensity 810
8C 8T @ 2.40 GHz |
Samsung Exynos 9820
8C 8T @ 2.70 GHz |
|||
Samsung Exynos 9825
8C 8T @ 2.73 GHz |
|||
Qualcomm Snapdragon 695 5G
8C 8T @ 2.20 GHz |
|||
HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
|||
Qualcomm Snapdragon 845
8C 8T @ 2.80 GHz |
|||
Qualcomm Snapdragon 480 Plus 5G
8C 8T @ 2.20 GHz |
|||
Apple A11 Bionic
6C 6T @ 2.39 GHz |
Samsung Exynos 9810
8C 8T @ 2.90 GHz |
|||
MediaTek Dimensity 1000C
8C 8T @ 2.00 GHz |
|||
MediaTek Dimensity 800U
8C 8T @ 2.40 GHz |
|||
HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
|||
Qualcomm Snapdragon 690 5G
8C 8T @ 2.00 GHz |
|||
MediaTek Dimensity 810
8C 8T @ 2.40 GHz |
|||
Qualcomm Snapdragon 732G
8C 8T @ 2.30 GHz |
Qualcomm Snapdragon 695 5G
8C 8T @ 2.20 GHz |
|||
Qualcomm Snapdragon 750G
8C 8T @ 2.20 GHz |
|||
Samsung Exynos 9810
8C 8T @ 2.90 GHz |
|||
HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
|||
MediaTek Dimensity 7020
8C 8T @ 2.20 GHz |
|||
Samsung Exynos 1280
8C 8T @ 2.40 GHz |
|||
Samsung Exynos 880
8C 8T @ 2.00 GHz |
Qualcomm Snapdragon 626
Qualcomm Adreno 506 @ 0.65 GHz |
|||
HiSilicon Kirin 950
ARM Mali-T880 MP4 @ 0.90 GHz |
|||
HiSilicon Kirin 955
ARM Mali-T880 MP4 @ 0.90 GHz |
|||
HiSilicon Kirin 810
ARM Mali-G52 MP6 @ 0.85 GHz |
|||
MediaTek Helio X27
ARM Mali-T880 MP4 @ 0.88 GHz |
|||
MediaTek Helio X25
ARM Mali-T880 MP4 @ 0.85 GHz |
|||
Apple A7
PowerVR G6430 @ 0.45 GHz |
Qualcomm Snapdragon 732G
8C 8T @ 2.30 GHz |
|||
Qualcomm Snapdragon 690 5G
8C 8T @ 2.00 GHz |
|||
MediaTek Helio G95
8C 8T @ 2.05 GHz |
|||
HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
|||
MediaTek Helio G96
8C 8T @ 2.05 GHz |
|||
MediaTek Dimensity 810
8C 8T @ 2.40 GHz |
|||
Qualcomm Snapdragon 720G
8C 8T @ 2.30 GHz |
Qualcomm Snapdragon 765G
8C 8T @ 2.40 GHz |
|||
Samsung Exynos 9810
8C 8T @ 2.90 GHz |
|||
MediaTek Dimensity 800
8C 8T @ 2.00 GHz |
|||
HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
|||
MediaTek Helio G95
8C 8T @ 2.05 GHz |
|||
Apple A11 Bionic
6C 6T @ 2.39 GHz |
|||
Qualcomm Snapdragon 765
8C 8T @ 2.30 GHz |