MediaTek Dimensity 810

MediaTek Dimensity 810
Benchmarks & Specs

Last updated:
The MediaTek Dimensity 810 established itself as a solid processor for mobile devices. Its manufacture using the advanced 6-nanometer process was a clear advantage at the time. It enabled remarkable energy efficiency, which had a positive impact on battery life. Inside, a combination of Cortex-A76 and Cortex-A55 cores works.

This architecture offered a balanced performance for everyday tasks. The Dimensity 810 proved reliable when browsing, using social media, or with common apps. The integrated graphics unit, an ARM Mali-G57 MP2, is also worth mentioning. It was and is sufficient for smooth video playback. Light mobile games also run well on it.

With a maximum memory bandwidth of 17 GB/s, data access is sufficiently fast for this class. Even though there are newer chips now, the MediaTek Dimensity 810 still offers solid performance. It is a reliable choice for most common applications. We still see it in use in many devices.
  • Efficient 6-nanometer manufacturing
  • Balanced performance through Cortex-A76/Cortex-A55 cores
  • Integrated ARM Mali-G57 MP2 graphics
  • Reliable for everyday applications

Performance Overview
Average performance across multiple benchmarks

Single-core performance
Rank 95 / 176
In segment Smartphone / Tablet
Multi-core performance
Rank 103 / 177
In segment Smartphone / Tablet
Geekbench 6 Single-Core

Geekbench 6 Single-Core
Single-core performance

Apple A9X
Apple A9X 102 %
2C / 2T · 2.26 GHz
763
MediaTek Dimensity 800U
8C / 8T · 2.40 GHz
753
MediaTek Dimensity 810
8C / 8T · 2.40 GHz
746
Qualcomm Snapdragon 732G
8C / 8T · 2.30 GHz
732
Qualcomm Snapdragon 720G
8C / 8T · 2.30 GHz
732
Geekbench 6 Multi-Core

Geekbench 6 Multi-Core
Multi-core performance

Qualcomm Snapdragon 720G
8C / 8T · 2.30 GHz
1,770
MediaTek Helio G95
8C / 8T · 2.05 GHz
1,755
MediaTek Dimensity 810
8C / 8T · 2.40 GHz
1,705
Qualcomm Snapdragon 732G
8C / 8T · 2.30 GHz
1,684
Qualcomm Snapdragon 730G
8C / 8T · 2.20 GHz
1,671
Geekbench 5, 64bit Single-Core

Geekbench 5, 64bit Single-Core
Single-core performance

HiSilicon Kirin 810
8C / 8T · 2.20 GHz
592
Qualcomm Snapdragon 690 5G
8C / 8T · 2.00 GHz
585
MediaTek Dimensity 810
8C / 8T · 2.40 GHz
564
Qualcomm Snapdragon 732G
8C / 8T · 2.30 GHz
558
Apple A9
Apple A9 99 %
2C / 2T · 1.85 GHz
558
Geekbench 5, 64bit Multi-Core

Geekbench 5, 64bit Multi-Core
Multi-core performance

MediaTek Dimensity 6080
8C / 8T · 2.40 GHz
1,810
Qualcomm Snapdragon 685 4G
8C / 8T · 2.80 GHz
1,789
MediaTek Dimensity 810
8C / 8T · 2.40 GHz
1,788
MediaTek Dimensity 800U
8C / 8T · 2.40 GHz
1,783
Qualcomm Snapdragon 765
8C / 8T · 2.30 GHz
1,765
iGPU - FP32 Performance (Single-precision GFLOPS)

iGPU - FP32 Performance (Single-precision GFLOPS)

HiSilicon Kirin 960
ARM Mali-G71 MP8
245
HiSilicon Kirin 960S
ARM Mali-G71 MP8
245
MediaTek Dimensity 810
ARM Mali-G57 MP2
243
MediaTek Dimensity 700
ARM Mali-G57 MP2
243
MediaTek Helio G96
ARM Mali-G57 MP2
243
AnTuTu 9 Benchmark

AnTuTu 9 Benchmark
Multi-core performance

HiSilicon Kirin 810
8C / 8T · 2.20 GHz
338,464 pts
MediaTek Helio G96
8C / 8T · 2.05 GHz
338,464 pts
MediaTek Dimensity 810
8C / 8T · 2.40 GHz
334,641 pts
Qualcomm Snapdragon 720G
8C / 8T · 2.30 GHz
332,605 pts
MediaTek Helio G90T
8C / 8T · 2.05 GHz
327,844 pts

More benchmarks

At a glance

PropertyValue
FamilyMediatek Dimensity (38)
CPU groupMediaTek Dimensity 810 (1)
ArchitectureCortex-A76 / Cortex-A55
Technology6 nm
SegmentSmartphone / Tablet
Socket
Generation2
Predecessor
Successor

CPU Cores and Base Frequency

PropertyValue
CPU Cores / Threads8 / 8
Hyperthreading / SMT
Core architecturehybrid (big.LITTLE)
Core Cluster 1: 4x Cortex-A76
2.40 GHz
Core Cluster 2: 4x Cortex-A55
2.00 GHz
L2-Cache
L3-Cache
OverclockingNo

Integrated graphics (iGPU)

PropertyValue
GPU nameARM Mali-G57 MP2
GPU frequency0.25 - 0.95 GHz
CUs / Shader2 / 32
Raytracing
Max. displays2
Max. GPU Memory4 GB
Technology7 nm
Release dateQ2/2020

Memory & PCIe

Memory typeMemory bandwidth
LPDDR4X-4266
17.2 GB/s
PropertyValue
Max. Memory16 GB
Memory channels2
ECC
PCIe
PCIe Bandwidth

Thermal Management

PropertyValue
TDP
TDP (PL2)
TDP up
TDP down
T. junction max.

Technical details

PropertyValue
Chip designChiplet
AES-NI
Operating systemsAndroid
Instruction setArmv8-A (64 bit)
ISA extensions
Release dateQ3/2021
Release price
DocumentsTechnical data sheet
MediaTek Dimensity 810
MediaTek Dimensity 810
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