VS
Qualcomm Snapdragon 855 Plus vs MediaTek Dimensity 9300
Letzte Aktualisierung:
|
Wischen
|
Qualcomm Snapdragon 855 Plus | MediaTek Dimensity 9300 |
|---|---|---|
| Familie | Qualcomm Snapdragon (105) | Mediatek Dimensity (38) |
| CPU Gruppe | Qualcomm Snapdragon 855/860 (3) | MediaTek Dimensity 9300 (2) |
| Architektur | Kryo 485 | Cortex-X4 / -A720 |
| Technologie | 7 nm | 4 nm |
| Segment | Smartphone / Tablet | Smartphone / Tablet |
| Sockel | ||
| Vorgänger | MediaTek Dimensity 9200+ | |
| Nachfolger | Qualcomm Snapdragon 860 | MediaTek Dimensity 9300+ |
|
Wischen
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Qualcomm Snapdragon 855 Plus | MediaTek Dimensity 9300 |
|---|---|---|
| CPU Kerne / Threads | 8 / 8 | 8 / 8 |
| Hyperthreading / SMT | ✗ | ✗ |
| Kernarchitektur | hybrid (Prime / big.LITTLE) | hybrid (big.LITTLE) |
| Core Cluster 1: | 1x Kryo 485 Prime 2,96 GHz |
1x Cortex-X4 3,25 GHz |
| Core Cluster 2: | 3x Kryo 485 Gold 2,42 GHz |
3x Cortex-X4 2,85 GHz |
| Core Cluster 3: | 4x Kryo 485 Silver 1,80 GHz |
4x Cortex-A720 2,00 GHz |
| L2-Cache | 2,00 MB | |
| L3-Cache | 3,00 MB | 18,00 MB |
| Übertaktung | ✗ | ✗ |
|
Wischen
|
Qualcomm Snapdragon 855 Plus | MediaTek Dimensity 9300 |
|---|---|---|
| GPU Name | Qualcomm Adreno 640 | ARM Immortalis-G720 MC12 |
| Grafik-Taktfrequenz | 0,25 - 0,68 GHz | 1,00 GHz |
| CUs / Shader | 4 / 384 | 12 / |
| Raytracing | ✗ | ✗ |
| Max. Bildschirme | 1 | 0 |
| Max. GPU Speicher | 4 GB | |
| Technologie | 7 nm | 4 nm |
| Erscheinungsdatum | Q1/2019 | Q4/2023 |
|
Wischen
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Qualcomm Snapdragon 855 Plus | MediaTek Dimensity 9300 |
|---|---|---|
| KI-Hardware | Qualcomm AI engine | Mediatek APU |
| KI-Spezifikationen | Hexagon 690 @ 7 TOPS | MediaTek APU 790 @ 33 TOPS |
| NPU + CPU + iGPU |
|
Wischen
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Qualcomm Snapdragon 855 Plus | MediaTek Dimensity 9300 |
|---|---|---|
| Arbeitsspeicher | LPDDR4X-4266 (34,1 GB/s) | LPDDR5X-9600 (76,8 GB/s) |
| Max. Speicher | 12 GB | 16 GB |
| Speicherkanäle | 4 | 4 |
| ECC | Nein | Nein |
| PCIe | ||
| PCIe Bandbreite |
|
Wischen
|
Qualcomm Snapdragon 855 Plus | MediaTek Dimensity 9300 |
|---|---|---|
| TDP | 12.5 W | |
| TDP (PL2) | ||
| TDP up | ||
| TDP down | ||
| T. junction max. |
|
Wischen
|
Qualcomm Snapdragon 855 Plus | MediaTek Dimensity 9300 |
|---|---|---|
| Chip-Design | Chiplet | Chiplet |
| AES-NI | ✗ | ✗ |
| Betriebssysteme | Android | Android |
| Befehlssatz | Armv8-A (64 bit) | Armv9-A (64 bit) |
| ISA Erweiterungen | ||
| Erscheinungsdatum | Q4/2018 | Q4/2023 |
| Erscheinungspreis | ||
| Dokumente | Technisches Datenblatt | Technisches Datenblatt |