VS
Qualcomm Snapdragon 855 Plus vs MediaTek Dimensity 9300
Dernière mise à jour:
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Wischen
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Qualcomm Snapdragon 855 Plus | MediaTek Dimensity 9300 |
|---|---|---|
| Famille | Qualcomm Snapdragon (105) | Mediatek Dimensity (38) |
| Groupe de processeurs | Qualcomm Snapdragon 855/860 (3) | MediaTek Dimensity 9300 (2) |
| Architecture | Kryo 485 | Cortex-X4 / -A720 |
| La technologie | 7 nm | 4 nm |
| Segment | Smartphone / Tablet | Smartphone / Tablet |
| Socket | ||
| Prédécesseur | MediaTek Dimensity 9200+ | |
| Successeur | Qualcomm Snapdragon 860 | MediaTek Dimensity 9300+ |
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Wischen
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Qualcomm Snapdragon 855 Plus | MediaTek Dimensity 9300 |
|---|---|---|
| CPU Cores / Threads | 8 / 8 | 8 / 8 |
| Hyperthreading / SMT | ✗ | ✗ |
| Architecture de base | hybrid (Prime / big.LITTLE) | hybrid (big.LITTLE) |
| Core Cluster 1: | 1x Kryo 485 Prime 2.96 GHz |
1x Cortex-X4 3.25 GHz |
| Core Cluster 2: | 3x Kryo 485 Gold 2.42 GHz |
3x Cortex-X4 2.85 GHz |
| Core Cluster 3: | 4x Kryo 485 Silver 1.80 GHz |
4x Cortex-A720 2.00 GHz |
| L2-Cache | 2.00 MB | |
| L3-Cache | 3.00 MB | 18.00 MB |
| Overclocking | ✗ | ✗ |
|
Wischen
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Qualcomm Snapdragon 855 Plus | MediaTek Dimensity 9300 |
|---|---|---|
| Nom du GPU | Qualcomm Adreno 640 | ARM Immortalis-G720 MC12 |
| Fréquence GPU | 0.25 - 0.68 GHz | 1.00 GHz |
| CUs / Shader | 4 / 384 | 12 / |
| Raytracing | ✗ | ✗ |
| Max. affiche | 1 | 0 |
| Max. GPU Mémoire | 4 Go | |
| La technologie | 7 nm | 4 nm |
| Date de sortie | Q1/2019 | Q4/2023 |
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Wischen
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Qualcomm Snapdragon 855 Plus | MediaTek Dimensity 9300 |
|---|---|---|
| Matériel AI | Qualcomm AI engine | Mediatek APU |
| Spécifications de l'IA | Hexagon 690 @ 7 TOPS | MediaTek APU 790 @ 33 TOPS |
| NPU + CPU + iGPU |
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Wischen
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Qualcomm Snapdragon 855 Plus | MediaTek Dimensity 9300 |
|---|---|---|
| Mémoire | LPDDR4X-4266 (34.1 Go/s) | LPDDR5X-9600 (76.8 Go/s) |
| Max. Mémoire | 12 Go | 16 Go |
| Canaux de mémoire | 4 | 4 |
| ECC | Non | Non |
| PCIe | ||
| PCIe Bande passante |
|
Wischen
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Qualcomm Snapdragon 855 Plus | MediaTek Dimensity 9300 |
|---|---|---|
| TDP | 12.5 W | |
| TDP (PL2) | ||
| TDP up | ||
| TDP down | ||
| T. junction max. |
|
Wischen
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Qualcomm Snapdragon 855 Plus | MediaTek Dimensity 9300 |
|---|---|---|
| Conception de puce | Chiplet | Chiplet |
| AES-NI | ✗ | ✗ |
| Systèmes d'exploitation | Android | Android |
| Jeu d'instructions | Armv8-A (64 bit) | Armv9-A (64 bit) |
| Extensions ISA | ||
| Date de sortie | Q4/2018 | Q4/2023 |
| Prix de sortie | ||
| Documents | Fiche technique | Fiche technique |