VS
Intel Core i9-13900TE vs Qualcomm Snapdragon 855 Plus
Letzte Aktualisierung:
|
Wischen
|
Intel Core i9-13900TE | Qualcomm Snapdragon 855 Plus |
|---|---|---|
| Familie | Intel Core i9 (81) | Qualcomm Snapdragon (105) |
| CPU Gruppe | Intel Core i 13000 (18) | Qualcomm Snapdragon 855/860 (3) |
| Architektur | Raptor Lake S | Kryo 485 |
| Technologie | 10 nm | 7 nm |
| Segment | Desktop | Smartphone / Tablet |
| Sockel | LGA 1700 | |
| Vorgänger | Intel Core i9-12900TE | |
| Nachfolger | Qualcomm Snapdragon 860 |
|
Wischen
|
Intel Core i9-13900TE | Qualcomm Snapdragon 855 Plus |
|---|---|---|
| CPU Kerne / Threads | 24 / 32 | 8 / 8 |
| Hyperthreading / SMT | ✓ | ✗ |
| Kernarchitektur | hybrid (big.LITTLE) | hybrid (Prime / big.LITTLE) |
| Core Cluster 1: | 8x Raptor Cove 1,00 - 5,00 GHz |
1x Kryo 485 Prime 2,96 GHz |
| Core Cluster 2: | 16x Gracemont 0,80 - 3,90 GHz |
3x Kryo 485 Gold 2,42 GHz |
| Core Cluster 3: | 4x Kryo 485 Silver 1,80 GHz |
|
| L2-Cache | 32,00 MB | 2,00 MB |
| L3-Cache | 36,00 MB | 3,00 MB |
| Übertaktung | ✗ | ✗ |
|
Wischen
|
Intel Core i9-13900TE | Qualcomm Snapdragon 855 Plus |
|---|---|---|
| GPU Name | Intel UHD Graphics 770 | Qualcomm Adreno 640 |
| Grafik-Taktfrequenz | 0,30 - 1,65 GHz | 0,25 - 0,68 GHz |
| CUs / Shader | 32 / 256 | 4 / 384 |
| Raytracing | ✗ | ✗ |
| Max. Bildschirme | 3 | 1 |
| Max. GPU Speicher | 64 GB | 4 GB |
| Technologie | 10 nm | 7 nm |
| Erscheinungsdatum | Q4/2021 | Q1/2019 |
|
Wischen
|
Intel Core i9-13900TE | Qualcomm Snapdragon 855 Plus |
|---|---|---|
| KI-Hardware | Qualcomm AI engine | |
| KI-Spezifikationen | Hexagon 690 @ 7 TOPS | |
| NPU + CPU + iGPU |
|
Wischen
|
Intel Core i9-13900TE | Qualcomm Snapdragon 855 Plus |
|---|---|---|
| Arbeitsspeicher | DDR5-5600 (89,6 GB/s) DDR4-3200 (51,2 GB/s) | LPDDR4X-4266 (34,1 GB/s) |
| Max. Speicher | 192 GB | 12 GB |
| Speicherkanäle | 2 | 4 |
| ECC | Ja | Nein |
| PCIe | 5.0 x 20 | |
| PCIe Bandbreite | 78,8 GB/s |
|
Wischen
|
Intel Core i9-13900TE | Qualcomm Snapdragon 855 Plus |
|---|---|---|
| TDP | 35 W | |
| TDP (PL2) | ||
| TDP up | ||
| TDP down | ||
| T. junction max. | 100 °C |
|
Wischen
|
Intel Core i9-13900TE | Qualcomm Snapdragon 855 Plus |
|---|---|---|
| Chip-Design | Monolithisch | Chiplet |
| AES-NI | ✓ | ✗ |
| Betriebssysteme | Windows 10, Windows 11, Linux | Android |
| Befehlssatz | x86-64 (64 bit) | Armv8-A (64 bit) |
| ISA Erweiterungen | SSE4.1, SSE4.2, AVX2, AVX2+ | |
| Erscheinungsdatum | Q1/2023 | Q4/2018 |
| Erscheinungspreis | 554 $ | |
| Dokumente | Technisches Datenblatt | Technisches Datenblatt |