Name: | HiSilicon Kirin 820 5G |
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Family: | HiSilicon Kirin (29) |
CPU group: | HiSilicon Kirin 810/820 (3) |
Architecture: | Cortex-A76 / Cortex-A55 |
Technology: | 7 nm |
Segment: | Smartphone / Tablet |
Generation: | 6 |
Predecessor: | -- |
Successor: | -- |
CPU Cores / Threads: | 8 / 8 |
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Core architecture: | hybrid (big.LITTLE) |
A-Core: | 4x Cortex-A76 |
B-Core: | 4x Cortex-A55 |
Hyperthreading / SMT: | No |
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Overclocking: | No |
A-Core Frequency: | 2.36 GHz |
B-Core Frequency: | 1.84 GHz |
AI hardware: | HUAWEI HiAI 2.0 |
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AI specifications: | Da Vinci Architecture. Ascend D110 Lite |
NPU + CPU + iGPU: | -- |
GPU name: | ARM Mali-G57 MP6 |
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GPU frequency: | 0.85 GHz |
GPU (Turbo): | No turbo |
Compute units: | 6 |
Shader: | 96 |
Hardware Raytracing: | No |
Release date: | Q2/2020 |
Max. displays: | 2 |
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Generation: | Vallhall 1 |
Direct X: | 12 |
Technology: | 7 nm |
Max. GPU Memory: | 4 GB |
Frame Generation: | No |
h265 / HEVC (8 bit): | Decode / Encode |
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h265 / HEVC (10 bit): | Decode / Encode |
h264: | Decode / Encode |
VP8: | Decode / Encode |
VP9: | Decode / Encode |
AV1: | Decode |
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AVC: | Decode / Encode |
VC-1: | Decode / Encode |
JPEG: | Decode / Encode |
Memory & PCIeThe HiSilicon Kirin 820 5G supports up to memory in up to 4 (Quad Channel) memory channels. This results in a maximum memory bandwidth of --. |
|
Memory type: | Memory bandwidth: |
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LPDDR4X-2133 | -- |
Max. Memory: | |
Memory channels: | 4 (Quad Channel) |
ECC: | No |
PCIe: | |
PCIe Bandwidth: | -- |
Thermal ManagementWith the TDP, the processor manufacturer specifies the cooling solution required for the processor. The HiSilicon Kirin 820 5G has a TDP of 6 W. |
|
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TDP (PL1 / PBP): | 6 W |
TDP (PL2): | -- |
TDP up: | -- |
TDP down: | -- |
Tjunction max.: | -- |
Technology: | 7 nm |
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Chip design: | Chiplet |
Socket: | -- |
L2-Cache: | -- |
L3-Cache: | 2.00 MB |
AES-NI: | No |
Operating systems: | Android |
Virtualization: | None |
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Instruction set (ISA): | Armv8-A (64 bit) |
ISA extensions: | -- |
Release date: | Q2/2019 |
Release price: | -- |
Part Number: | -- |
Documents: | -- |
MediaTek Dimensity 820
8C 8T @ 2.60 GHz |
|||
Samsung Exynos 880
8C 8T @ 2.00 GHz |
|||
Qualcomm Snapdragon 750G
8C 8T @ 2.20 GHz |
|||
HiSilicon Kirin 820 5G
8C 8T @ 2.36 GHz |
|||
MediaTek Kompanio 828
8C 8T @ 2.60 GHz |
|||
MediaTek Dimensity 6080
8C 8T @ 2.40 GHz |
|||
UNISOC T770
8C 8T @ 2.50 GHz |
HiSilicon Kirin 985 5G
8C 8T @ 2.58 GHz |
|||
MediaTek Dimensity 820
8C 8T @ 2.60 GHz |
|||
MediaTek Dimensity 1000C
8C 8T @ 2.00 GHz |
|||
HiSilicon Kirin 820 5G
8C 8T @ 2.36 GHz |
|||
Apple A10X Fusion
6C 6T @ 2.36 GHz |
|||
MediaTek Dimensity 920
8C 8T @ 2.50 GHz |
|||
MediaTek Dimensity 1080
8C 8T @ 2.60 GHz |
Qualcomm Snapdragon 845
Qualcomm Adreno 630 @ 0.70 GHz |
|||
Google Tensor G2
ARM Mali-G710 MP7 @ 0.90 GHz |
|||
Apple A13 Bionic
Apple A13 @ 1.35 GHz |
|||
HiSilicon Kirin 820 5G
ARM Mali-G57 MP6 @ 0.85 GHz |
|||
HiSilicon Kirin 820E 5G
ARM Mali-G57 MP6 @ 0.85 GHz |
|||
HiSilicon Kirin 990E 5G
ARM Mali-G76 MP14 @ 0.60 GHz |
|||
MediaTek Dimensity 1000L
ARM Mali-G77 MP7 @ 0.70 GHz |
HiSilicon Kirin 985 5G
8C 8T @ 2.58 GHz |
|||
MediaTek Kompanio 820
8C 8T @ 2.20 GHz |
|||
Samsung Exynos 9820
8C 8T @ 2.70 GHz |
|||
HiSilicon Kirin 820 5G
8C 8T @ 2.36 GHz |
|||
Apple A10X Fusion
6C 6T @ 2.36 GHz |
|||
Qualcomm Snapdragon 845
8C 8T @ 2.80 GHz |
|||
Qualcomm Snapdragon 768G
8C 8T @ 2.80 GHz |