HiSilicon Kirin 820 5G

HiSilicon Kirin 820 5G
Benchmarks & Specs

Last updated:
The HiSilicon Kirin 820 5G is a notable mobile processor. It significantly shaped its era in the smartphone segment. It was manufactured using the advanced 7nm process. This gave it good energy efficiency and solid performance. A truly outstanding feature was certainly the integrated 5G modem.

This offered fast connectivity even back then. You could surf the mobile web smoothly and enjoy streaming. Inside this chip works a well-thought-out combination. Here are powerful Cortex-A76 cores and energy-efficient Cortex-A55 cores. This architecture provided very balanced performance in everyday use.

The integrated graphics unit, the ARM Mali-G57 MP6, rounds off the entire package. It delivered respectable graphics performance. For many common apps and mobile games, this was more than sufficient. This chip was a very solid choice for many devices of its time. It offered a reliable basis for a wide variety of applications.

We saw it as a very robust companion. Its design was aimed at a broad user base and fully met these expectations.
  • Integrated 5G Modem
  • Efficient 7nm Manufacturing Process
  • Balanced Cortex-A76 and A55 Core Architecture
  • Powerful ARM Mali-G57 MP6 Graphics

Performance Overview
Average performance across multiple benchmarks

Single-core performance
Rank ? / ?
In segment Smartphone / Tablet
Multi-core performance
Rank ? / ?
In segment Smartphone / Tablet
Geekbench 5, 64bit Single-Core

Geekbench 5, 64bit Single-Core
Single-core performance

Samsung Exynos 880
8C / 8T · 2.00 GHz
645
Qualcomm Snapdragon 750G
8C / 8T · 2.20 GHz
644
HiSilicon Kirin 820 5G
8C / 8T · 2.36 GHz
641
MediaTek Kompanio 828
8C / 8T · 2.60 GHz
625
MediaTek Dimensity 6080
8C / 8T · 2.40 GHz
624
Geekbench 5, 64bit Multi-Core

Geekbench 5, 64bit Multi-Core
Multi-core performance

MediaTek Dimensity 820
8C / 8T · 2.60 GHz
2,432
MediaTek Dimensity 1000C
8C / 8T · 2.00 GHz
2,431
HiSilicon Kirin 820 5G
8C / 8T · 2.36 GHz
2,429
Apple A10X Fusion
6C / 6T · 2.36 GHz
2,295
MediaTek Dimensity 920
8C / 8T · 2.50 GHz
2,277
iGPU - FP32 Performance (Single-precision GFLOPS)

iGPU - FP32 Performance (Single-precision GFLOPS)

Google Tensor G2
ARM Mali-G710 MP7
700
Apple A13 Bionic
Apple A13
691
HiSilicon Kirin 820 5G
ARM Mali-G57 MP6
653
HiSilicon Kirin 820E 5G
ARM Mali-G57 MP6
653
HiSilicon Kirin 990E 5G
ARM Mali-G76 MP14
645
AnTuTu 8 Benchmark

AnTuTu 8 Benchmark

MediaTek Kompanio 820
8C / 8T · 2.20 GHz
403,759 pts
Samsung Exynos 9820
8C / 8T · 2.70 GHz
394,976 pts
HiSilicon Kirin 820 5G
8C / 8T · 2.36 GHz
384,634 pts
Apple A10X Fusion
6C / 6T · 2.36 GHz
377,455 pts
Qualcomm Snapdragon 845
8C / 8T · 2.80 GHz
361,498 pts

More benchmarks

At a glance

PropertyValue
FamilyHiSilicon Kirin (29)
CPU groupHiSilicon Kirin 810/820 (3)
ArchitectureCortex-A76 / Cortex-A55
Technology7 nm
SegmentSmartphone / Tablet
Socket
Generation6
Predecessor
Successor

CPU Cores and Base Frequency

PropertyValue
CPU Cores / Threads8 / 8
Hyperthreading / SMT
Core architecturehybrid (big.LITTLE)
Core Cluster 1: 4x Cortex-A76
2.36 GHz
Core Cluster 2: 4x Cortex-A55
1.84 GHz
L2-Cache
L3-Cache2.00 MB
OverclockingNo

Integrated graphics (iGPU)

PropertyValue
GPU nameARM Mali-G57 MP6
GPU frequency0.85 GHz
CUs / Shader6 / 96
Raytracing
Max. displays2
Max. GPU Memory4 GB
Technology7 nm
Release dateQ2/2020

NPU AI performance

PropertyValue
AI hardwareHUAWEI HiAI 2.0
AI specificationsDa Vinci Architecture. Ascend D110 Lite
NPU + CPU + iGPU

Memory & PCIe

Memory typeMemory bandwidth
LPDDR4X-2133
--
PropertyValue
Max. Memory
Memory channels4
ECC
PCIe
PCIe Bandwidth

Thermal Management

PropertyValue
TDP6 W
TDP (PL2)
TDP up
TDP down
T. junction max.

Technical details

PropertyValue
Chip designChiplet
AES-NI
Operating systemsAndroid
Instruction setArmv8-A (64 bit)
ISA extensions
Release dateQ2/2019
Release price
Documents
HiSilicon Kirin 820 5G
HiSilicon Kirin 820 5G
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