HiSilicon Kirin 990E 5G Benchmark, Test and specs

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The HiSilicon Kirin 990E 5G has 8 cores with 8 threads and is based on the 8. gen of the HiSilicon Kirin series. The processor was released in Q3/2019. The HiSilicon Kirin 990E 5G scores 757 points in the Geekbench 5 single-core benchmark. In the Geekbench 5 multi-core benchmark, the result is 2,855 points.
HiSilicon Kirin 990E 5G

At a glance

Name: HiSilicon Kirin 990E 5G
Family: HiSilicon Kirin (29)
CPU group: HiSilicon Kirin 990 (3)
Architecture: Cortex-A76 / Cortex-A55
Technology: 7 nm
Segment: Smartphone / Tablet
Generation: 8
Predecessor: --
Successor: --

CPU Cores and Base Frequency

The HiSilicon Kirin 990E 5G has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the HiSilicon Kirin 990E 5G is 2.86 GHz. The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.

CPU Cores / Threads: 8 / 8
Core architecture: hybrid (Prime / big.LITTLE)
A-Core: 2x Cortex-A76
B-Core: 2x Cortex-A76
C-Core: 4x Cortex-A55
Hyperthreading / SMT: No
Overclocking: No
A-Core Frequency: 2.86 GHz
B-Core Frequency: 2.36 GHz
C-Core Frequency: 1.95 GHz

NPU AI performance

The performance values of the processor's AI unit. The isolated NPU performance is specified here, the total AI performance (NPU+CPU+iGPU) can be higher. Processors with support for artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors.

AI hardware: HUAWEI HiAI 2.0
AI specifications: Da Vinci Architecture. 1x Ascend Lite + 1x Ascend Tiny
NPU + CPU + iGPU: --

Integrated graphics (iGPU)

The HiSilicon Kirin 990E 5G has integrated graphics, called iGPU for short. Specifically, the HiSilicon Kirin 990E 5G uses the ARM Mali-G76 MP14, which has 224 texture shaders and 14 execution units. The iGPU uses the system's main memory as graphics memory and sits on the processor's die.

GPU name: ARM Mali-G76 MP14
GPU frequency: 0.60 GHz
GPU (Turbo): 0.60 GHz
Compute units: 14
Shader: 224
Hardware Raytracing: No
Release date: Q3/2018
Max. displays: 2
Generation: Bifrost 3
Direct X: 12
Technology: 7 nm
Max. GPU Memory: 4 GB
Frame Generation: No

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.

h265 / HEVC (8 bit): Decode / Encode
h265 / HEVC (10 bit): Decode / Encode
h264: Decode / Encode
VP8: Decode / Encode
VP9: Decode / Encode
AV1: No
AVC: Decode / Encode
VC-1: Decode / Encode
JPEG: Decode / Encode

Memory & PCIe

The processor can use up to 8 GB memory in 4 (Quad Channel) memory channels. The maximum memory bandwidth is --. The memory type as well as the amount of memory can greatly affect the speed of the system.

Memory type: Memory bandwidth:
LPDDR4X-4266
--
Max. Memory: 8 GB
Memory channels: 4 (Quad Channel)
ECC: No
PCIe:
PCIe Bandwidth: --

Thermal Management

The thermal design power (TDP for short) of the processor is 6 W. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. The TDP usually gives a rough idea of the actual power consumption of the CPU.

TDP (PL1 / PBP): 6 W
TDP (PL2): --
TDP up: --
TDP down: --
Tjunction max.: --

Technical details

The HiSilicon Kirin 990E 5G is made in 7 nm. The smaller the manufacturing process of a CPU, the more modern and energy-efficient it is. Overall, the processor has 2.00 MB cache. A large cache can greatly speed up the processor's speed in some cases such as games.

Technology: 7 nm
Chip design: Chiplet
Socket: --
L2-Cache: --
L3-Cache: 2.00 MB
AES-NI: No
Operating systems: Android
Virtualization: None
Instruction set (ISA): Armv8-A (64 bit)
ISA extensions: --
Release date: Q3/2019
Release price: --
Part Number: --
Documents: --

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Benchmark results

Verified Benchmark results
The benchmark results for the HiSilicon Kirin 990E 5G have been carefully checked by us. We only publish benchmark results that have been created by us or that have been submitted by a visitor and then checked by a team member. All results are based on and fullfill our benchmark guidelines.


Geekbench 6 Single-Core

Geekbench 6 is a partial load benchmark for modern computers, notebooks and smartphones. In the single-core test, only the fastest CPU core is measured. The test run simulates the performance in practice.
Qualcomm Snapdragon 780G Qualcomm Snapdragon 780G
8C 8T @ 2.40 GHz
1027
Qualcomm Snapdragon 778G+ Qualcomm Snapdragon 778G+
8C 8T @ 2.50 GHz
1025
Qualcomm Snapdragon 7c+ Gen 3 Qualcomm Snapdragon 7c+ Gen 3
8C 8T @ 2.40 GHz
1025
HiSilicon Kirin 990E 5G HiSilicon Kirin 990E 5G
8C 8T @ 2.86 GHz
996
HiSilicon Kirin 990 4G HiSilicon Kirin 990 4G
8C 8T @ 2.86 GHz
996
HiSilicon Kirin 990 5G HiSilicon Kirin 990 5G
8C 8T @ 2.86 GHz
996
Qualcomm Snapdragon 855 Plus Qualcomm Snapdragon 855 Plus
8C 8T @ 2.96 GHz
994

Geekbench 6 Multi-Core

The practical Geekbench 6 multi-core benchmark tests the system's performance under partial load. The processor's maximum power consumption is far from being used up.
MediaTek Dimensity 8200 MediaTek Dimensity 8200
8C 8T @ 3.10 GHz
3369
Google Tensor G2 Google Tensor G2
8C 8T @ 2.85 GHz
3342
Samsung Exynos 2100 Samsung Exynos 2100
8C 8T @ 2.90 GHz
3339
HiSilicon Kirin 990E 5G HiSilicon Kirin 990E 5G
8C 8T @ 2.86 GHz
3244
Qualcomm Snapdragon 865 Qualcomm Snapdragon 865
8C 8T @ 2.84 GHz
3244
HiSilicon Kirin 990 4G HiSilicon Kirin 990 4G
8C 8T @ 2.86 GHz
3244
HiSilicon Kirin 990 5G HiSilicon Kirin 990 5G
8C 8T @ 2.86 GHz
3244

Geekbench 5, 64bit Single-Core

Geekbench 5 is a cross plattform benchmark that heavily uses the systems memory. A fast memory will push the result a lot. The single-core test only uses one CPU core, the amount of cores or hyperthreading ability doesn't count.
MediaTek Dimensity 920 MediaTek Dimensity 920
8C 8T @ 2.50 GHz
768
Samsung Exynos 1330 Samsung Exynos 1330
8C 8T @ 2.40 GHz
768
Qualcomm Snapdragon 8cx Gen. 2 Qualcomm Snapdragon 8cx Gen. 2
8C 8T @ 3.15 GHz
760
HiSilicon Kirin 990E 5G HiSilicon Kirin 990E 5G
8C 8T @ 2.86 GHz
757
HiSilicon Kirin 990 4G HiSilicon Kirin 990 4G
8C 8T @ 2.86 GHz
757
HiSilicon Kirin 990 5G HiSilicon Kirin 990 5G
8C 8T @ 2.86 GHz
757
MediaTek Dimensity 1050 MediaTek Dimensity 1050
8C 8T @ 2.50 GHz
747

Geekbench 5, 64bit Multi-Core

Geekbench 5 is a cross plattform benchmark that heavily uses the systems memory. A fast memory will push the result a lot. The multi-core test involves all CPU cores and taks a big advantage of hyperthreading.
Qualcomm Snapdragon 7s Gen 2 Qualcomm Snapdragon 7s Gen 2
8C 8T @ 0.70 GHz
2874
MediaTek Dimensity 8050 MediaTek Dimensity 8050
8C 8T @ 3.00 GHz
2861
Qualcomm Snapdragon 778G+ Qualcomm Snapdragon 778G+
8C 8T @ 2.50 GHz
2856
HiSilicon Kirin 990E 5G HiSilicon Kirin 990E 5G
8C 8T @ 2.86 GHz
2855
Qualcomm Snapdragon 8cx Gen. 2 Qualcomm Snapdragon 8cx Gen. 2
8C 8T @ 3.15 GHz
2855
HiSilicon Kirin 990 4G HiSilicon Kirin 990 4G
8C 8T @ 2.86 GHz
2855
HiSilicon Kirin 990 5G HiSilicon Kirin 990 5G
8C 8T @ 2.86 GHz
2855

iGPU - FP32 Performance (Single-precision GFLOPS)

The theoretical computing performance of the internal graphics unit of the processor with simple accuracy (32 bit) in GFLOPS. GFLOPS indicates how many billion floating point operations the iGPU can perform per second.
Apple A13 Bionic Apple A13 Bionic
Apple A13 @ 1.35 GHz
691
HiSilicon Kirin 820 5G HiSilicon Kirin 820 5G
ARM Mali-G57 MP6 @ 0.85 GHz
653
HiSilicon Kirin 820E 5G HiSilicon Kirin 820E 5G
ARM Mali-G57 MP6 @ 0.85 GHz
653
HiSilicon Kirin 990E 5G HiSilicon Kirin 990E 5G
ARM Mali-G76 MP14 @ 0.60 GHz
645
MediaTek Dimensity 1000L MediaTek Dimensity 1000L
ARM Mali-G77 MP7 @ 0.70 GHz
622
Qualcomm Snapdragon 768G Qualcomm Snapdragon 768G
Qualcomm Adreno 620 @ 0.80 GHz
620
Samsung Exynos 8895 Samsung Exynos 8895
ARM Mali-G71 MP20 @ 0.90 GHz
612

Benchmarks





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