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HiSilicon Kirin 990E 5G
Benchmarks & Specs
Last updated:
HiSilicon Kirin 990E 5G
Summary
The HiSilicon Kirin 990E 5G was a mobile processor manufactured using an advanced 7-nanometer process at the time. This ensured high energy efficiency and solid performance in many mobile devices. It's evident that this design still offers advantages today. It also supported good battery life.
Its internal architecture relied on a combination of powerful Cortex-A76 and efficient Cortex-A55 cores. This blend allowed for balanced usage in everyday situations. This applied equally to multitasking and other applications. Visual tasks and demanding games were handled by the integrated ARM Mali-G76 MP14 graphics unit.
It delivered considerable graphics performance for mobile applications of its time. This was highly valued by many users. A key feature of this chip was the direct integration of 5G connectivity. This provided users with early access to the then-latest and fastest mobile networks. The Kirin 990E 5G thus laid an important foundation.
It contributed to future-proof and well-equipped mobile devices.
Its internal architecture relied on a combination of powerful Cortex-A76 and efficient Cortex-A55 cores. This blend allowed for balanced usage in everyday situations. This applied equally to multitasking and other applications. Visual tasks and demanding games were handled by the integrated ARM Mali-G76 MP14 graphics unit.
It delivered considerable graphics performance for mobile applications of its time. This was highly valued by many users. A key feature of this chip was the direct integration of 5G connectivity. This provided users with early access to the then-latest and fastest mobile networks. The Kirin 990E 5G thus laid an important foundation.
It contributed to future-proof and well-equipped mobile devices.
- 7-nanometer manufacturing
- Integrated 5G connectivity
- Powerful ARM Mali-G76 MP14 graphics
- Efficient Cortex-A76/A55 architecture
Benchmarks
Performance Overview
Average performance across multiple benchmarks
Single-core performance
Multi-core performance
Geekbench 6 Single-Core
Single-core performance
8C / 8T · 2.50 GHz
8C / 8T · 2.40 GHz
HiSilicon Kirin 990E 5G
100 %
8C / 8T · 2.86 GHz
8C / 8T · 2.96 GHz
Samsung Exynos 1380
99 %
8C / 8T · 2.40 GHz
Geekbench 6 Multi-Core
Multi-core performance
Google Tensor G2
103 %
8C / 8T · 2.85 GHz
Samsung Exynos 2100
103 %
8C / 8T · 2.90 GHz
HiSilicon Kirin 990E 5G
100 %
8C / 8T · 2.86 GHz
8C / 8T · 3.00 GHz
8C / 8T · 3.00 GHz
Geekbench 5, 64bit Single-Core
Single-core performance
MediaTek Dimensity 920
101 %
8C / 8T · 2.50 GHz
8C / 8T · 3.15 GHz
HiSilicon Kirin 990E 5G
100 %
8C / 8T · 2.86 GHz
8C / 8T · 2.50 GHz
Samsung Exynos 9820
98 %
8C / 8T · 2.70 GHz
Geekbench 5, 64bit Multi-Core
Multi-core performance
MediaTek Dimensity 8050
100 %
8C / 8T · 3.00 GHz
8C / 8T · 2.50 GHz
HiSilicon Kirin 990E 5G
100 %
8C / 8T · 2.86 GHz
MediaTek Dimensity 1100
100 %
8C / 8T · 2.60 GHz
Qualcomm Snapdragon 778G
100 %
8C / 8T · 2.40 GHz
iGPU - FP32 Performance (Single-precision GFLOPS)
HiSilicon Kirin 820 5G
101 %
ARM Mali-G57 MP6
HiSilicon Kirin 820E 5G
101 %
ARM Mali-G57 MP6
HiSilicon Kirin 990E 5G
100 %
ARM Mali-G76 MP14
ARM Mali-G77 MP7
Qualcomm Adreno 620
More benchmarks
Specifications
At a glance
| Property | Value |
|---|---|
| Family | HiSilicon Kirin (29) |
| CPU group | HiSilicon Kirin 990 (3) |
| Architecture | Cortex-A76 / Cortex-A55 |
| Technology | 7 nm |
| Segment | Smartphone / Tablet |
| Socket | |
| Generation | 8 |
| Predecessor | |
| Successor |
CPU Cores and Base Frequency
| Property | Value |
|---|---|
| CPU Cores / Threads | 8 / 8 |
| Hyperthreading / SMT | ✗ |
| Core architecture | hybrid (Prime / big.LITTLE) |
| Core Cluster 1: | 2x Cortex-A76 2.86 GHz |
| Core Cluster 2: | 2x Cortex-A76 2.36 GHz |
| Core Cluster 3: | 4x Cortex-A55 1.95 GHz |
| L2-Cache | |
| L3-Cache | 2.00 MB |
| Overclocking | No |
Integrated graphics (iGPU)
| Property | Value |
|---|---|
| GPU name | ARM Mali-G76 MP14 |
| GPU frequency | 0.60 - 0.60 GHz |
| CUs / Shader | 14 / 224 |
| Raytracing | ✗ |
| Max. displays | 2 |
| Max. GPU Memory | 4 GB |
| Technology | 7 nm |
| Release date | Q3/2018 |
NPU AI performance
| Property | Value |
|---|---|
| AI hardware | HUAWEI HiAI 2.0 |
| AI specifications | Da Vinci Architecture. 1x Ascend Lite + 1x Ascend Tiny |
| NPU + CPU + iGPU |
Memory & PCIe
| Memory type | Memory bandwidth |
|---|---|
| LPDDR4X-4266 | -- |
| Property | Value |
| Max. Memory | 8 GB |
| Memory channels | 4 |
| ECC | ✗ |
| PCIe | |
| PCIe Bandwidth |
Thermal Management
| Property | Value |
|---|---|
| TDP | 6 W |
| TDP (PL2) | |
| TDP up | |
| TDP down | |
| T. junction max. |
Technical details
| Property | Value |
|---|---|
| Chip design | Chiplet |
| AES-NI | ✗ |
| Operating systems | Android |
| Instruction set | Armv8-A (64 bit) |
| ISA extensions | |
| Release date | Q3/2019 |
| Release price | |
| Documents |
User Reviews
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