HiSilicon Kirin 820 5G | Qualcomm Snapdragon 778G | |
CPU comparisonHiSilicon Kirin 820 5G or Qualcomm Snapdragon 778G - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The HiSilicon Kirin 820 5G has 8 cores with 8 threads and clocks with a maximum frequency of 2.36 GHz. Up to GB of memory is supported in 4 memory channels. The HiSilicon Kirin 820 5G was released in Q2/2019. The Qualcomm Snapdragon 778G has 8 cores with 8 threads and clocks with a maximum frequency of 2.40 GHz. The CPU supports up to 16 GB of memory in 2 memory channels. The Qualcomm Snapdragon 778G was released in Q2/2021. |
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HiSilicon Kirin (29) | Family | Qualcomm Snapdragon (102) |
HiSilicon Kirin 810/820 (3) | CPU group | Qualcomm Snapdragon 778 (2) |
6 | Generation | 4 |
Cortex-A76 / Cortex-A55 | Architecture | Kryo 670 |
Mobile | Segment | Mobile |
-- | Predecessor | -- |
-- | Successor | -- |
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CPU Cores and Base FrequencyThe HiSilicon Kirin 820 5G is a 8 core processor with a clock frequency of 2.36 GHz. The Qualcomm Snapdragon 778G has 8 CPU cores with a clock frequency of 2.40 GHz. |
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HiSilicon Kirin 820 5G | Characteristic | Qualcomm Snapdragon 778G |
8 | Cores | 8 |
8 | Threads | 8 |
hybrid (big.LITTLE) | Core architecture | hybrid (Prime / big.LITTLE) |
No | Hyperthreading | No |
No | Overclocking ? | No |
2.36 GHz 4x Cortex-A76 |
A-Core | 2.40 GHz 1x Kryo 670 Prime |
1.84 GHz 4x Cortex-A55 |
B-Core | 2.20 GHz 3x Kryo 670 Gold |
-- | C-Core | 1.90 GHz 4x Kryo 670 Silver |
Artificial Intelligence and Machine LearningProcessors with the support of artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. Algorithms for ML improve their performance the more data they have collected via software. ML tasks can be processed up to 10,000 times faster than with a classic processor. |
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HiSilicon Kirin 820 5G | Characteristic | Qualcomm Snapdragon 778G |
HUAWEI HiAI 2.0 | AI hardware | Qualcomm AI engine |
Da Vinci Architecture. Ascend D110 Lite | AI specifications | Hexagon 770 @ 12 TOPS |
Internal GraphicsThe integrated graphics unit of a processor is not only responsible for the pure image output on the system, but can also significantly increase the efficiency of the system with the support of modern video codecs. |
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ARM Mali-G57 MP6 | GPU | Qualcomm Adreno 642L |
0.85 GHz | GPU frequency | -- |
-- | GPU (Turbo) | -- |
Vallhall 1 | GPU Generation | 5 |
7 nm | Technology | 6 nm |
2 | Max. displays | 1 |
6 | Compute units | 4 |
96 | Shader | 384 |
No | Hardware Raytracing | No |
No | Frame Generation | No |
4 GB | Max. GPU Memory | 4 GB |
12 | DirectX Version | 12.0 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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ARM Mali-G57 MP6 | GPU | Qualcomm Adreno 642L |
Decode / Encode | Codec h265 / HEVC (8 bit) | Decode |
Decode / Encode | Codec h265 / HEVC (10 bit) | Decode |
Decode / Encode | Codec h264 | Decode / Encode |
Decode / Encode | Codec VP9 | Decode |
Decode / Encode | Codec VP8 | Decode |
Decode | Codec AV1 | No |
Decode / Encode | Codec AVC | Decode |
Decode / Encode | Codec VC-1 | Decode |
Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeThe HiSilicon Kirin 820 5G supports a maximum of GB of memory in 4 memory channels. The Qualcomm Snapdragon 778G can connect up to 16 GB of memory in 2 memory channels. |
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HiSilicon Kirin 820 5G | Characteristic | Qualcomm Snapdragon 778G |
LPDDR4X-2133 | Memory | LPDDR5-6400 |
Max. Memory | 16 GB | |
4 (Quad Channel) | Memory channels | 2 (Dual Channel) |
-- | Max. Bandwidth | 51.2 GB/s |
No | ECC | No |
-- | L2 Cache | -- |
2.00 MB | L3 Cache | 2.00 MB |
-- | PCIe version | -- |
-- | PCIe lanes | -- |
-- | PCIe Bandwidth | -- |
Thermal ManagementThe TDP (Thermal Design Power) of a processor specifies the required cooling solution. The HiSilicon Kirin 820 5G has a TDP of 6 W, that of the Qualcomm Snapdragon 778G is --. |
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HiSilicon Kirin 820 5G | Characteristic | Qualcomm Snapdragon 778G |
6 W | TDP (PL1 / PBP) | -- |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe HiSilicon Kirin 820 5G has a 2.00 MB cache, while the Qualcomm Snapdragon 778G cache has a total of 2.00 MB. |
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HiSilicon Kirin 820 5G | Characteristic | Qualcomm Snapdragon 778G |
7 nm | Technology | 6 nm |
Chiplet | Chip design | Chiplet |
Armv8-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
-- | ISA extensions | -- |
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android | Operating systems | Android |
Q2/2019 | Release date | Q2/2021 |
-- | Release price | -- |
show more data | show more data | |
HiSilicon Kirin 820 5G
8C 8T @ 2.36 GHz |
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Qualcomm Snapdragon 778G
8C 8T @ 2.40 GHz |
HiSilicon Kirin 820 5G
8C 8T @ 2.36 GHz |
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Qualcomm Snapdragon 778G
8C 8T @ 2.40 GHz |
HiSilicon Kirin 820 5G
8C 8T @ 2.36 GHz |
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Qualcomm Snapdragon 778G
8C 8T @ 2.40 GHz |
HiSilicon Kirin 820 5G
8C 8T @ 2.36 GHz |
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Qualcomm Snapdragon 778G
8C 8T @ 2.40 GHz |
HiSilicon Kirin 820 5G
8C 8T @ 2.36 GHz |
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Qualcomm Snapdragon 778G
8C 8T @ 2.40 GHz |
HiSilicon Kirin 820 5G
ARM Mali-G57 MP6 @ 0.85 GHz |
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Qualcomm Snapdragon 778G
Qualcomm Adreno 642L @ 0.00 GHz |
HiSilicon Kirin 820 5G
8C 8T @ 2.36 GHz |
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Qualcomm Snapdragon 778G
8C 8T @ 2.40 GHz |
HiSilicon Kirin 820 5G
8C 8T @ 2.36 GHz |
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Qualcomm Snapdragon 778G
8C 8T @ 2.40 GHz |
HiSilicon Kirin 820 5G
8C 8T @ 2.36 GHz |
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Qualcomm Snapdragon 778G
8C 8T @ 2.40 GHz |
Devices using this processor |
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HiSilicon Kirin 820 5G | Qualcomm Snapdragon 778G |
Huawei Honor 30S Huawei P40 Lite 5G |
Samsung Galaxy A73 5G Xiaomi Civi S1 Oppo Reno7 5G |