HiSilicon Kirin 960S vs AMD Ryzen Embedded R1102G
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CPU comparison with benchmarks
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| HiSilicon Kirin 960S | AMD Ryzen Embedded R1102G | |
CPU comparisonHiSilicon Kirin 960S or AMD Ryzen Embedded R1102G - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The HiSilicon Kirin 960S has 8 cores with 8 threads and clocks with a maximum frequency of 2.11 GHz. Up to 6 GB of memory is supported in 2 memory channels. The HiSilicon Kirin 960S was released in Q4/2016. The AMD Ryzen Embedded R1102G has 2 cores with 2 threads and clocks with a maximum frequency of 2.60 GHz. The CPU supports up to 32 GB of memory in 2 memory channels. The AMD Ryzen Embedded R1102G was released in Q1/2020. |
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| HiSilicon Kirin (29) | Family | AMD Ryzen Embedded R (9) |
| HiSilicon Kirin 960 (2) | CPU group | AMD Ryzen Embedded R1000 (5) |
| 5 | Generation | 1 |
| Cortex-A73 / Cortex-A53 | Architecture | Banded Kestrel (Zen) |
| Mobile | Segment | Desktop / Server |
| -- | Predecessor | -- |
| -- | Successor | -- |
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CPU Cores and Base FrequencyThe HiSilicon Kirin 960S has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the HiSilicon Kirin 960S is 2.11 GHz while the AMD Ryzen Embedded R1102G has 2 CPU cores and 2 threads can calculate simultaneously. The clock frequency of the AMD Ryzen Embedded R1102G is at 1.20 GHz (2.60 GHz). |
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| HiSilicon Kirin 960S | Characteristic | AMD Ryzen Embedded R1102G |
| 8 | Cores | 2 |
| 8 | Threads | 2 |
| hybrid (big.LITTLE) | Core architecture | normal |
| No | Hyperthreading | No |
| No | Overclocking ? | No |
| 2.11 GHz 4x Cortex-A73 |
A-Core | 1.20 GHz (2.60 GHz) |
| 1.84 GHz 4x Cortex-A53 |
B-Core | -- |
Internal GraphicsThe HiSilicon Kirin 960S or AMD Ryzen Embedded R1102G has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
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| ARM Mali-G71 MP8 | GPU | AMD Radeon RX Vega 3 (Raven Ridge) |
| 0.90 GHz | GPU frequency | 1.00 GHz |
| -- | GPU (Turbo) | -- |
| Bifrost 1 | GPU Generation | 8 |
| 16 nm | Technology | 14 nm |
| 2 | Max. displays | 3 |
| 8 | Compute units | 3 |
| 256 | Shader | 192 |
| No | Hardware Raytracing | No |
| No | Frame Generation | No |
| 2 GB | Max. GPU Memory | 2 GB |
| 11 | DirectX Version | 12 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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| ARM Mali-G71 MP8 | GPU | AMD Radeon RX Vega 3 (Raven Ridge) |
| Decode / Encode | Codec h265 / HEVC (8 bit) | Decode / Encode |
| Decode | Codec h265 / HEVC (10 bit) | Decode / Encode |
| Decode / Encode | Codec h264 | Decode / Encode |
| No | Codec VP9 | Decode / Encode |
| Decode / Encode | Codec VP8 | Decode / Encode |
| No | Codec AV1 | No |
| Decode / Encode | Codec AVC | Decode / Encode |
| No | Codec VC-1 | Decode |
| Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeThe HiSilicon Kirin 960S can use up to 6 GB of memory in 2 memory channels. The maximum memory bandwidth is 12.8 GB/s. The AMD Ryzen Embedded R1102G supports up to 32 GB of memory in 2 memory channels and achieves a memory bandwidth of up to 38.4 GB/s. |
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| HiSilicon Kirin 960S | Characteristic | AMD Ryzen Embedded R1102G |
| LPDDR4-1600 | Memory | DDR4-2400 |
| 6 GB | Max. Memory | 32 GB |
| 2 (Dual Channel) | Memory channels | 2 (Dual Channel) |
| 12.8 GB/s | Max. Bandwidth | 38.4 GB/s |
| No | ECC | Yes |
| -- | L2 Cache | -- |
| 4.00 MB | L3 Cache | 4.00 MB |
| -- | PCIe version | 3.0 |
| -- | PCIe lanes | 8 |
| -- | PCIe Bandwidth | 7.9 GB/s |
Thermal ManagementThe thermal design power (TDP for short) of the HiSilicon Kirin 960S is 5 W, while the AMD Ryzen Embedded R1102G has a TDP of 6 W. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. |
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| HiSilicon Kirin 960S | Characteristic | AMD Ryzen Embedded R1102G |
| 5 W | TDP (PL1 / PBP) | 6 W |
| -- | TDP (PL2) | -- |
| -- | TDP up | -- |
| -- | TDP down | -- |
| -- | Tjunction max. | 105 °C |
Technical detailsThe HiSilicon Kirin 960S is manufactured in 16 nm and has 4.00 MB cache. The AMD Ryzen Embedded R1102G is manufactured in 14 nm and has a 4.00 MB cache. |
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| HiSilicon Kirin 960S | Characteristic | AMD Ryzen Embedded R1102G |
| 16 nm | Technology | 14 nm |
| Chiplet | Chip design | Chiplet |
| Armv8-A (64 bit) | Instruction set (ISA) | x86-64 (64 bit) |
| -- | ISA extensions | SSE4a, SSE4.1, SSE4.2, AVX2, FMA3 |
| -- | Socket | FP5 |
| None | Virtualization | AMD-V, SVM |
| No | AES-NI | Yes |
| Android | Operating systems | Windows 10, Linux |
| Q4/2016 | Release date | Q1/2020 |
| -- | Release price | -- |
| show more data | show more data | |
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iGPU - FP32 Performance (Single-precision GFLOPS)
The theoretical computing performance of the internal graphics unit of the processor with simple accuracy (32 bit) in GFLOPS. GFLOPS indicates how many billion floating point operations the iGPU can perform per second.
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HiSilicon Kirin 960S
ARM Mali-G71 MP8 @ 0.90 GHz |
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AMD Ryzen Embedded R1102G
AMD Radeon RX Vega 3 (Raven Ridge) @ 1.00 GHz |
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Devices using this processor |
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| HiSilicon Kirin 960S | AMD Ryzen Embedded R1102G |
| Unknown | Unknown |
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