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HiSilicon Kirin 960S
Benchmarks & Specs
Last updated:
HiSilicon Kirin 960S
Summary
The HiSilicon Kirin 960S was once a remarkable mobile processor from HiSilicon. It relied on an intelligent mix of Cortex-A73 and Cortex-A53 cores. This Big.LITTLE architecture enabled a balanced blend of high processing power and considerable energy efficiency. This chip was manufactured using the 16-nanometer process, which was advanced at the time.
An integrated ARM Mali-G71 MP8 unit was responsible for the graphics performance. This allowed the HiSilicon Kirin 960S to offer solid capabilities for everyday applications and mobile gaming. A 4 MB L3 cache also supported fast data processing. The maximum memory bandwidth was 13 GB/s. Even today, this processor can provide surprisingly decent performance for basic tasks.
We were pleasantly surprised by the versatility of the HiSilicon Kirin 960S back then. It remains an example of HiSilicon's engineering prowess in the mobile world.
An integrated ARM Mali-G71 MP8 unit was responsible for the graphics performance. This allowed the HiSilicon Kirin 960S to offer solid capabilities for everyday applications and mobile gaming. A 4 MB L3 cache also supported fast data processing. The maximum memory bandwidth was 13 GB/s. Even today, this processor can provide surprisingly decent performance for basic tasks.
We were pleasantly surprised by the versatility of the HiSilicon Kirin 960S back then. It remains an example of HiSilicon's engineering prowess in the mobile world.
- Efficient Big.LITTLE architecture
- Integrated ARM Mali-G71 MP8 Graphics
- 4 MB L3 Cache
- Good energy efficiency
Benchmarks
Performance Overview
Average performance across multiple benchmarks
Single-core performance
Multi-core performance
iGPU - FP32 Performance (Single-precision GFLOPS)
MediaTek Dimensity 930
102 %
PowerVR IMG AXM-8-256
Apple A9
102 %
Apple A9
HiSilicon Kirin 960S
100 %
ARM Mali-G71 MP8
ARM Mali-G57 MP2
ARM Mali-G57 MP2
More benchmarks
Specifications
At a glance
| Property | Value |
|---|---|
| Family | HiSilicon Kirin (29) |
| CPU group | HiSilicon Kirin 960 (2) |
| Architecture | Cortex-A73 / Cortex-A53 |
| Technology | 16 nm |
| Segment | Smartphone / Tablet |
| Socket | |
| Generation | 5 |
| Predecessor | |
| Successor |
CPU Cores and Base Frequency
| Property | Value |
|---|---|
| CPU Cores / Threads | 8 / 8 |
| Hyperthreading / SMT | ✗ |
| Core architecture | hybrid (big.LITTLE) |
| Core Cluster 1: | 4x Cortex-A73 2.11 GHz |
| Core Cluster 2: | 4x Cortex-A53 1.84 GHz |
| L2-Cache | |
| L3-Cache | 4.00 MB |
| Overclocking | No |
Integrated graphics (iGPU)
| Property | Value |
|---|---|
| GPU name | ARM Mali-G71 MP8 |
| GPU frequency | 0.90 GHz |
| CUs / Shader | 8 / 256 |
| Raytracing | ✗ |
| Max. displays | 2 |
| Max. GPU Memory | 2 GB |
| Technology | 16 nm |
| Release date | Q2/2016 |
Memory & PCIe
| Memory type | Memory bandwidth |
|---|---|
| LPDDR4-1600 | 12.8 GB/s |
| Property | Value |
| Max. Memory | 6 GB |
| Memory channels | 2 |
| ECC | ✗ |
| PCIe | |
| PCIe Bandwidth |
Thermal Management
| Property | Value |
|---|---|
| TDP | 5 W |
| TDP (PL2) | |
| TDP up | |
| TDP down | |
| T. junction max. |
Technical details
| Property | Value |
|---|---|
| Chip design | Chiplet |
| AES-NI | ✗ |
| Operating systems | Android |
| Instruction set | Armv8-A (64 bit) |
| ISA extensions | |
| Release date | Q4/2016 |
| Release price | |
| Documents |
User Reviews
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