Name: | Intel Core Ultra 7 255H |
---|---|
Family: | Intel Core Ultra 7 (24) |
CPU group: | Intel Core Ultra 200H (5) |
Architecture: | Arrow Lake H |
Technology: | 3 nm |
Segment: | Notebook |
Generation: | 2 |
Predecessor: | Intel Core Ultra 7 155H |
Successor: | -- |
CPU Cores / Threads: | 16 / 16 |
---|---|
Core architecture: | hybrid (big.LITTLE) |
A-Core: | 6x Lion Cove |
B-Core: | 8x Skymont |
C-Core: | 2x Crestmont |
Hyperthreading / SMT: | No |
---|---|
Overclocking: | No |
A-Core Frequency: | 2.00 GHz (5.10 GHz) |
B-Core Frequency: | 1.50 GHz (4.40 GHz) |
C-Core Frequency: | 0.70 GHz (2.50 GHz) |
AI hardware: | Intel® AI Boost |
---|---|
AI specifications: | Intel AI Boost (OpenVINO, WindowsML, DirectML, ONNX RT) |
NPU + CPU + iGPU: | 96 TOPS |
GPU name: | Intel Arc 140T |
---|---|
GPU frequency: | 0.60 GHz |
GPU (Turbo): | 2.25 GHz |
Compute units: | 64 |
Shader: | 1024 |
Hardware Raytracing: | Yes |
Release date: | Q1/2025 |
Max. displays: | 3 |
---|---|
Generation: | -- |
Direct X: | 12.2 |
Technology: | 5 nm |
Max. GPU Memory: | 32 GB |
Frame Generation: | Intel XeSS |
h265 / HEVC (8 bit): | Decode / Encode |
---|---|
h265 / HEVC (10 bit): | Decode / Encode |
h264: | Decode / Encode |
VP8: | Decode |
VP9: | Decode |
AV1: | Decode / Encode |
---|---|
AVC: | Decode / Encode |
VC-1: | Decode |
JPEG: | Decode / Encode |
Memory & PCIeThe Intel Core Ultra 7 255H supports a maximum of 128 GB memory. Depending on the mainboard, the processor can use a maximum of 2 (Dual Channel) memory channels. This results in a maximum bandwidth of the main memory of 134.4 GB/s. |
|
Memory type: | Memory bandwidth: |
---|---|
LPDDR5X-8400 DDR5-6400 | 134.4 GB/s 102.4 GB/s |
Max. Memory: | 128 GB |
Memory channels: | 2 (Dual Channel) |
ECC: | No |
PCIe: | 5.0 x 28 |
PCIe Bandwidth: | 110.3 GB/s |
Thermal ManagementThe Intel Core Ultra 7 255H has a TDP of 28 W. Based on the TDP, the system manufacturer can and must adapt the cooling solution to the processor. |
|
---|---|
TDP (PL1 / PBP): | 28 W |
TDP (PL2): | 115 W |
TDP up: | -- |
TDP down: | 20 W |
Tjunction max.: | 110 °C |
Technology: | 3 nm |
---|---|
Chip design: | Chiplet |
Socket: | BGA 2049 |
L2-Cache: | 6.00 MB |
L3-Cache: | 24.00 MB |
AES-NI: | Yes |
Operating systems: | Windows 11, Linux |
Virtualization: | VT-x, VT-x EPT, VT-d |
---|---|
Instruction set (ISA): | x86-64 (64 bit) |
ISA extensions: | SSE4.1, SSE4.2, AVX2 |
Release date: | Q1/2025 |
Release price: | -- |
Part Number: | -- |
Documents: | Technical data sheet |
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