HiSilicon Kirin 9000E

HiSilicon Kirin 9000E
Benchmarks & Specs

Last updated:
The HiSilicon Kirin 9000E presents itself as a robust mobile processor. Its production using the advanced 5nm process enabled remarkable energy efficiency. For its development time, it also offered truly convincing performance. The chip's architecture is based on a clever combination of cores.

You'll find both powerful Cortex-A77 cores and efficient Cortex-A55 cores. This configuration ensured a very balanced user experience in everyday life. It provided the necessary computing power for demanding applications. At the same time, energy consumption was always kept within limits.

Another significant feature was the integrated graphics unit. The ARM Mali-G78 MP22 GPU was among the best of its kind at the time. It enabled smooth playback of high-resolution media content. Even graphically demanding games ran very well with it. Even now, the HiSilicon Kirin 9000E handles many everyday tasks without any problems.

It is still capable of smoothly handling streaming and social media. For users who value lasting reliability, it remains a viable choice.
  • 5nm manufacturing process for high energy efficiency
  • Balanced architecture with Cortex-A77 and Cortex-A55 cores
  • High-performance ARM Mali-G78 MP22 graphics unit

Performance Overview
Average performance across multiple benchmarks

Single-core performance
Rank ? / ?
In segment Smartphone / Tablet
Multi-core performance
Rank ? / ?
In segment Smartphone / Tablet
Geekbench 5, 64bit Single-Core

Geekbench 5, 64bit Single-Core
Single-core performance

Qualcomm Snapdragon 888
8C / 8T · 2.84 GHz
1,088
Google Tensor G2
8C / 8T · 2.85 GHz
1,068
HiSilicon Kirin 9000E
8C / 8T · 3.13 GHz
1,063
Samsung Exynos 1580
8C / 8T · 2.91 GHz
1,046
Google Tensor
8C / 8T · 2.80 GHz
1,043
Geekbench 5, 64bit Multi-Core

Geekbench 5, 64bit Multi-Core
Multi-core performance

Qualcomm Snapdragon 7+ Gen 2
8C / 8T · 2.91 GHz
4,029
Qualcomm Snapdragon 8+ Gen 1
8C / 8T · 3.20 GHz
3,924
HiSilicon Kirin 9000E
8C / 8T · 3.13 GHz
3,767
MediaTek Dimensity 8100
8C / 8T · 2.85 GHz
3,765
Qualcomm Snapdragon 8 Gen 1
8C / 8T · 3.00 GHz
3,722
iGPU - FP32 Performance (Single-precision GFLOPS)

iGPU - FP32 Performance (Single-precision GFLOPS)

Apple A18
Apple A18 101 %
Apple A18 (5 GPU Cores)
2,150
Apple A17 Pro
Apple A17 Pro (6 GPU Cores)
2,147
HiSilicon Kirin 9000E
ARM Mali-G78 MP22
2,137
Qualcomm Snapdragon 8 Elite for Galaxy
Qualcomm Adreno 830
1,950
Google Tensor
ARM Mali-G78 MP20
1,943
AnTuTu 8 Benchmark

AnTuTu 8 Benchmark

MediaTek Dimensity 1300
8C / 8T · 3.00 GHz
647,817 pts
MediaTek Dimensity 1100
8C / 8T · 2.60 GHz
634,870 pts
HiSilicon Kirin 9000E
8C / 8T · 3.13 GHz
632,768 pts
Apple A14 Bionic
6C / 6T · 3.00 GHz
628,047 pts
MediaTek Dimensity 1200
8C / 8T · 3.00 GHz
627,817 pts

More benchmarks

At a glance

PropertyValue
FamilyHiSilicon Kirin (29)
CPU groupHiSilicon Kirin 9000 (2)
ArchitectureCortex-A77 / Cortex-A55
Technology5 nm
SegmentSmartphone / Tablet
Socket
Generation9
Predecessor
Successor

CPU Cores and Base Frequency

PropertyValue
CPU Cores / Threads8 / 8
Hyperthreading / SMT
Core architecturehybrid (Prime / big.LITTLE)
Core Cluster 1: 1x Cortex-A77
3.13 GHz
Core Cluster 2: 3x Cortex-A77
2.54 GHz
Core Cluster 3: 4x Cortex-A55
2.05 GHz
L2-Cache
L3-Cache
OverclockingNo

Integrated graphics (iGPU)

PropertyValue
GPU nameARM Mali-G78 MP22
GPU frequency0.76 GHz
CUs / Shader22 / 352
Raytracing
Max. displays1
Max. GPU Memory
Technology5 nm
Release dateQ4/2020

Memory & PCIe

Memory typeMemory bandwidth
LPDDR5-2750
LPDDR4X-2133
--
--
PropertyValue
Max. Memory
Memory channels4
ECC
PCIe
PCIe Bandwidth

Thermal Management

PropertyValue
TDP
TDP (PL2)
TDP up
TDP down
T. junction max.

Technical details

PropertyValue
Chip designChiplet
AES-NI
Operating systemsAndroid
Instruction setArmv8-A (64 bit)
ISA extensions
Release dateQ4/2020
Release price
Documents
HiSilicon Kirin 9000E
HiSilicon Kirin 9000E
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