Name: | HiSilicon Kirin 9000E |
---|---|
Family: | HiSilicon Kirin (29) |
CPU group: | HiSilicon Kirin 9000 (2) |
Architecture: | Cortex-A77 / Cortex-A55 |
Technology: | 5 nm |
Segment: | Smartphone / Tablet |
Generation: | 9 |
Predecessor: | -- |
Successor: | -- |
CPU Cores / Threads: | 8 / 8 |
---|---|
Core architecture: | hybrid (Prime / big.LITTLE) |
A-Core: | 1x Cortex-A77 |
B-Core: | 3x Cortex-A77 |
C-Core: | 4x Cortex-A55 |
Hyperthreading / SMT: | No |
---|---|
Overclocking: | No |
A-Core Frequency: | 3.13 GHz |
B-Core Frequency: | 2.54 GHz |
C-Core Frequency: | 2.05 GHz |
GPU name: | ARM Mali-G78 MP22 |
---|---|
GPU frequency: | 0.76 GHz |
GPU (Turbo): | No turbo |
Compute units: | 22 |
Shader: | 352 |
Hardware Raytracing: | No |
Release date: | Q4/2020 |
Max. displays: | 1 |
---|---|
Generation: | Vallhall 2 |
Direct X: | 12 |
Technology: | 5 nm |
Max. GPU Memory: | -- |
Frame Generation: | No |
h265 / HEVC (8 bit): | Decode / Encode |
---|---|
h265 / HEVC (10 bit): | Decode / Encode |
h264: | Decode / Encode |
VP8: | Decode / Encode |
VP9: | Decode / Encode |
AV1: | Decode |
---|---|
AVC: | Decode / Encode |
VC-1: | Decode / Encode |
JPEG: | Decode / Encode |
Memory & PCIeThe processor can use up to memory in 4 (Quad Channel) memory channels. The maximum memory bandwidth is --. The memory type as well as the amount of memory can greatly affect the speed of the system. |
|
Memory type: | Memory bandwidth: |
---|---|
LPDDR5-2750 LPDDR4X-2133 | -- -- |
Max. Memory: | |
Memory channels: | 4 (Quad Channel) |
ECC: | No |
PCIe: | |
PCIe Bandwidth: | -- |
Thermal ManagementThe thermal design power (TDP for short) of the processor is . The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. The TDP usually gives a rough idea of the actual power consumption of the CPU. |
|
---|---|
TDP (PL1 / PBP): | |
TDP (PL2): | -- |
TDP up: | -- |
TDP down: | -- |
Tjunction max.: | -- |
Technology: | 5 nm |
---|---|
Chip design: | Chiplet |
Socket: | -- |
L2-Cache: | -- |
L3-Cache: | -- |
AES-NI: | No |
Operating systems: | Android |
Virtualization: | None |
---|---|
Instruction set (ISA): | Armv8-A (64 bit) |
ISA extensions: | -- |
Release date: | Q4/2020 |
Release price: | -- |
Part Number: | -- |
Documents: | -- |
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Qualcomm Snapdragon 8cx Gen 3
8C 8T @ 3.00 GHz |
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Qualcomm Snapdragon 888
8C 8T @ 2.84 GHz |
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Google Tensor G2
8C 8T @ 2.85 GHz |
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HiSilicon Kirin 9000E
8C 8T @ 3.13 GHz |
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HiSilicon Kirin 9000
8C 8T @ 3.13 GHz |
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Samsung Exynos 1580
8C 8T @ 2.91 GHzNot verified |
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Google Tensor
8C 8T @ 2.80 GHz |
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MediaTek Dimensity 9200
8C 8T @ 3.05 GHz |
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Qualcomm Snapdragon 7+ Gen 2
8C 8T @ 2.91 GHz |
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Qualcomm Snapdragon 8+ Gen 1
8C 8T @ 3.20 GHz |
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HiSilicon Kirin 9000E
8C 8T @ 3.13 GHz |
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HiSilicon Kirin 9000
8C 8T @ 3.13 GHz |
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MediaTek Dimensity 8100
8C 8T @ 2.85 GHz |
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Qualcomm Snapdragon 8 Gen 1
8C 8T @ 3.00 GHz |
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Qualcomm Snapdragon 8 Gen 3
Qualcomm Adreno 750 @ 0.90 GHz |
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Apple A18
Apple A18 (5 GPU Cores) @ 1.68 GHz |
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Apple A17 Pro
Apple A17 Pro (6 GPU Cores) @ 1.40 GHz |
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HiSilicon Kirin 9000E
ARM Mali-G78 MP22 @ 0.76 GHz |
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Qualcomm Snapdragon 8 Elite for Galaxy
Qualcomm Adreno 830 @ 1.20 GHz |
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Google Tensor
ARM Mali-G78 MP20 @ 0.76 GHz |
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Qualcomm Snapdragon 8cx
Qualcomm Adreno 680 @ 0.59 GHz |
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Qualcomm Snapdragon 870
8C 8T @ 3.20 GHz |
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MediaTek Dimensity 1300
8C 8T @ 3.00 GHz |
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MediaTek Dimensity 1100
8C 8T @ 2.60 GHz |
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HiSilicon Kirin 9000E
8C 8T @ 3.13 GHz |
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Apple A14 Bionic
6C 6T @ 3.00 GHz |
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MediaTek Dimensity 1200
8C 8T @ 3.00 GHz |
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Qualcomm Snapdragon 865+
8C 8T @ 3.10 GHz |