Qualcomm Snapdragon 7c+ Gen 3 | MediaTek Dimensity 8200 | |
CPU comparisonIn this CPU comparison, we compare the Qualcomm Snapdragon 7c+ Gen 3 and the MediaTek Dimensity 8200 and use benchmarks to check which processor is faster.
We compare the Qualcomm Snapdragon 7c+ Gen 3 8 core processor released in Q1/2022 with the MediaTek Dimensity 8200 which has 8 CPU cores and was introduced in Q4/2022. |
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Qualcomm Snapdragon (103) | Family | Mediatek Dimensity (36) |
Qualcomm Snapdragon 7c Plus (1) | CPU group | MediaTek Dimensity 8000 4nm (1) |
3 | Generation | 3 |
Cortex-A78 / Cortex-A55 | Architecture | Cortex-A78 / -A78 / -A55 |
Mobile | Segment | Mobile |
Qualcomm Snapdragon 7c Gen 2 | Predecessor | -- |
-- | Successor | -- |
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CPU Cores and Base FrequencyThe Qualcomm Snapdragon 7c+ Gen 3 is a 8 core processor with a clock frequency of 2.40 GHz. The processor can compute 8 threads at the same time. The MediaTek Dimensity 8200 clocks with 3.10 GHz, has 8 CPU cores and can calculate 8 threads in parallel. |
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Qualcomm Snapdragon 7c+ Gen 3 | Characteristic | MediaTek Dimensity 8200 |
8 | Cores | 8 |
8 | Threads | 8 |
hybrid (big.LITTLE) | Core architecture | hybrid (big.LITTLE) |
No | Hyperthreading | No |
No | Overclocking ? | No |
2.40 GHz 4x Cortex-A78 |
A-Core | 3.10 GHz 1x Cortex-A78 |
1.50 GHz 4x Cortex-A55 |
B-Core | 3.00 GHz 3x Cortex-A78 |
-- | C-Core | 2.00 GHz 4x Cortex-A55 |
Integrated graphics (iGPU)Graphics (iGPU) integrated into the processor not only enable image output without having to rely on a dedicated graphics solution, but can also efficiently accelerate video playback. |
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Qualcomm Adreno 642L | GPU | ARM Mali-G610 MP6 |
0.70 GHz | GPU frequency | -- |
-- | GPU (Turbo) | -- |
5 | GPU Generation | Vallhall 3 |
6 nm | Technology | 4 nm |
1 | Max. displays | 1 |
4 | Compute units | 6 |
384 | Shader | -- |
No | Hardware Raytracing | No |
No | Frame Generation | No |
4 GB | Max. GPU Memory | -- |
12.0 | DirectX Version | 12 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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Qualcomm Adreno 642L | GPU | ARM Mali-G610 MP6 |
Decode | Codec h265 / HEVC (8 bit) | Decode / Encode |
Decode | Codec h265 / HEVC (10 bit) | Decode / Encode |
Decode / Encode | Codec h264 | Decode / Encode |
Decode | Codec VP9 | Decode / Encode |
Decode | Codec VP8 | Decode / Encode |
No | Codec AV1 | Decode |
Decode | Codec AVC | Decode / Encode |
Decode | Codec VC-1 | Decode / Encode |
Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeUp to 16 GB of memory in a maximum of 2 memory channels is supported by the Qualcomm Snapdragon 7c+ Gen 3, while the MediaTek Dimensity 8200 supports a maximum of GB of memory with a maximum memory bandwidth of 51.2 GB/s enabled. |
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Qualcomm Snapdragon 7c+ Gen 3 | Characteristic | MediaTek Dimensity 8200 |
LPDDR5-6400, LPDDR4X-4266 | Memory | LPDDR5-6400 |
16 GB | Max. Memory | |
2 (Dual Channel) | Memory channels | 4 (Quad Channel) |
51.2 GB/s | Max. Bandwidth | 51.2 GB/s |
No | ECC | No |
-- | L2 Cache | -- |
-- | L3 Cache | -- |
-- | PCIe version | -- |
-- | PCIe lanes | -- |
-- | PCIe Bandwidth | -- |
Thermal ManagementThe Qualcomm Snapdragon 7c+ Gen 3 has a TDP of --. The TDP of the MediaTek Dimensity 8200 is --. System integrators use the TDP of the processor as a guide when dimensioning the cooling solution. |
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Qualcomm Snapdragon 7c+ Gen 3 | Characteristic | MediaTek Dimensity 8200 |
-- | TDP (PL1 / PBP) | -- |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe Qualcomm Snapdragon 7c+ Gen 3 has 0.00 MB cache and is manufactured in 6 nm. The cache of MediaTek Dimensity 8200 is at 0.00 MB. The processor is manufactured in 4 nm. |
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Qualcomm Snapdragon 7c+ Gen 3 | Characteristic | MediaTek Dimensity 8200 |
6 nm | Technology | 4 nm |
Chiplet | Chip design | Chiplet |
Armv8-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
-- | ISA extensions | -- |
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android | Operating systems | Android |
Q1/2022 | Release date | Q4/2022 |
-- | Release price | -- |
show more data | show more data | |
Qualcomm Snapdragon 7c+ Gen 3
8C 8T @ 2.40 GHz |
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MediaTek Dimensity 8200
8C 8T @ 3.10 GHz |
Qualcomm Snapdragon 7c+ Gen 3
8C 8T @ 2.40 GHz |
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MediaTek Dimensity 8200
8C 8T @ 3.10 GHz |
Qualcomm Snapdragon 7c+ Gen 3
8C 8T @ 2.40 GHz |
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MediaTek Dimensity 8200
8C 8T @ 3.10 GHz |
Qualcomm Snapdragon 7c+ Gen 3
8C 8T @ 2.40 GHz |
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MediaTek Dimensity 8200
8C 8T @ 3.10 GHz |
Devices using this processor |
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Qualcomm Snapdragon 7c+ Gen 3 | MediaTek Dimensity 8200 |
Unknown | Unknown |