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MediaTek Dimensity 8200
Benchmarks & Specs
Last updated:
MediaTek Dimensity 8200
Summary
The MediaTek Dimensity 8200 remains a remarkable choice for mobile devices. This processor, manufactured using the advanced 4 nm process, offers impressive energy efficiency. This is particularly important for long battery life in everyday use. Its architecture utilizes powerful Cortex-A78 and efficient Cortex-A55 cores.
This combination ensures a very balanced and responsive performance. We see that it effortlessly handles many applications. Whether multitasking or more demanding tasks, the MediaTek Dimensity 8200 shows its strengths. The integrated ARM Mali-G610 MP6 graphics unit supports smooth display. It enables a pleasant gaming experience and smooth multimedia playback.
With 51 GB/s maximum memory bandwidth, data is processed quickly. This contributes to overall system performance. The MediaTek Dimensity 8200 is therefore a solid foundation. It impresses with its balanced combination of processing power and efficiency.
This combination ensures a very balanced and responsive performance. We see that it effortlessly handles many applications. Whether multitasking or more demanding tasks, the MediaTek Dimensity 8200 shows its strengths. The integrated ARM Mali-G610 MP6 graphics unit supports smooth display. It enables a pleasant gaming experience and smooth multimedia playback.
With 51 GB/s maximum memory bandwidth, data is processed quickly. This contributes to overall system performance. The MediaTek Dimensity 8200 is therefore a solid foundation. It impresses with its balanced combination of processing power and efficiency.
- Efficient 4 nm manufacturing process
- Balanced Cortex-A78 / A55 architecture
- Powerful ARM Mali-G610 MP6 graphics unit
- High energy efficiency and smooth system performance
Benchmarks
Performance Overview
Average performance across multiple benchmarks
Single-core performance
Multi-core performance
Geekbench 6 Single-Core
Single-core performance
Qualcomm Snapdragon 888
102 %
8C / 8T · 2.84 GHz
Samsung Exynos 1480
101 %
8C / 8T · 2.75 GHz
MediaTek Dimensity 8200
100 %
8C / 8T · 3.10 GHz
Samsung Exynos 990
99 %
8C / 8T · 2.73 GHz
8C / 8T · 3.00 GHz
Geekbench 6 Multi-Core
Multi-core performance
Qualcomm Snapdragon 888+
102 %
8C / 8T · 3.00 GHz
MediaTek Kompanio 1300T
101 %
8C / 8T · 2.60 GHz
MediaTek Dimensity 8200
100 %
8C / 8T · 3.10 GHz
Google Tensor G2
99 %
8C / 8T · 2.85 GHz
Samsung Exynos 2100
99 %
8C / 8T · 2.90 GHz
Geekbench 5, 64bit Single-Core
Single-core performance
Samsung Exynos 2100
102 %
8C / 8T · 2.90 GHz
Qualcomm Snapdragon 870
101 %
8C / 8T · 3.20 GHz
MediaTek Dimensity 8200
100 %
8C / 8T · 3.10 GHz
Qualcomm Snapdragon 865+
100 %
8C / 8T · 3.10 GHz
8C / 8T · 2.85 GHz
Geekbench 5, 64bit Multi-Core
Multi-core performance
MediaTek Dimensity 8100
102 %
8C / 8T · 2.85 GHz
8C / 8T · 3.00 GHz
MediaTek Dimensity 8200
100 %
8C / 8T · 3.10 GHz
Samsung Exynos 1580
99 %
8C / 8T · 0.70 GHz
Google Tensor G3
98 %
8C / 8T · 2.91 GHz
More benchmarks
Specifications
At a glance
| Property | Value |
|---|---|
| Family | Mediatek Dimensity (38) |
| CPU group | MediaTek Dimensity 8000 4nm (1) |
| Architecture | Cortex-A78 / -A78 / -A55 |
| Technology | 4 nm |
| Segment | Smartphone / Tablet |
| Socket | |
| Generation | 3 |
| Predecessor | |
| Successor |
CPU Cores and Base Frequency
| Property | Value |
|---|---|
| CPU Cores / Threads | 8 / 8 |
| Hyperthreading / SMT | ✗ |
| Core architecture | hybrid (big.LITTLE) |
| Core Cluster 1: | 1x Cortex-A78 3.10 GHz |
| Core Cluster 2: | 3x Cortex-A78 3.00 GHz |
| Core Cluster 3: | 4x Cortex-A55 2.00 GHz |
| L2-Cache | |
| L3-Cache | |
| Overclocking | No |
Integrated graphics (iGPU)
| Property | Value |
|---|---|
| GPU name | ARM Mali-G610 MP6 |
| GPU frequency | |
| CUs / Shader | 6 / |
| Raytracing | ✗ |
| Max. displays | 1 |
| Max. GPU Memory | |
| Technology | 4 nm |
| Release date | Q2/2021 |
Memory & PCIe
| Memory type | Memory bandwidth |
|---|---|
| LPDDR5-6400 | 51.2 GB/s |
| Property | Value |
| Max. Memory | |
| Memory channels | 4 |
| ECC | ✗ |
| PCIe | |
| PCIe Bandwidth |
Thermal Management
| Property | Value |
|---|---|
| TDP | |
| TDP (PL2) | |
| TDP up | |
| TDP down | |
| T. junction max. |
Technical details
| Property | Value |
|---|---|
| Chip design | Chiplet |
| AES-NI | ✗ |
| Operating systems | Android |
| Instruction set | Armv8-A (64 bit) |
| ISA extensions | |
| Release date | Q4/2022 |
| Release price | |
| Documents | Technical data sheet |
User Reviews
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