Name: | Qualcomm Snapdragon 7 Gen 3 |
---|---|
Family: | Qualcomm Snapdragon (105) |
CPU group: | Qualcomm Snapdragon 7 Gen 3 (1) |
Architecture: | Kryo Prime, Gold, Silver |
Technology: | 4 nm |
Segment: | Smartphone / Tablet |
Generation: | 3 |
Predecessor: | -- |
Successor: | -- |
CPU Cores / Threads: | 8 / 8 |
---|---|
Core architecture: | hybrid (Prime / big.LITTLE) |
A-Core: | 1x Cortex-A715 |
B-Core: | 3x Cortex-A715 |
C-Core: | 4x Cortex-A510 |
Hyperthreading / SMT: | No |
---|---|
Overclocking: | No |
A-Core Frequency: | 2.63 GHz |
B-Core Frequency: | 2.40 GHz |
C-Core Frequency: | 1.80 GHz |
AI hardware: | Qualcomm AI engine |
---|---|
AI specifications: | Hexagon |
NPU + CPU + iGPU: | -- |
GPU name: | Qualcomm Adreno 720 |
---|---|
GPU frequency: | 0.44 GHz |
GPU (Turbo): | 0.44 GHz |
Compute units: | -- |
Shader: | -- |
Hardware Raytracing: | No |
Release date: | Q4/2023 |
Max. displays: | 0 |
---|---|
Generation: | -- |
Direct X: | 12.1 |
Technology: | 4 nm |
Max. GPU Memory: | -- |
Frame Generation: | No |
h265 / HEVC (8 bit): | Decode / Encode |
---|---|
h265 / HEVC (10 bit): | Decode / Encode |
h264: | Decode / Encode |
VP8: | Decode / Encode |
VP9: | Decode / Encode |
AV1: | No |
---|---|
AVC: | Decode |
VC-1: | Decode |
JPEG: | Decode / Encode |
Memory & PCIeThe processor can use up to 12 GB memory in 2 (Dual Channel) memory channels. The maximum memory bandwidth is 25.6 GB/s. The memory type as well as the amount of memory can greatly affect the speed of the system. |
|
Memory type: | Memory bandwidth: |
---|---|
LPDDR4X-4266 LPDDR5-6400 | 17.1 GB/s 25.6 GB/s |
Max. Memory: | 12 GB |
Memory channels: | 2 (Dual Channel) |
ECC: | No |
PCIe: | |
PCIe Bandwidth: | -- |
Thermal ManagementThe thermal design power (TDP for short) of the processor is . The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. The TDP usually gives a rough idea of the actual power consumption of the CPU. |
|
---|---|
TDP (PL1 / PBP): | |
TDP (PL2): | -- |
TDP up: | -- |
TDP down: | -- |
Tjunction max.: | -- |
Technology: | 4 nm |
---|---|
Chip design: | Chiplet |
Socket: | -- |
L2-Cache: | -- |
L3-Cache: | -- |
AES-NI: | No |
Operating systems: | Android, Windows 10/11 (ARM) |
Virtualization: | None |
---|---|
Instruction set (ISA): | Armv9-A (64 bit) |
ISA extensions: | -- |
Release date: | Q4/2023 |
Release price: | -- |
Part Number: | SM7550-AB |
Documents: | Technical data sheet |
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MediaTek Dimensity 8200
8C 8T @ 3.10 GHz |
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Samsung Exynos 990
8C 8T @ 2.73 GHz |
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MediaTek Dimensity 1300
8C 8T @ 3.00 GHz |
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Qualcomm Snapdragon 7 Gen 3
8C 8T @ 2.63 GHz |
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MediaTek Dimensity 8020
8C 8T @ 2.60 GHz |
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Qualcomm Snapdragon 870
8C 8T @ 3.20 GHz |
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MediaTek Dimensity 8100
8C 8T @ 2.85 GHz |
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MediaTek Dimensity 1100
8C 8T @ 2.60 GHz |
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MediaTek Dimensity 1000+
8C 8T @ 2.60 GHz |
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Qualcomm Snapdragon 870
8C 8T @ 3.20 GHz |
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Qualcomm Snapdragon 7 Gen 3
8C 8T @ 2.63 GHz |
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Qualcomm Snapdragon 7s Gen 2
8C 8T @ 0.70 GHz |
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Qualcomm Snapdragon 778G
8C 8T @ 2.40 GHz |
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MediaTek Dimensity 1000L
8C 8T @ 2.20 GHz |
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Samsung Exynos 2200
8C 8T @ 2.80 GHz |
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Google Tensor G3
8C 8T @ 2.91 GHz |
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Apple A15 Bionic (4-GPU)
6C 6T @ 3.23 GHz |
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Qualcomm Snapdragon 7 Gen 3
8C 8T @ 2.63 GHz |
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Samsung Exynos 1480
8C 8T @ 2.75 GHz |
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Qualcomm QCM6490
8C 8T @ 2.71 GHz |
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Samsung Exynos 1380
8C 8T @ 2.40 GHz |