Qualcomm QCM6490

Qualcomm QCM6490
Benchmarks & Specs

Last updated:
The Qualcomm QCM6490 is a versatile processor particularly well-suited for demanding embedded applications. It is designed to provide a reliable and efficient foundation. Based on the Kryo 670 architecture, this chip demonstrates a remarkable balance between performance and energy efficiency. This makes it a solid choice for devices that are permanently in use.

A key feature is its manufacturing in the 6nm process. This modern technology contributes significantly to the high energy efficiency of the Qualcomm QCM6490. Thus, the processor can operate reliably even in fanless systems. The integrated graphics, the Qualcomm Adreno 643L, also impresses with its ability to handle demanding visual tasks.

We have found that it is more than sufficient for many IoT applications. Overall, the Qualcomm QCM6490 offers a robust platform for various industrial and commercial solutions that require balanced computing power.
  • Kryo 670 Architecture
  • Efficient 6nm Manufacturing
  • Integrated Qualcomm Adreno 643L Graphics

Performance Overview
Average performance across multiple benchmarks

Single-core performance
Rank 52 / 176
In segment Smartphone / Tablet
Multi-core performance
Rank 62 / 177
In segment Smartphone / Tablet
Geekbench 6 Single-Core

Geekbench 6 Single-Core
Single-core performance

MediaTek Dimensity 7200
8C / 8T · 2.80 GHz
1,120
MediaTek Dimensity 1200
8C / 8T · 3.00 GHz
1,114
Qualcomm QCM6490
8C / 8T · 2.71 GHz
1,097
Apple A11 Bionic
6C / 6T · 2.39 GHz
1,093
MediaTek Kompanio 1300T
8C / 8T · 2.60 GHz
1,053
Geekbench 6 Multi-Core

Geekbench 6 Multi-Core
Multi-core performance

HiSilicon Kirin 980
8C / 8T · 2.60 GHz
2,778
Samsung Exynos 1380
8C / 8T · 2.40 GHz
2,778
Qualcomm QCM6490
8C / 8T · 2.71 GHz
2,745
MediaTek Dimensity 1000C
8C / 8T · 2.00 GHz
2,736
Qualcomm Snapdragon 778G+
8C / 8T · 2.50 GHz
2,727
Geekbench 5, 64bit Single-Core

Geekbench 5, 64bit Single-Core
Single-core performance

MediaTek Dimensity 1300
8C / 8T · 3.00 GHz
878
MediaTek Dimensity 8050
8C / 8T · 3.00 GHz
871
Qualcomm QCM6490
8C / 8T · 2.71 GHz
869
MediaTek Dimensity 1200
8C / 8T · 3.00 GHz
868
MediaTek Dimensity 8000
8C / 8T · 2.75 GHz
845
Geekbench 5, 64bit Multi-Core

Geekbench 5, 64bit Multi-Core
Multi-core performance

MediaTek Dimensity 930
8C / 8T · 2.20 GHz
2,756
Apple A12 Bionic
6C / 6T · 2.49 GHz
2,731
Qualcomm QCM6490
8C / 8T · 2.71 GHz
2,705
Qualcomm Snapdragon 860
8C / 8T · 2.96 GHz
2,698
Qualcomm Snapdragon 855 Plus
8C / 8T · 2.96 GHz
2,632
iGPU - FP32 Performance (Single-precision GFLOPS)

iGPU - FP32 Performance (Single-precision GFLOPS)

Samsung Exynos 2100
ARM Mali-G78 MP14
1,360
Qualcomm Snapdragon 865
Qualcomm Adreno 650
1,250
Qualcomm QCM6490
Qualcomm Adreno 643L
1,247
Apple A12Z Bionic
Apple A12Z
1,152
Samsung Exynos 990
ARM Mali-G77 MP11
1,126
AnTuTu 10 Benchmark

AnTuTu 10 Benchmark
Multi-core performance

Qualcomm Snapdragon 7 Gen 3
8C / 8T · 2.63 GHz
769,286
Samsung Exynos 1480
8C / 8T · 2.75 GHz
742,548
Qualcomm QCM6490
8C / 8T · 2.71 GHz
673,946
Samsung Exynos 1380
8C / 8T · 2.40 GHz
601,969
Qualcomm Snapdragon 778G
8C / 8T · 2.40 GHz
596,849

More benchmarks

At a glance

PropertyValue
FamilyQualcomm Snapdragon (105)
CPU groupQualcomm QCM6490 (1)
ArchitectureKryo 670
Technology6 nm
SegmentSmartphone / Tablet
Socket
Generation9
Predecessor
Successor

CPU Cores and Base Frequency

PropertyValue
CPU Cores / Threads8 / 8
Hyperthreading / SMT
Core architecturehybrid (Prime / big.LITTLE)
Core Cluster 1: 1x Cortex-A78
2.71 GHz
Core Cluster 2: 3x Cortex-A78
2.40 GHz
L2-Cache
L3-Cache
OverclockingNo

Integrated graphics (iGPU)

PropertyValue
GPU nameQualcomm Adreno 643L
GPU frequency0.81 - 0.81 GHz
CUs / Shader / 768
Raytracing
Max. displays1
Max. GPU Memory
Technology6 nm
Release dateQ4/2022

NPU AI performance

PropertyValue
AI hardwareQualcomm AI engine
AI specifications
NPU + CPU + iGPU

Memory & PCIe

Memory typeMemory bandwidth
LPDDR5-6400
LPDDR4X-4266
44.0 GB/s
34.1 GB/s
PropertyValue
Max. Memory
Memory channels2
ECC
PCIe
PCIe Bandwidth

Thermal Management

PropertyValue
TDP
TDP (PL2)
TDP up
TDP down
T. junction max.

Technical details

PropertyValue
Chip designChiplet
AES-NI
Operating systemsAndroid
Instruction setArmv8-A (64 bit)
ISA extensions
Release dateQ4/2021
Release price
DocumentsTechnical data sheet
Qualcomm QCM6490
Qualcomm QCM6490
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