The HiSilicon Kirin 910 has 4 CPU cores and can process 4 threads at the same time. The processor was presented in Q1/2014 and is based on the 1. Generation of the HiSilicon Kirin series.
CPU lineage
In this classification you can see to which group of processors the HiSilicon Kirin 910 belongs. We also show the direct predecessor and successor of HiSilicon Kirin 910.
The HiSilicon Kirin 910 has 4 cores. The clock frequency of the HiSilicon Kirin 910 is 1.60 GHz. An initial performance assessment can be made using the number of CPU cores.
CPU Cores / Threads:
4 / 4
Core architecture:
normal
Cores:
4x Cortex-A9
Hyperthreading / SMT:
No
Overclocking:
No
Frequency:
1.60 GHz
Turbo Frequency (1 Core):
--
Turbo Frequency (4 Cores):
--
Artificial Intelligence and Machine Learning
Processors with the support of artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. Algorithms for ML improve their performance the more data they have collected via software. ML tasks can be processed up to 10,000 times faster than with a classic processor.
AI hardware:
--
AI specifications:
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Internal Graphics
The HiSilicon Kirin 910 has an integrated graphics that the system can use to efficiently play back videos. The HiSilicon Kirin 910 has the ARM Mali-450 MP4 installed, which has 4 streaming multiprocessors (64 shaders).
Processors with integrated graphics can process video codecs faster. Support for modern codecs can significantly increase system efficiency during video playback.
h265 / HEVC (8 bit):
No
h265 / HEVC (10 bit):
No
h264:
No
VP8:
No
VP9:
No
AV1:
No
AVC:
No
VC-1:
No
JPEG:
No
Memory & PCIe
The HiSilicon Kirin 910 supports a maximum of memory. Depending on the mainboard, the processor can use a maximum of 1 (Single Channel) memory channels. This results in a maximum bandwidth of the main memory of --.
Memory type:
Memory bandwidth:
LPDDR3
--
Max. Memory:
Memory channels:
1 (Single Channel)
ECC:
No
PCIe:
PCIe Bandwidth:
--
Thermal Management
The HiSilicon Kirin 910 has a TDP of . Based on the TDP, the system manufacturer can and must adapt the cooling solution to the processor.
TDP (PL1 / PBP):
TDP (PL2):
--
TDP up:
--
TDP down:
--
Tjunction max.:
--
Technical details
Modern production reduces the waste heat of a processor and increases its efficiency. The HiSilicon Kirin 910 is made in 28 nm and has 0.00 MB cache.
Technology:
28 nm
Chip design:
Chiplet
Socket:
--
L2-Cache:
--
L3-Cache:
--
AES-NI:
No
Operating systems:
Android
Virtualization:
None
Instruction set (ISA):
ARMv7-A32 (32 bit)
ISA extensions:
Release date:
Q1/2014
Release price:
--
Part Number:
--
Documents:
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HiSilicon Kirin 910 4C 4T @ 1.60 GHz
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Benchmark results
The benchmark results for the HiSilicon Kirin 910 have been carefully checked by us. We only publish benchmark results that have been created by us or that have been submitted by a visitor and then checked by a team member. All results are based on and fullfill our benchmark guidelines.
The theoretical computing performance of the internal graphics unit of the processor with simple accuracy (32 bit) in GFLOPS. GFLOPS indicates how many billion floating point operations the iGPU can perform per second.