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HiSilicon Kirin 910 Benchmark, Test and specs
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The HiSilicon Kirin 910 has 4 CPU cores and can process 4 threads at the same time. The processor was presented in Q1/2014 and is based on the 1. Generation of the HiSilicon Kirin series.
| Name: | HiSilicon Kirin 910 |
|---|---|
| Family: | HiSilicon Kirin (29) |
| CPU group: | HiSilicon Kirin 910 (2) |
| Architecture: | Cortex-A9 |
| Technology: | 28 nm |
| Segment: | Smartphone / Tablet |
| Generation: | 1 |
| Predecessor: | -- |
| Successor: | -- |
CPU Cores and Base Frequency
The HiSilicon Kirin 910 has 4 cores. The clock frequency of the HiSilicon Kirin 910 is 1.60 GHz. An initial performance assessment can be made using the number of CPU cores.
| CPU Cores / Threads: | 4 / 4 |
|---|---|
| Core architecture: | normal |
| Cores: | 4x Cortex-A9 |
| Hyperthreading / SMT: | No |
|---|---|
| Overclocking: | No |
| Frequency: | 1.60 GHz |
| Turbo Frequency (1 Core): | -- |
| Turbo Frequency (4 Cores): | -- |
Integrated graphics (iGPU)
The HiSilicon Kirin 910 has an integrated graphics that the system can use to efficiently play back videos. The HiSilicon Kirin 910 has the ARM Mali-450 MP4 installed, which has 4 streaming multiprocessors (64 shaders).
| GPU name: | ARM Mali-450 MP4 |
|---|---|
| GPU frequency: | 0.53 GHz |
| GPU (Turbo): | 0.53 GHz |
| Compute units: | 4 |
| Shader: | 64 |
| Hardware Raytracing: | No |
| Release date: | 2012 |
| Max. displays: | 1 |
|---|---|
| Generation: | Utgard |
| Direct X: | 0 |
| Technology: | 28nm |
| Max. GPU Memory: | -- |
| Frame Generation: | No |
Memory & PCIeThe HiSilicon Kirin 910 supports a maximum of memory. Depending on the mainboard, the processor can use a maximum of 1 (Single Channel) memory channels. This results in a maximum bandwidth of the main memory of --. |
|
| Memory type: | Memory bandwidth: |
|---|---|
| LPDDR3 | -- |
| Max. Memory: | |
| Memory channels: | 1 (Single Channel) |
| ECC: | No |
| PCIe: | |
| PCIe Bandwidth: | -- |
Thermal ManagementThe HiSilicon Kirin 910 has a TDP of . Based on the TDP, the system manufacturer can and must adapt the cooling solution to the processor. |
|
|---|---|
| TDP (PL1 / PBP): | |
| TDP (PL2): | -- |
| TDP up: | -- |
| TDP down: | -- |
| Tjunction max.: | -- |
Technical details
Modern production reduces the waste heat of a processor and increases its efficiency. The HiSilicon Kirin 910 is made in 28 nm and has 0.00 MB cache.
| Technology: | 28 nm |
|---|---|
| Chip design: | Chiplet |
| Socket: | -- |
| L2-Cache: | -- |
| L3-Cache: | -- |
| AES-NI: | No |
| Operating systems: | Android |
| Virtualization: | None |
|---|---|
| Instruction set (ISA): | Armv7-A (32 bit) |
| ISA extensions: | -- |
| Release date: | Q1/2014 |
| Release price: | -- |
| Part Number: | -- |
| Documents: | -- |
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Benchmark results
The benchmark results for the HiSilicon Kirin 910 have been carefully checked by us. We only publish benchmark results that have been created by us or that have been submitted by a visitor and then checked by a team member. All results are based on and fullfill our benchmark guidelines.
iGPU - FP32 Performance (Single-precision GFLOPS)
The theoretical computing performance of the internal graphics unit of the processor with simple accuracy (32 bit) in GFLOPS. GFLOPS indicates how many billion floating point operations the iGPU can perform per second.
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