HiSilicon Kirin 659 vs MediaTek Dimensity 8300
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CPU comparison with benchmarks
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| HiSilicon Kirin 659 | MediaTek Dimensity 8300 | |
CPU comparisonHiSilicon Kirin 659 or MediaTek Dimensity 8300 - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The HiSilicon Kirin 659 has 8 cores with 8 threads and clocks with a maximum frequency of 2.36 GHz. Up to GB of memory is supported in 2 memory channels. The HiSilicon Kirin 659 was released in Q2/2016. The MediaTek Dimensity 8300 has 8 cores with 8 threads and clocks with a maximum frequency of 3.35 GHz. The CPU supports up to GB of memory in 4 memory channels. The MediaTek Dimensity 8300 was released in Q4/2023. |
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| HiSilicon Kirin (29) | Family | Mediatek Dimensity (36) |
| HiSilicon Kirin 650 (4) | CPU group | MediaTek Dimensity 8300 (1) |
| 4 | Generation | 4 |
| Cortex-A53 / Cortex-A53 | Architecture | Cortex-A715 / -A510 |
| Mobile | Segment | Mobile |
| -- | Predecessor | -- |
| -- | Successor | -- |
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CPU Cores and Base FrequencyThe HiSilicon Kirin 659 has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the HiSilicon Kirin 659 is 2.36 GHz while the MediaTek Dimensity 8300 has 8 CPU cores and 8 threads can calculate simultaneously. The clock frequency of the MediaTek Dimensity 8300 is at 3.35 GHz. |
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| HiSilicon Kirin 659 | Characteristic | MediaTek Dimensity 8300 |
| 8 | Cores | 8 |
| 8 | Threads | 8 |
| hybrid (big.LITTLE) | Core architecture | hybrid (Prime / big.LITTLE) |
| No | Hyperthreading | No |
| No | Overclocking ? | No |
| 2.36 GHz 4x Cortex-A53 |
A-Core | 3.35 GHz 1x Cortex-A715 |
| 1.70 GHz 4x Cortex-A53 |
B-Core | 3.20 GHz 3x Cortex-A715 |
| -- | C-Core | 2.20 GHz 4x Cortex-A510 |
Artificial Intelligence and Machine LearningProcessors with the support of artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. Algorithms for ML improve their performance the more data they have collected via software. ML tasks can be processed up to 10,000 times faster than with a classic processor. |
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| HiSilicon Kirin 659 | Characteristic | MediaTek Dimensity 8300 |
| -- | AI hardware | Mediatek APU |
| -- | AI specifications | APU 780 |
Internal GraphicsThe HiSilicon Kirin 659 or MediaTek Dimensity 8300 has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
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| ARM Mali-T830 MP2 | GPU | ARM Mali-G615 MP6 |
| 0.90 GHz | GPU frequency | 1.40 GHz |
| -- | GPU (Turbo) | 1.40 GHz |
| Midgard 4 | GPU Generation | -- |
| 28nm | Technology | 4 nm |
| 2 | Max. displays | 1 |
| 2 | Compute units | 6 |
| 32 | Shader | -- |
| No | Hardware Raytracing | No |
| No | Frame Generation | No |
| -- | Max. GPU Memory | -- |
| 11 | DirectX Version | 12 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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| ARM Mali-T830 MP2 | GPU | ARM Mali-G615 MP6 |
| Decode / Encode | Codec h265 / HEVC (8 bit) | Decode / Encode |
| Decode | Codec h265 / HEVC (10 bit) | Decode / Encode |
| Decode / Encode | Codec h264 | Decode / Encode |
| No | Codec VP9 | Decode / Encode |
| Decode / Encode | Codec VP8 | Decode / Encode |
| No | Codec AV1 | Decode |
| No | Codec AVC | Decode / Encode |
| No | Codec VC-1 | Decode / Encode |
| Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeThe HiSilicon Kirin 659 can use up to GB of memory in 2 memory channels. The maximum memory bandwidth is --. The MediaTek Dimensity 8300 supports up to GB of memory in 4 memory channels and achieves a memory bandwidth of up to 68.2 GB/s. |
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| HiSilicon Kirin 659 | Characteristic | MediaTek Dimensity 8300 |
| LPDDR3-933 | Memory | LPDDR5X-8533 |
| Max. Memory | ||
| 2 (Dual Channel) | Memory channels | 4 (Quad Channel) |
| -- | Max. Bandwidth | 68.2 GB/s |
| No | ECC | No |
| -- | L2 Cache | -- |
| -- | L3 Cache | 4.00 MB |
| -- | PCIe version | -- |
| -- | PCIe lanes | -- |
| -- | PCIe Bandwidth | -- |
Thermal ManagementThe thermal design power (TDP for short) of the HiSilicon Kirin 659 is --, while the MediaTek Dimensity 8300 has a TDP of --. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. |
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| HiSilicon Kirin 659 | Characteristic | MediaTek Dimensity 8300 |
| -- | TDP (PL1 / PBP) | -- |
| -- | TDP (PL2) | -- |
| -- | TDP up | -- |
| -- | TDP down | -- |
| -- | Tjunction max. | -- |
Technical detailsThe HiSilicon Kirin 659 is manufactured in 16 nm and has 0.00 MB cache. The MediaTek Dimensity 8300 is manufactured in 4 nm and has a 4.00 MB cache. |
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| HiSilicon Kirin 659 | Characteristic | MediaTek Dimensity 8300 |
| 16 nm | Technology | 4 nm |
| Chiplet | Chip design | Chiplet |
| Armv8-A (64 bit) | Instruction set (ISA) | Armv9-A (64 bit) |
| -- | ISA extensions | -- |
| -- | Socket | -- |
| None | Virtualization | None |
| No | AES-NI | No |
| Android | Operating systems | Android |
| Q2/2016 | Release date | Q4/2023 |
| -- | Release price | -- |
| show more data | show more data | |
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8C 8T @ 2.36 GHz buy now on Amazon and save!
8C 8T @ 3.35 GHz buy now on Amazon and save!
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Rate these processors
Geekbench 5, 64bit (Single-Core)
Geekbench 5 is a cross plattform benchmark that heavily uses the systems memory. A fast memory will push the result a lot. The single-core test only uses one CPU core, the amount of cores or hyperthreading ability doesn't count.
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HiSilicon Kirin 659
8C 8T @ 2.36 GHz |
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MediaTek Dimensity 8300
8C 8T @ 3.35 GHz |
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Geekbench 5, 64bit (Multi-Core)
Geekbench 5 is a cross plattform benchmark that heavily uses the systems memory. A fast memory will push the result a lot. The multi-core test involves all CPU cores and taks a big advantage of hyperthreading.
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HiSilicon Kirin 659
8C 8T @ 2.36 GHz |
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MediaTek Dimensity 8300
8C 8T @ 3.35 GHz |
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iGPU - FP32 Performance (Single-precision GFLOPS)
The theoretical computing performance of the internal graphics unit of the processor with simple accuracy (32 bit) in GFLOPS. GFLOPS indicates how many billion floating point operations the iGPU can perform per second.
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HiSilicon Kirin 659
ARM Mali-T830 MP2 @ 0.90 GHz |
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MediaTek Dimensity 8300
ARM Mali-G615 MP6 @ 1.40 GHz |
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AnTuTu 10 Benchmark
The AnTuTu 10 benchmark is one of the best-known benchmarks for mobile processors, which is now available in version 10. There is a version for Android-based smartphones and tablets, as well as a version for Apple mobile devices, i.e. iPhones and iPads.
The Antutu 10 benchmark has 3 phases. In the first phase, the device's RAM is tested, in phase 2 the graphics are tested and in the final phase the entire device is pushed to its performance limits by rendering 3D graphics.
Antutu 10 is therefore ideal for comparing the performance of different devices.
The Antutu 10 benchmark has 3 phases. In the first phase, the device's RAM is tested, in phase 2 the graphics are tested and in the final phase the entire device is pushed to its performance limits by rendering 3D graphics.
Antutu 10 is therefore ideal for comparing the performance of different devices.
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HiSilicon Kirin 659
8C 8T @ 2.36 GHz |
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MediaTek Dimensity 8300
8C 8T @ 3.35 GHz |
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Devices using this processor |
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| HiSilicon Kirin 659 | MediaTek Dimensity 8300 |
| Unknown | Unknown |
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