Apple M3 Pro (11-CPU 14-GPU) vs AMD Ryzen Embedded 5900E

Apple M3 Pro (11-CPU 14-GPU) or AMD Ryzen Embedded 5900E - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.

The Apple M3 Pro (11-CPU 14-GPU) has 11 cores with 11 threads and clocks with a maximum frequency of 4.06 GHz. Up to 36 GB of memory is supported in 2 memory channels. The Apple M3 Pro (11-CPU 14-GPU) was released in Q4/2023.

The AMD Ryzen Embedded 5900E has 12 cores with 24 threads and clocks with a maximum frequency of 3.70 GHz. The CPU supports up to 128 GB of memory in 2 memory channels. The AMD Ryzen Embedded 5900E was released in Q2/2023.

The Apple M3 Pro (11-CPU 14-GPU) has 11 CPU cores and can calculate 11 threads in parallel. The clock frequency of the Apple M3 Pro (11-CPU 14-GPU) is 0.70 GHz (4.06 GHz) while the AMD Ryzen Embedded 5900E has 12 CPU cores and 24 threads can calculate simultaneously. The clock frequency of the AMD Ryzen Embedded 5900E is at 3.35 GHz (3.70 GHz).

The performance values of the processor's AI unit. The isolated NPU performance is specified here, the total AI performance (NPU+CPU+iGPU) can be higher. Processors with support for artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors.

The Apple M3 Pro (11-CPU 14-GPU) or AMD Ryzen Embedded 5900E has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die.

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.

The Apple M3 Pro (11-CPU 14-GPU) can use up to 36 GB of memory in 2 memory channels. The maximum memory bandwidth is 153.6 GB/s. The AMD Ryzen Embedded 5900E supports up to 128 GB of memory in 2 memory channels and achieves a memory bandwidth of up to 51.2 GB/s.

The thermal design power (TDP for short) of the Apple M3 Pro (11-CPU 14-GPU) is 35 W, while the AMD Ryzen Embedded 5900E has a TDP of 105 W. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently.

The Apple M3 Pro (11-CPU 14-GPU) is manufactured in 3 nm and has 36.00 MB cache. The AMD Ryzen Embedded 5900E is manufactured in 7 nm and has a 70.00 MB cache.