AMD Ryzen 3 3250C | HiSilicon Kirin 820E 5G | |
CPU comparisonIn this CPU comparison, we compare the AMD Ryzen 3 3250C and the HiSilicon Kirin 820E 5G and use benchmarks to check which processor is faster.
We compare the AMD Ryzen 3 3250C 2 core processor released in Q3/2020 with the HiSilicon Kirin 820E 5G which has 8 CPU cores and was introduced in Q1/2021. |
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AMD Ryzen 3 (33) | Family | HiSilicon Kirin (29) |
AMD Ryzen 3000C (3) | CPU group | HiSilicon Kirin 810/820 (3) |
3 | Generation | 6 |
Picasso (Zen+) | Architecture | Cortex-A76 / Cortex-A55 |
Mobile | Segment | Mobile |
-- | Predecessor | -- |
AMD Ryzen 3 5425C | Successor | -- |
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CPU Cores and Base FrequencyThe AMD Ryzen 3 3250C is a 2 core processor with a clock frequency of 2.60 GHz (3.50 GHz). The processor can compute 4 threads at the same time. The HiSilicon Kirin 820E 5G clocks with 2.22 GHz, has 8 CPU cores and can calculate 8 threads in parallel. |
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AMD Ryzen 3 3250C | Characteristic | HiSilicon Kirin 820E 5G |
2 | Cores | 8 |
4 | Threads | 8 |
normal | Core architecture | hybrid (big.LITTLE) |
Yes | Hyperthreading | No |
No | Overclocking ? | No |
2.60 GHz (3.50 GHz) | A-Core | 2.22 GHz 3x Cortex-A76 |
-- | B-Core | 1.84 GHz 3x Cortex-A55 |
NPU AI performanceThe performance values of the processor's AI unit. The isolated NPU performance is specified here, the total AI performance (NPU+CPU+iGPU) can be higher. Processors with support for artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. |
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AMD Ryzen 3 3250C | Characteristic | HiSilicon Kirin 820E 5G |
-- | AI hardware | HUAWEI HiAI 2.0 |
-- | AI specifications | Da Vinci Architecture. Ascend D110 Lite |
-- | NPU + CPU + iGPU | -- |
Integrated graphics (iGPU)Graphics (iGPU) integrated into the processor not only enable image output without having to rely on a dedicated graphics solution, but can also efficiently accelerate video playback. |
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AMD Radeon RX Vega 3 (Raven Ridge) | GPU | ARM Mali-G57 MP6 |
1.20 GHz | GPU frequency | 0.85 GHz |
-- | GPU (Turbo) | -- |
8 | GPU Generation | Vallhall 1 |
14 nm | Technology | 7 nm |
3 | Max. displays | 2 |
3 | Compute units | 6 |
192 | Shader | 96 |
No | Hardware Raytracing | No |
No | Frame Generation | No |
2 GB | Max. GPU Memory | 4 GB |
12 | DirectX Version | 12 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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AMD Radeon RX Vega 3 (Raven Ridge) | GPU | ARM Mali-G57 MP6 |
Decode / Encode | Codec h265 / HEVC (8 bit) | Decode / Encode |
Decode / Encode | Codec h265 / HEVC (10 bit) | Decode / Encode |
Decode / Encode | Codec h264 | Decode / Encode |
Decode / Encode | Codec VP9 | Decode / Encode |
Decode / Encode | Codec VP8 | Decode / Encode |
No | Codec AV1 | Decode |
Decode / Encode | Codec AVC | Decode / Encode |
Decode | Codec VC-1 | Decode / Encode |
Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeUp to 32 GB of memory in a maximum of 2 memory channels is supported by the AMD Ryzen 3 3250C, while the HiSilicon Kirin 820E 5G supports a maximum of GB of memory with a maximum memory bandwidth of -- enabled. |
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AMD Ryzen 3 3250C | Characteristic | HiSilicon Kirin 820E 5G |
DDR4-2400 | Memory | LPDDR4X-2133 |
32 GB | Max. Memory | |
2 (Dual Channel) | Memory channels | 4 (Quad Channel) |
38.4 GB/s | Max. Bandwidth | -- |
Yes | ECC | No |
1.00 MB | L2 Cache | -- |
4.00 MB | L3 Cache | 2.00 MB |
3.0 | PCIe version | -- |
20 | PCIe lanes | -- |
19.7 GB/s | PCIe Bandwidth | -- |
Thermal ManagementThe AMD Ryzen 3 3250C has a TDP of 15 W. The TDP of the HiSilicon Kirin 820E 5G is 6 W. System integrators use the TDP of the processor as a guide when dimensioning the cooling solution. |
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AMD Ryzen 3 3250C | Characteristic | HiSilicon Kirin 820E 5G |
15 W | TDP (PL1 / PBP) | 6 W |
-- | TDP (PL2) | -- |
25 W | TDP up | -- |
12 W | TDP down | -- |
105 °C | Tjunction max. | -- |
Technical detailsThe AMD Ryzen 3 3250C has 5.00 MB cache and is manufactured in 12 nm. The cache of HiSilicon Kirin 820E 5G is at 2.00 MB. The processor is manufactured in 7 nm. |
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AMD Ryzen 3 3250C | Characteristic | HiSilicon Kirin 820E 5G |
12 nm | Technology | 7 nm |
Chiplet | Chip design | Chiplet |
x86-64 (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
SSE4a, SSE4.1, SSE4.2, AVX2, FMA3 | ISA extensions | -- |
FP5 | Socket | -- |
AMD-V, SVM | Virtualization | None |
Yes | AES-NI | No |
Windows 10, Windows 11, Linux | Operating systems | Android |
Q3/2020 | Release date | Q1/2021 |
-- | Release price | -- |
show more data | show more data | |
AMD Ryzen 3 3250C
AMD Radeon RX Vega 3 (Raven Ridge) @ 1.20 GHz |
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HiSilicon Kirin 820E 5G
ARM Mali-G57 MP6 @ 0.85 GHz |
AMD Ryzen 3 3250C
2C 4T @ 3.50 GHz |
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HiSilicon Kirin 820E 5G
8C 8T @ 2.22 GHz |
AMD Ryzen 3 3250C
2C 4T @ 2.80 GHz |
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HiSilicon Kirin 820E 5G
8C 8T @ 2.22 GHz |
AMD Ryzen 3 3250C
2C 4T @ 3.50 GHz |
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HiSilicon Kirin 820E 5G
8C 8T @ 2.22 GHz |
AMD Ryzen 3 3250C
2C 4T @ 2.80 GHz |
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HiSilicon Kirin 820E 5G
8C 8T @ 2.22 GHz |
AMD Ryzen 3 3250C
2C 4T @ 2.60 GHz |
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HiSilicon Kirin 820E 5G
8C 8T @ 2.22 GHz |
AMD Ryzen 3 3250C
2C 4T @ 2.80 GHz |
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HiSilicon Kirin 820E 5G
8C 8T @ 2.22 GHz |
Devices using this processor |
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AMD Ryzen 3 3250C | HiSilicon Kirin 820E 5G |
Unknown | Huawei Nova 7 SE Huawei Nova 8 |