MediaTek Dimensity 1000+

MediaTek Dimensity 1000+
Benchmarks & Specs

Last updated:
The MediaTek Dimensity 1000+ was a noteworthy mobile processor when it was released. MediaTek manufactured this chip using a modern 7nm process, resulting in good energy efficiency. For processing power, the processor relied on a combination of powerful Cortex-A77 and energy-efficient Cortex-A55 cores.

This architecture provided balanced performance in everyday use. ARM Mali-G77 MP9 delivered very decent graphics performance back then. This made the MediaTek Dimensity 1000+ a good choice for mobile games. It also offered sufficient reserves for demanding multimedia applications. We were surprised at how smoothly many apps ran.

The maximum memory bandwidth of 30 GB/s further supported this. This allowed data to be processed quickly. It was a solid option for many users.
  • Efficient 7nm manufacturing
  • Powerful Cortex-A77 and Cortex-A55 cores
  • Robust ARM Mali-G77 MP9 graphics unit
  • Solid memory bandwidth of 30 GB/s

Performance Overview
Average performance across multiple benchmarks

Single-core performance
Rank 68 / 176
In segment Smartphone / Tablet
Multi-core performance
Rank 53 / 177
In segment Smartphone / Tablet
Geekbench 6 Single-Core

Geekbench 6 Single-Core
Single-core performance

Samsung Exynos 1380
8C / 8T · 2.40 GHz
984
Qualcomm Snapdragon 860
8C / 8T · 2.96 GHz
972
MediaTek Dimensity 1000+
8C / 8T · 2.60 GHz
970
MediaTek Dimensity 1100
8C / 8T · 2.60 GHz
966
Qualcomm Snapdragon 855
8C / 8T · 2.84 GHz
960
Geekbench 6 Multi-Core

Geekbench 6 Multi-Core
Multi-core performance

Qualcomm Snapdragon 865+
8C / 8T · 3.10 GHz
3,129
MediaTek Dimensity 1100
8C / 8T · 2.60 GHz
3,128
MediaTek Dimensity 1000+
8C / 8T · 2.60 GHz
3,126
Qualcomm Snapdragon 870
8C / 8T · 3.20 GHz
3,110
Qualcomm Snapdragon 7 Gen 3
8C / 8T · 2.63 GHz
3,065
Geekbench 5, 64bit Single-Core

Geekbench 5, 64bit Single-Core
Single-core performance

Samsung Exynos 1380
8C / 8T · 2.40 GHz
780
Apple A10 Fusion
4C / 4T · 2.34 GHz
776
MediaTek Dimensity 1000+
8C / 8T · 2.60 GHz
775
MediaTek Dimensity 920
8C / 8T · 2.50 GHz
768
Samsung Exynos 1330
8C / 8T · 2.40 GHz
768
Geekbench 5, 64bit Multi-Core

Geekbench 5, 64bit Multi-Core
Multi-core performance

Apple A12X Bionic
8C / 8T · 2.49 GHz
4,718
MediaTek Dimensity 9000+
8C / 8T · 3.20 GHz
4,645
MediaTek Dimensity 1000+
8C / 8T · 2.60 GHz
4,507
MediaTek Dimensity 9000
8C / 8T · 3.05 GHz
4,335
Apple A14 Bionic
6C / 6T · 3.00 GHz
4,247
iGPU - FP32 Performance (Single-precision GFLOPS)

iGPU - FP32 Performance (Single-precision GFLOPS)

Qualcomm Snapdragon 855 Plus
Qualcomm Adreno 640
1,037
Apple A12X Bionic
Apple A12X
1,008
MediaTek Dimensity 1000+
ARM Mali-G77 MP9
979
Samsung Exynos 1080
ARM Mali-G78 MP10
972
Qualcomm Snapdragon 855
Qualcomm Adreno 640
899
AnTuTu 8 Benchmark

AnTuTu 8 Benchmark

Qualcomm Snapdragon 780G
8C / 8T · 2.40 GHz
509,756 pts
MediaTek Dimensity 1000
8C / 8T · 2.60 GHz
507,536 pts
MediaTek Dimensity 1000+
8C / 8T · 2.60 GHz
493,583 pts
Qualcomm Snapdragon 855 Plus
8C / 8T · 2.96 GHz
487,155 pts
MediaTek Dimensity 930
8C / 8T · 2.20 GHz
482,796 pts
AI performance (NPU)

AI performance (NPU)

Apple A12X Bionic
8C / 8T · 2.49 GHz
5.0 TOPS
Qualcomm Snapdragon 720G
8C / 8T · 2.30 GHz
5.0 TOPS
MediaTek Dimensity 1000+
8C / 8T · 2.60 GHz
4.5 TOPS
Google Tensor G2
8C / 8T · 2.85 GHz
4.0 TOPS
Qualcomm Snapdragon 732G
8C / 8T · 2.30 GHz
3.6 TOPS

More benchmarks

At a glance

PropertyValue
FamilyMediatek Dimensity (38)
CPU groupMediaTek Dimensity 1000 (4)
ArchitectureCortex-A77 / Cortex-A55
Technology7 nm
SegmentSmartphone / Tablet
Socket
Generation1
Predecessor
Successor

CPU Cores and Base Frequency

PropertyValue
CPU Cores / Threads8 / 8
Hyperthreading / SMT
Core architecturehybrid (big.LITTLE)
Core Cluster 1: 4x Cortex-A77
2.60 GHz
Core Cluster 2: 4x Cortex-A55
2.00 GHz
L2-Cache
L3-Cache
OverclockingNo

Integrated graphics (iGPU)

PropertyValue
GPU nameARM Mali-G77 MP9
GPU frequency0.85 GHz
CUs / Shader9 / 144
Raytracing
Max. displays1
Max. GPU Memory4 GB
Technology7 nm
Release dateQ2/2019

NPU AI performance

PropertyValue
AI hardwareMediatek APU 3.0
AI specifications
NPU + CPU + iGPU

Memory & PCIe

Memory typeMemory bandwidth
LPDDR4X-1866
29.8 GB/s
PropertyValue
Max. Memory16 GB
Memory channels4
ECC
PCIe
PCIe Bandwidth

Thermal Management

PropertyValue
TDP
TDP (PL2)
TDP up
TDP down
T. junction max.

Technical details

PropertyValue
Chip designChiplet
AES-NI
Operating systemsAndroid
Instruction setArmv8-A (64 bit)
ISA extensions
Release dateQ2/2020
Release price
Documents
MediaTek Dimensity 1000+
MediaTek Dimensity 1000+
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