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Intel Xeon D-1627
Benchmarks & Specs
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Intel Xeon D-1627
Summary
The Intel Xeon D-1627 is a processor specifically designed for certain applications. It is based on the Hewitt Lake architecture. This chip was manufactured using the 14nm process. This achieved a balanced energy efficiency. For connecting external components, it offers PCIe 3.0, which enables versatile connectivity.
The processor has 6 MB of Level 2 cache. This is adequately sized for many dedicated tasks. With a maximum memory bandwidth of 34 GB/s, it is flexible in its application. The Intel Xeon D-1627 is ideally suited for embedded systems. It is also frequently used in compact server systems. Its design aims for long-lasting and reliable services.
It delivers stable performance for special server tasks. We often see it in edge computing solutions. There it can fully exploit its specific advantages. It remains a reliable choice for certain infrastructures. Its durability is a clear advantage that is appreciated.
The processor has 6 MB of Level 2 cache. This is adequately sized for many dedicated tasks. With a maximum memory bandwidth of 34 GB/s, it is flexible in its application. The Intel Xeon D-1627 is ideally suited for embedded systems. It is also frequently used in compact server systems. Its design aims for long-lasting and reliable services.
It delivers stable performance for special server tasks. We often see it in edge computing solutions. There it can fully exploit its specific advantages. It remains a reliable choice for certain infrastructures. Its durability is a clear advantage that is appreciated.
- Hewitt Lake Architecture
- 14nm Manufacturing Process
- Versatile PCIe 3.0 Connectivity
- Designed for reliable Embedded- and Edge-Applications
Benchmarks
Performance Overview
Average performance across multiple benchmarks
Single-core performance
Multi-core performance
More benchmarks
Specifications
At a glance
| Property | Value |
|---|---|
| Family | Intel Xeon D (79) |
| CPU group | Intel Xeon D-1600 (8) |
| Architecture | Hewitt Lake |
| Technology | 14 nm |
| Segment | Desktop |
| Socket | BGA 1667 |
| Generation | 3 |
| Predecessor | |
| Successor |
CPU Cores and Base Frequency
| Property | Value |
|---|---|
| CPU Cores / Threads | 4 / 8 |
| Hyperthreading / SMT | ✓ |
| Core architecture | normal |
| Cores: | 4x |
| Frequency: | 2.90 GHz |
| Turbo Frequency (1 Core): | 3.20 GHz |
| Turbo Frequency (4 Cores): | 3.20 GHz |
| L2-Cache | 6.00 MB |
| L3-Cache | |
| Overclocking | No |
Memory & PCIe
| Memory type | Memory bandwidth |
|---|---|
| DDR4-2133 | 34.1 GB/s |
| Property | Value |
| Max. Memory | 128 GB |
| Memory channels | 2 |
| ECC | ✓ |
| PCIe | 3.0 x 32 |
| PCIe Bandwidth | 31.5 GB/s |
Thermal Management
| Property | Value |
|---|---|
| TDP | 45 W |
| TDP (PL2) | |
| TDP up | |
| TDP down | |
| T. junction max. |
Technical details
| Property | Value |
|---|---|
| Chip design | Monolithic |
| AES-NI | ✓ |
| Operating systems | Windows 10, Linux |
| Instruction set | x86-64 (64 bit) |
| ISA extensions | SSE4.1, SSE4.2, AVX2 |
| Release date | Q2/2019 |
| Release price | 216 $ |
| Documents | Technical data sheet |
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