Qualcomm Snapdragon Microsoft SQ2 | HiSilicon Kirin 9000 | |
CPU comparisonQualcomm Snapdragon Microsoft SQ2 or HiSilicon Kirin 9000 - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The Qualcomm Snapdragon Microsoft SQ2 has 8 cores with 8 threads and clocks with a maximum frequency of 3.15 GHz. Up to 16 GB of memory is supported in 8 memory channels. The Qualcomm Snapdragon Microsoft SQ2 was released in Q3/2020. The HiSilicon Kirin 9000 has 8 cores with 8 threads and clocks with a maximum frequency of 3.13 GHz. The CPU supports up to GB of memory in 4 memory channels. The HiSilicon Kirin 9000 was released in Q4/2020. |
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Qualcomm Snapdragon (102) | Family | HiSilicon Kirin (29) |
Qualcomm Snapdragon SQ1/SQ2 (2) | CPU group | HiSilicon Kirin 9000 (2) |
1 | Generation | 9 |
Kryo 495 | Architecture | Cortex-A77 / Cortex-A55 |
Mobile | Segment | Mobile |
-- | Predecessor | -- |
-- | Successor | -- |
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CPU Cores and Base FrequencyThe Qualcomm Snapdragon Microsoft SQ2 has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the Qualcomm Snapdragon Microsoft SQ2 is 3.15 GHz while the HiSilicon Kirin 9000 has 8 CPU cores and 8 threads can calculate simultaneously. The clock frequency of the HiSilicon Kirin 9000 is at 3.13 GHz. |
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Qualcomm Snapdragon Microsoft SQ2 | Characteristic | HiSilicon Kirin 9000 |
8 | Cores | 8 |
8 | Threads | 8 |
hybrid (big.LITTLE) | Core architecture | hybrid (Prime / big.LITTLE) |
No | Hyperthreading | No |
No | Overclocking ? | No |
3.15 GHz 4x Kryo 495 Gold |
A-Core | 3.13 GHz 1x Cortex-A77 |
2.42 GHz 4x Kryo 495 Silver |
B-Core | 2.54 GHz 3x Cortex-A77 |
-- | C-Core | 2.05 GHz 4x Cortex-A55 |
Internal GraphicsThe Qualcomm Snapdragon Microsoft SQ2 or HiSilicon Kirin 9000 has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
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Qualcomm Adreno 690 | GPU | ARM Mali-G78 MP24 |
GPU frequency | 0.76 GHz | |
-- | GPU (Turbo) | -- |
6 | GPU Generation | Vallhall 2 |
7 nm | Technology | 5 nm |
0 | Max. displays | 1 |
-- | Compute units | 24 |
-- | Shader | 384 |
No | Hardware Raytracing | No |
No | Frame Generation | No |
-- | Max. GPU Memory | -- |
12.0 | DirectX Version | 12 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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Qualcomm Adreno 690 | GPU | ARM Mali-G78 MP24 |
Decode / Encode | Codec h265 / HEVC (8 bit) | Decode / Encode |
Decode / Encode | Codec h265 / HEVC (10 bit) | Decode / Encode |
Decode / Encode | Codec h264 | Decode / Encode |
Decode | Codec VP9 | Decode / Encode |
Decode / Encode | Codec VP8 | Decode / Encode |
No | Codec AV1 | Decode |
Decode | Codec AVC | Decode / Encode |
Decode | Codec VC-1 | Decode / Encode |
Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeThe Qualcomm Snapdragon Microsoft SQ2 can use up to 16 GB of memory in 8 memory channels. The maximum memory bandwidth is 68.3 GB/s. The HiSilicon Kirin 9000 supports up to GB of memory in 4 memory channels and achieves a memory bandwidth of up to --. |
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Qualcomm Snapdragon Microsoft SQ2 | Characteristic | HiSilicon Kirin 9000 |
LPDDR4X-2133 | Memory | LPDDR5-2750, LPDDR4X-2133 |
16 GB | Max. Memory | |
8 (Octa Channel) | Memory channels | 4 (Quad Channel) |
68.3 GB/s | Max. Bandwidth | -- |
No | ECC | No |
-- | L2 Cache | -- |
-- | L3 Cache | -- |
-- | PCIe version | -- |
-- | PCIe lanes | -- |
-- | PCIe Bandwidth | -- |
Thermal ManagementThe thermal design power (TDP for short) of the Qualcomm Snapdragon Microsoft SQ2 is --, while the HiSilicon Kirin 9000 has a TDP of --. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. |
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Qualcomm Snapdragon Microsoft SQ2 | Characteristic | HiSilicon Kirin 9000 |
-- | TDP (PL1 / PBP) | -- |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe Qualcomm Snapdragon Microsoft SQ2 is manufactured in 7 nm and has 0.00 MB cache. The HiSilicon Kirin 9000 is manufactured in 5 nm and has a 0.00 MB cache. |
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Qualcomm Snapdragon Microsoft SQ2 | Characteristic | HiSilicon Kirin 9000 |
7 nm | Technology | 5 nm |
Chiplet | Chip design | Chiplet |
Armv8-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
-- | ISA extensions | -- |
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android, Windows 10 (ARM) | Operating systems | Android |
Q3/2020 | Release date | Q4/2020 |
-- | Release price | -- |
show more data | show more data | |
Qualcomm Snapdragon Microsoft SQ2
8C 8T @ 3.15 GHz |
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HiSilicon Kirin 9000
8C 8T @ 3.13 GHz |
Qualcomm Snapdragon Microsoft SQ2
8C 8T @ 3.15 GHz |
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HiSilicon Kirin 9000
8C 8T @ 3.13 GHz |
Qualcomm Snapdragon Microsoft SQ2
Qualcomm Adreno 690 @ 0.00 GHz |
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HiSilicon Kirin 9000
ARM Mali-G78 MP24 @ 0.76 GHz |
Qualcomm Snapdragon Microsoft SQ2
8C 8T @ 3.15 GHz |
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HiSilicon Kirin 9000
8C 8T @ 3.13 GHz |
Devices using this processor |
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Qualcomm Snapdragon Microsoft SQ2 | HiSilicon Kirin 9000 |
Microsoft Surface Pro X | Unknown |