Qualcomm Snapdragon 7c+ Gen 3 vs HiSilicon Kirin 990 4G
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CPU comparison with benchmarks
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| Qualcomm Snapdragon 7c+ Gen 3 | HiSilicon Kirin 990 4G | |
CPU comparisonIn this CPU comparison, we compare the Qualcomm Snapdragon 7c+ Gen 3 and the HiSilicon Kirin 990 4G and use benchmarks to check which processor is faster.
We compare the Qualcomm Snapdragon 7c+ Gen 3 8 core processor released in Q1/2022 with the HiSilicon Kirin 990 4G which has 8 CPU cores and was introduced in Q3/2019. |
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| Qualcomm Snapdragon (102) | Family | HiSilicon Kirin (29) |
| Qualcomm Snapdragon 7c Plus (1) | CPU group | HiSilicon Kirin 990 (3) |
| 3 | Generation | 8 |
| Cortex-A78 / Cortex-A55 | Architecture | Cortex-A76 / Cortex-A55 |
| Mobile | Segment | Mobile |
| Qualcomm Snapdragon 7c Gen 2 | Predecessor | -- |
| -- | Successor | -- |
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CPU Cores and Base FrequencyThe Qualcomm Snapdragon 7c+ Gen 3 is a 8 core processor with a clock frequency of 2.40 GHz. The processor can compute 8 threads at the same time. The HiSilicon Kirin 990 4G clocks with 2.86 GHz, has 8 CPU cores and can calculate 8 threads in parallel. |
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| Qualcomm Snapdragon 7c+ Gen 3 | Characteristic | HiSilicon Kirin 990 4G |
| 8 | Cores | 8 |
| 8 | Threads | 8 |
| hybrid (big.LITTLE) | Core architecture | hybrid (Prime / big.LITTLE) |
| No | Hyperthreading | No |
| No | Overclocking ? | No |
| 2.40 GHz 4x Cortex-A78 |
A-Core | 2.86 GHz 2x Cortex-A76 |
| 1.50 GHz 4x Cortex-A55 |
B-Core | 2.09 GHz 2x Cortex-A76 |
| -- | C-Core | 1.86 GHz 4x Cortex-A55 |
Artificial Intelligence and Machine LearningProcessors with the support of artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. Algorithms for ML improve their performance the more data they have collected via software. ML tasks can be processed up to 10,000 times faster than with a classic processor. |
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| Qualcomm Snapdragon 7c+ Gen 3 | Characteristic | HiSilicon Kirin 990 4G |
| -- | AI hardware | HUAWEI HiAI 2.0 |
| -- | AI specifications | Da Vinci Architecture. 1x Ascend Lite + 1x Ascend Tiny |
Internal GraphicsGraphics (iGPU) integrated into the processor not only enable image output without having to rely on a dedicated graphics solution, but can also efficiently accelerate video playback. |
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| Qualcomm Adreno 642L | GPU | ARM Mali-G76 MP16 |
| 0.70 GHz | GPU frequency | 0.60 GHz |
| -- | GPU (Turbo) | -- |
| 5 | GPU Generation | Bifrost 3 |
| 6 nm | Technology | 7 nm |
| 1 | Max. displays | 2 |
| 4 | Compute units | 16 |
| 384 | Shader | 256 |
| No | Hardware Raytracing | No |
| No | Frame Generation | No |
| 4 GB | Max. GPU Memory | 4 GB |
| 12.0 | DirectX Version | 12 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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| Qualcomm Adreno 642L | GPU | ARM Mali-G76 MP16 |
| Decode | Codec h265 / HEVC (8 bit) | Decode / Encode |
| Decode | Codec h265 / HEVC (10 bit) | Decode / Encode |
| Decode / Encode | Codec h264 | Decode / Encode |
| Decode | Codec VP9 | Decode / Encode |
| Decode | Codec VP8 | Decode / Encode |
| No | Codec AV1 | No |
| Decode | Codec AVC | Decode / Encode |
| Decode | Codec VC-1 | Decode / Encode |
| Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeUp to 16 GB of memory in a maximum of 2 memory channels is supported by the Qualcomm Snapdragon 7c+ Gen 3, while the HiSilicon Kirin 990 4G supports a maximum of 8 GB of memory with a maximum memory bandwidth of -- enabled. |
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| Qualcomm Snapdragon 7c+ Gen 3 | Characteristic | HiSilicon Kirin 990 4G |
| LPDDR5-6400, LPDDR4X-4266 | Memory | LPDDR4X-2133 |
| 16 GB | Max. Memory | 8 GB |
| 2 (Dual Channel) | Memory channels | 4 (Quad Channel) |
| 51.2 GB/s | Max. Bandwidth | -- |
| No | ECC | No |
| -- | L2 Cache | -- |
| -- | L3 Cache | 2.00 MB |
| -- | PCIe version | -- |
| -- | PCIe lanes | -- |
| -- | PCIe Bandwidth | -- |
Thermal ManagementThe Qualcomm Snapdragon 7c+ Gen 3 has a TDP of --. The TDP of the HiSilicon Kirin 990 4G is 6 W. System integrators use the TDP of the processor as a guide when dimensioning the cooling solution. |
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| Qualcomm Snapdragon 7c+ Gen 3 | Characteristic | HiSilicon Kirin 990 4G |
| -- | TDP (PL1 / PBP) | 6 W |
| -- | TDP (PL2) | -- |
| -- | TDP up | -- |
| -- | TDP down | -- |
| -- | Tjunction max. | -- |
Technical detailsThe Qualcomm Snapdragon 7c+ Gen 3 has 0.00 MB cache and is manufactured in 6 nm. The cache of HiSilicon Kirin 990 4G is at 2.00 MB. The processor is manufactured in 7 nm. |
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| Qualcomm Snapdragon 7c+ Gen 3 | Characteristic | HiSilicon Kirin 990 4G |
| 6 nm | Technology | 7 nm |
| Chiplet | Chip design | Chiplet |
| Armv8-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
| -- | ISA extensions | -- |
| -- | Socket | -- |
| None | Virtualization | None |
| No | AES-NI | No |
| Android | Operating systems | Android |
| Q1/2022 | Release date | Q3/2019 |
| -- | Release price | -- |
| show more data | show more data | |
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Rate these processors
Average performance in benchmarks
⌀ Single core performance in 2 CPU benchmarks
⌀ Multi core performance in 2 CPU benchmarks
Geekbench 5, 64bit (Single-Core)
Geekbench 5 is a cross plattform benchmark that heavily uses the systems memory. A fast memory will push the result a lot. The single-core test only uses one CPU core, the amount of cores or hyperthreading ability doesn't count.
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Qualcomm Snapdragon 7c+ Gen 3
8C 8T @ 2.40 GHz |
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HiSilicon Kirin 990 4G
8C 8T @ 2.86 GHz |
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Geekbench 5, 64bit (Multi-Core)
Geekbench 5 is a cross plattform benchmark that heavily uses the systems memory. A fast memory will push the result a lot. The multi-core test involves all CPU cores and taks a big advantage of hyperthreading.
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Qualcomm Snapdragon 7c+ Gen 3
8C 8T @ 2.40 GHz |
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HiSilicon Kirin 990 4G
8C 8T @ 2.86 GHz |
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Geekbench 6 (Single-Core)
Geekbench 6 is a benchmark for modern computers, notebooks and smartphones. What is new is an optimized utilization of newer CPU architectures, e.g. based on the big.LITTLE concept and combining CPU cores of different sizes. The single-core benchmark only evaluates the performance of the fastest CPU core, the number of CPU cores in a processor is irrelevant here.
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Qualcomm Snapdragon 7c+ Gen 3
8C 8T @ 2.40 GHz |
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HiSilicon Kirin 990 4G
8C 8T @ 2.86 GHz |
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Geekbench 6 (Multi-Core)
Geekbench 6 is a benchmark for modern computers, notebooks and smartphones. What is new is an optimized utilization of newer CPU architectures, e.g. based on the big.LITTLE concept and combining CPU cores of different sizes. The multi-core benchmark evaluates the performance of all of the processor's CPU cores. Virtual thread improvements such as AMD SMT or Intel's Hyper-Threading have a positive impact on the benchmark result.
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Qualcomm Snapdragon 7c+ Gen 3
8C 8T @ 2.40 GHz |
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HiSilicon Kirin 990 4G
8C 8T @ 2.86 GHz |
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iGPU - FP32 Performance (Single-precision GFLOPS)
The theoretical computing performance of the internal graphics unit of the processor with simple accuracy (32 bit) in GFLOPS. GFLOPS indicates how many billion floating point operations the iGPU can perform per second.
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Qualcomm Snapdragon 7c+ Gen 3
Qualcomm Adreno 642L @ 0.70 GHz |
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HiSilicon Kirin 990 4G
ARM Mali-G76 MP16 @ 0.60 GHz |
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Devices using this processor |
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| Qualcomm Snapdragon 7c+ Gen 3 | HiSilicon Kirin 990 4G |
| Unknown | Huawei Mate 30 Pro |
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