Qualcomm Snapdragon 7 Gen 3 | HiSilicon Kirin 980 | |
CPU comparisonQualcomm Snapdragon 7 Gen 3 or HiSilicon Kirin 980 - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The Qualcomm Snapdragon 7 Gen 3 has 8 cores with 8 threads and clocks with a maximum frequency of 2.63 GHz. Up to GB of memory is supported in 2 memory channels. The Qualcomm Snapdragon 7 Gen 3 was released in Q4/2023. The HiSilicon Kirin 980 has 8 cores with 8 threads and clocks with a maximum frequency of 2.60 GHz. The CPU supports up to 8 GB of memory in 4 memory channels. The HiSilicon Kirin 980 was released in Q4/2018. |
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Qualcomm Snapdragon (103) | Family | HiSilicon Kirin (29) |
Qualcomm Snapdragon 7 Gen 3 (1) | CPU group | HiSilicon Kirin 980 (2) |
3 | Generation | 7 |
Kryo Prime, Gold, Silver | Architecture | Cortex-A76 / Cortex-A55 |
Mobile | Segment | Mobile |
-- | Predecessor | -- |
-- | Successor | -- |
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CPU Cores and Base FrequencyThe Qualcomm Snapdragon 7 Gen 3 has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the Qualcomm Snapdragon 7 Gen 3 is 2.63 GHz while the HiSilicon Kirin 980 has 8 CPU cores and 8 threads can calculate simultaneously. The clock frequency of the HiSilicon Kirin 980 is at 2.60 GHz. |
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Qualcomm Snapdragon 7 Gen 3 | Characteristic | HiSilicon Kirin 980 |
8 | Cores | 8 |
8 | Threads | 8 |
hybrid (Prime / big.LITTLE) | Core architecture | hybrid (Prime / big.LITTLE) |
No | Hyperthreading | No |
No | Overclocking ? | No |
2.63 GHz 1x Cortex-A715 |
A-Core | 2.60 GHz 2x Cortex-A76 |
2.40 GHz 3x Cortex-A715 |
B-Core | 1.92 GHz 2x Cortex-A76 |
1.80 GHz 4x Cortex-A510 |
C-Core | 1.80 GHz 4x Cortex-A55 |
NPU AI performanceThe performance values of the processor's AI unit. The isolated NPU performance is specified here, the total AI performance (NPU+CPU+iGPU) can be higher. Processors with support for artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. |
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Qualcomm Snapdragon 7 Gen 3 | Characteristic | HiSilicon Kirin 980 |
Qualcomm AI engine | AI hardware | -- |
Hexagon | AI specifications | -- |
-- | NPU + CPU + iGPU | -- |
Integrated graphics (iGPU)The Qualcomm Snapdragon 7 Gen 3 or HiSilicon Kirin 980 has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
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Qualcomm Adreno 720 | GPU | ARM Mali-G76 MP10 |
0.44 GHz | GPU frequency | 0.72 GHz |
0.44 GHz | GPU (Turbo) | -- |
-- | GPU Generation | Bifrost 3 |
4 nm | Technology | 7 nm |
0 | Max. displays | 2 |
-- | Compute units | 10 |
-- | Shader | 160 |
No | Hardware Raytracing | No |
No | Frame Generation | No |
-- | Max. GPU Memory | 4 GB |
12.1 | DirectX Version | 12 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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Qualcomm Adreno 720 | GPU | ARM Mali-G76 MP10 |
Decode / Encode | Codec h265 / HEVC (8 bit) | Decode / Encode |
Decode / Encode | Codec h265 / HEVC (10 bit) | Decode / Encode |
Decode / Encode | Codec h264 | Decode / Encode |
Decode / Encode | Codec VP9 | Decode / Encode |
Decode / Encode | Codec VP8 | Decode / Encode |
No | Codec AV1 | No |
Decode | Codec AVC | Decode / Encode |
Decode | Codec VC-1 | Decode / Encode |
Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeThe Qualcomm Snapdragon 7 Gen 3 can use up to GB of memory in 2 memory channels. The maximum memory bandwidth is 51.2 GB/s. The HiSilicon Kirin 980 supports up to 8 GB of memory in 4 memory channels and achieves a memory bandwidth of up to --. |
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Qualcomm Snapdragon 7 Gen 3 | Characteristic | HiSilicon Kirin 980 |
LPDDR4X-4266, LPDDR5-6400 | Memory | LPDDR4X-2133 |
Max. Memory | 8 GB | |
2 (Dual Channel) | Memory channels | 4 (Quad Channel) |
51.2 GB/s | Max. Bandwidth | -- |
No | ECC | No |
-- | L2 Cache | -- |
-- | L3 Cache | 2.00 MB |
-- | PCIe version | -- |
-- | PCIe lanes | -- |
-- | PCIe Bandwidth | -- |
Thermal ManagementThe thermal design power (TDP for short) of the Qualcomm Snapdragon 7 Gen 3 is --, while the HiSilicon Kirin 980 has a TDP of 6 W. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. |
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Qualcomm Snapdragon 7 Gen 3 | Characteristic | HiSilicon Kirin 980 |
-- | TDP (PL1 / PBP) | 6 W |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe Qualcomm Snapdragon 7 Gen 3 is manufactured in 4 nm and has 0.00 MB cache. The HiSilicon Kirin 980 is manufactured in 7 nm and has a 2.00 MB cache. |
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Qualcomm Snapdragon 7 Gen 3 | Characteristic | HiSilicon Kirin 980 |
4 nm | Technology | 7 nm |
Chiplet | Chip design | Chiplet |
Armv9-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
-- | ISA extensions | -- |
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android, Windows 10/11 (ARM) | Operating systems | Android |
Q4/2023 | Release date | Q4/2018 |
-- | Release price | -- |
show more data | show more data | |
Qualcomm Snapdragon 7 Gen 3
8C 8T @ 2.63 GHz |
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HiSilicon Kirin 980
8C 8T @ 2.60 GHz |
Qualcomm Snapdragon 7 Gen 3
8C 8T @ 2.63 GHz |
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HiSilicon Kirin 980
8C 8T @ 2.60 GHz |
Qualcomm Snapdragon 7 Gen 3
8C 8T @ 2.63 GHz |
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HiSilicon Kirin 980
8C 8T @ 2.60 GHz |
Qualcomm Snapdragon 7 Gen 3
8C 8T @ 2.63 GHz |
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HiSilicon Kirin 980
8C 8T @ 2.60 GHz |
Qualcomm Snapdragon 7 Gen 3
Qualcomm Adreno 720 @ 0.44 GHz |
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HiSilicon Kirin 980
ARM Mali-G76 MP10 @ 0.72 GHz |
Qualcomm Snapdragon 7 Gen 3
8C 8T @ 2.63 GHz |
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HiSilicon Kirin 980
8C 8T @ 2.60 GHz |
Qualcomm Snapdragon 7 Gen 3
8C 8T @ 2.63 GHz |
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HiSilicon Kirin 980
8C 8T @ 2.60 GHz |
Devices using this processor |
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Qualcomm Snapdragon 7 Gen 3 | HiSilicon Kirin 980 |
Unknown | Huawei P30 Huawei P30 Pro Huawei Honor 20 Huawei Honor 20 Pro Huawei Mate 20 Huawei Mate 20 Pro Huawei Nova 5T |