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HiSilicon Kirin 980 | Qualcomm Snapdragon 888 | |
CPU comparisonIn this CPU comparison, we compare the HiSilicon Kirin 980 and the Qualcomm Snapdragon 888 and use benchmarks to check which processor is faster.
We compare the HiSilicon Kirin 980 8 core processor released in Q4/2018 with the Qualcomm Snapdragon 888 which has 8 CPU cores and was introduced in Q1/2021. |
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HiSilicon Kirin (29) | Family | Qualcomm Snapdragon (105) |
HiSilicon Kirin 980 (2) | CPU group | Qualcomm Snapdragon 888 (2) |
7 | Generation | 8 |
Cortex-A76 / Cortex-A55 | Architecture | Kryo 680 |
Smartphone / Tablet | Segment | Smartphone / Tablet |
-- | Predecessor | -- |
-- | Successor | Qualcomm Snapdragon 8 Gen 1 |
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CPU Cores and Base FrequencyThe HiSilicon Kirin 980 is a 8 core processor with a clock frequency of 2.60 GHz. The processor can compute 8 threads at the same time. The Qualcomm Snapdragon 888 clocks with 2.84 GHz, has 8 CPU cores and can calculate 8 threads in parallel. |
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HiSilicon Kirin 980 | Characteristic | Qualcomm Snapdragon 888 |
8 | Cores | 8 |
8 | Threads | 8 |
hybrid (Prime / big.LITTLE) | Core architecture | hybrid (Prime / big.LITTLE) |
No | Hyperthreading | No |
No | Overclocking ? | No |
2.60 GHz 2x Cortex-A76 |
A-Core | 2.84 GHz 1x Kryo 680 Prime |
1.92 GHz 2x Cortex-A76 |
B-Core | 2.42 GHz 3x Kryo 680 Gold |
1.80 GHz 4x Cortex-A55 |
C-Core | 1.80 GHz 4x Kryo 680 Silver |
NPU AI performanceThe performance values of the processor's AI unit. The isolated NPU performance is specified here, the total AI performance (NPU+CPU+iGPU) can be higher. Processors with support for artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. |
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HiSilicon Kirin 980 | Characteristic | Qualcomm Snapdragon 888 |
-- | AI hardware | Qualcomm AI engine |
-- | AI specifications | Hexagon 780 @ 26 TOPS |
-- | NPU + CPU + iGPU | -- |
Integrated graphics (iGPU)Graphics (iGPU) integrated into the processor not only enable image output without having to rely on a dedicated graphics solution, but can also efficiently accelerate video playback. |
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ARM Mali-G76 MP10 | GPU | Qualcomm Adreno 660 |
0.72 GHz | GPU frequency | 0.84 GHz |
-- | GPU (Turbo) | -- |
Bifrost 3 | GPU Generation | 6 |
7 nm | Technology | 5 nm |
2 | Max. displays | 0 |
10 | Compute units | -- |
160 | Shader | -- |
No | Hardware Raytracing | No |
No | Frame Generation | No |
4 GB | Max. GPU Memory | -- |
12 | DirectX Version | 12.1 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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ARM Mali-G76 MP10 | GPU | Qualcomm Adreno 660 |
Decode / Encode | Codec h265 / HEVC (8 bit) | Decode / Encode |
Decode / Encode | Codec h265 / HEVC (10 bit) | Decode / Encode |
Decode / Encode | Codec h264 | Decode / Encode |
Decode / Encode | Codec VP9 | Decode / Encode |
Decode / Encode | Codec VP8 | Decode / Encode |
No | Codec AV1 | No |
Decode / Encode | Codec AVC | Decode |
Decode / Encode | Codec VC-1 | Decode |
Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeUp to 8 GB of memory in a maximum of 4 memory channels is supported by the HiSilicon Kirin 980, while the Qualcomm Snapdragon 888 supports a maximum of 16 GB of memory with a maximum memory bandwidth of 51.2 GB/s enabled. |
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HiSilicon Kirin 980 | Characteristic | Qualcomm Snapdragon 888 |
LPDDR4X-2133 | Memory | LPDDR5-6400 |
8 GB | Max. Memory | 16 GB |
4 (Quad Channel) | Memory channels | 4 (Quad Channel) |
-- | Max. Bandwidth | 51.2 GB/s |
No | ECC | No |
-- | L2 Cache | 1.00 MB |
2.00 MB | L3 Cache | 8.00 MB |
-- | PCIe version | -- |
-- | PCIe lanes | -- |
-- | PCIe Bandwidth | -- |
Thermal ManagementThe HiSilicon Kirin 980 has a TDP of 6 W. The TDP of the Qualcomm Snapdragon 888 is --. System integrators use the TDP of the processor as a guide when dimensioning the cooling solution. |
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HiSilicon Kirin 980 | Characteristic | Qualcomm Snapdragon 888 |
6 W | TDP (PL1 / PBP) | -- |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe HiSilicon Kirin 980 has 2.00 MB cache and is manufactured in 7 nm. The cache of Qualcomm Snapdragon 888 is at 9.00 MB. The processor is manufactured in 5 nm. |
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HiSilicon Kirin 980 | Characteristic | Qualcomm Snapdragon 888 |
7 nm | Technology | 5 nm |
Chiplet | Chip design | Chiplet |
Armv8-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
-- | ISA extensions | -- |
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android | Operating systems | Android |
Q4/2018 | Release date | Q1/2021 |
-- | Release price | -- |
show more data | show more data | |
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HiSilicon Kirin 980
8C 8T @ 2.60 GHz |
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Qualcomm Snapdragon 888
8C 8T @ 2.84 GHz |
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HiSilicon Kirin 980
8C 8T @ 2.60 GHz |
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Qualcomm Snapdragon 888
8C 8T @ 2.84 GHz |
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HiSilicon Kirin 980
8C 8T @ 2.60 GHz |
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Qualcomm Snapdragon 888
8C 8T @ 2.84 GHz |
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HiSilicon Kirin 980
8C 8T @ 2.60 GHz |
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Qualcomm Snapdragon 888
8C 8T @ 2.84 GHz |
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HiSilicon Kirin 980
ARM Mali-G76 MP10 @ 0.72 GHz |
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Qualcomm Snapdragon 888
Qualcomm Adreno 660 @ 0.84 GHz |
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HiSilicon Kirin 980
8C 8T @ 2.60 GHz |
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Qualcomm Snapdragon 888
8C 8T @ 2.84 GHz |
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HiSilicon Kirin 980
8C 8T @ 2.60 GHz |
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Qualcomm Snapdragon 888
8C 8T @ 2.84 GHz |
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HiSilicon Kirin 980
8C 8T @ 2.60 GHz |
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Qualcomm Snapdragon 888
8C 8T @ 2.84 GHz |
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HiSilicon Kirin 980
8C 8T @ 2.60 GHz |
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Qualcomm Snapdragon 888
8C 8T @ 2.84 GHz |
Devices using this processor |
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HiSilicon Kirin 980 | Qualcomm Snapdragon 888 |
Huawei P30 Huawei P30 Pro Huawei Honor 20 Huawei Honor 20 Pro Huawei Mate 20 Huawei Mate 20 Pro Huawei Nova 5T |
ASUS Zenfone 8 mini |