Qualcomm Snapdragon 625 vs HiSilicon Kirin 970
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CPU comparison with benchmarks
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| Qualcomm Snapdragon 625 | HiSilicon Kirin 970 | |
CPU comparisonQualcomm Snapdragon 625 or HiSilicon Kirin 970 - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The Qualcomm Snapdragon 625 has 8 cores with 8 threads and clocks with a maximum frequency of 2.00 GHz. Up to 8 GB of memory is supported in 2 memory channels. The Qualcomm Snapdragon 625 was released in Q2/2016. The HiSilicon Kirin 970 has 8 cores with 8 threads and clocks with a maximum frequency of 2.40 GHz. The CPU supports up to 8 GB of memory in 4 memory channels. The HiSilicon Kirin 970 was released in Q3/2017. |
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| Qualcomm Snapdragon (102) | Family | HiSilicon Kirin (29) |
| Qualcomm Snapdragon 625/626 (2) | CPU group | HiSilicon Kirin 970 (1) |
| 3 | Generation | 6 |
| Cortex-A53 | Architecture | Cortex-A73 / Cortex-A53 |
| Mobile | Segment | Mobile |
| -- | Predecessor | -- |
| -- | Successor | -- |
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CPU Cores and Base FrequencyThe Qualcomm Snapdragon 625 has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the Qualcomm Snapdragon 625 is 2.00 GHz while the HiSilicon Kirin 970 has 8 CPU cores and 8 threads can calculate simultaneously. The clock frequency of the HiSilicon Kirin 970 is at 2.40 GHz. |
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| Qualcomm Snapdragon 625 | Characteristic | HiSilicon Kirin 970 |
| 8 | Cores | 8 |
| 8 | Threads | 8 |
| normal | Core architecture | hybrid (big.LITTLE) |
| No | Hyperthreading | No |
| No | Overclocking ? | No |
| 2.00 GHz 8x Cortex-A53 |
A-Core | 2.40 GHz 4x Cortex-A73 |
| -- | B-Core | 1.84 GHz 4x Cortex-A53 |
Artificial Intelligence and Machine LearningProcessors with the support of artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. Algorithms for ML improve their performance the more data they have collected via software. ML tasks can be processed up to 10,000 times faster than with a classic processor. |
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| Qualcomm Snapdragon 625 | Characteristic | HiSilicon Kirin 970 |
| Qualcomm AI engine | AI hardware | -- |
| Hexagon 546 | AI specifications | -- |
Internal GraphicsThe Qualcomm Snapdragon 625 or HiSilicon Kirin 970 has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
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| Qualcomm Adreno 506 | GPU | ARM Mali-G72 MP12 |
| 0.65 GHz | GPU frequency | 0.75 GHz |
| 0.65 GHz | GPU (Turbo) | -- |
| 5 | GPU Generation | Bifrost 2 |
| 14 nm | Technology | 16 nm |
| 0 | Max. displays | 1 |
| -- | Compute units | 12 |
| 96 | Shader | 192 |
| No | Hardware Raytracing | No |
| No | Frame Generation | No |
| -- | Max. GPU Memory | 2 GB |
| 11 | DirectX Version | 12 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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| Qualcomm Adreno 506 | GPU | ARM Mali-G72 MP12 |
| Decode | Codec h265 / HEVC (8 bit) | Decode / Encode |
| No | Codec h265 / HEVC (10 bit) | Decode / Encode |
| Decode / Encode | Codec h264 | Decode / Encode |
| No | Codec VP9 | Decode / Encode |
| No | Codec VP8 | Decode / Encode |
| No | Codec AV1 | No |
| No | Codec AVC | Decode / Encode |
| Decode | Codec VC-1 | Decode / Encode |
| Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeThe Qualcomm Snapdragon 625 can use up to 8 GB of memory in 2 memory channels. The maximum memory bandwidth is 14.9 GB/s. The HiSilicon Kirin 970 supports up to 8 GB of memory in 4 memory channels and achieves a memory bandwidth of up to --. |
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| Qualcomm Snapdragon 625 | Characteristic | HiSilicon Kirin 970 |
| LPDDR3-1866 | Memory | LPDDR4X-2133 |
| 8 GB | Max. Memory | 8 GB |
| 2 (Dual Channel) | Memory channels | 4 (Quad Channel) |
| 14.9 GB/s | Max. Bandwidth | -- |
| No | ECC | No |
| -- | L2 Cache | -- |
| -- | L3 Cache | 2.00 MB |
| -- | PCIe version | -- |
| -- | PCIe lanes | -- |
| -- | PCIe Bandwidth | -- |
Thermal ManagementThe thermal design power (TDP for short) of the Qualcomm Snapdragon 625 is --, while the HiSilicon Kirin 970 has a TDP of 9 W. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. |
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| Qualcomm Snapdragon 625 | Characteristic | HiSilicon Kirin 970 |
| -- | TDP (PL1 / PBP) | 9 W |
| -- | TDP (PL2) | -- |
| -- | TDP up | -- |
| -- | TDP down | -- |
| -- | Tjunction max. | -- |
Technical detailsThe Qualcomm Snapdragon 625 is manufactured in 14 nm and has 0.00 MB cache. The HiSilicon Kirin 970 is manufactured in 10 nm and has a 2.00 MB cache. |
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| Qualcomm Snapdragon 625 | Characteristic | HiSilicon Kirin 970 |
| 14 nm | Technology | 10 nm |
| Chiplet | Chip design | Chiplet |
| Armv8-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
| -- | ISA extensions | -- |
| -- | Socket | -- |
| None | Virtualization | None |
| No | AES-NI | No |
| Android | Operating systems | Android |
| Q2/2016 | Release date | Q3/2017 |
| -- | Release price | -- |
| show more data | show more data | |
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Rate these processors
Average performance in benchmarks
⌀ Single core performance in 1 CPU benchmarks
⌀ Multi core performance in 1 CPU benchmarks
Geekbench 5, 64bit (Single-Core)
Geekbench 5 is a cross plattform benchmark that heavily uses the systems memory. A fast memory will push the result a lot. The single-core test only uses one CPU core, the amount of cores or hyperthreading ability doesn't count.
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Qualcomm Snapdragon 625
8C 8T @ 2.00 GHz |
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HiSilicon Kirin 970
8C 8T @ 2.40 GHz |
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Geekbench 5, 64bit (Multi-Core)
Geekbench 5 is a cross plattform benchmark that heavily uses the systems memory. A fast memory will push the result a lot. The multi-core test involves all CPU cores and taks a big advantage of hyperthreading.
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Qualcomm Snapdragon 625
8C 8T @ 2.00 GHz |
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HiSilicon Kirin 970
8C 8T @ 2.40 GHz |
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iGPU - FP32 Performance (Single-precision GFLOPS)
The theoretical computing performance of the internal graphics unit of the processor with simple accuracy (32 bit) in GFLOPS. GFLOPS indicates how many billion floating point operations the iGPU can perform per second.
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Qualcomm Snapdragon 625
Qualcomm Adreno 506 @ 0.65 GHz |
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HiSilicon Kirin 970
ARM Mali-G72 MP12 @ 0.75 GHz |
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Geekbench 6 (Single-Core)
Geekbench 6 is a benchmark for modern computers, notebooks and smartphones. What is new is an optimized utilization of newer CPU architectures, e.g. based on the big.LITTLE concept and combining CPU cores of different sizes. The single-core benchmark only evaluates the performance of the fastest CPU core, the number of CPU cores in a processor is irrelevant here.
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Qualcomm Snapdragon 625
8C 8T @ 2.00 GHz |
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HiSilicon Kirin 970
8C 8T @ 2.40 GHz |
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Geekbench 6 (Multi-Core)
Geekbench 6 is a benchmark for modern computers, notebooks and smartphones. What is new is an optimized utilization of newer CPU architectures, e.g. based on the big.LITTLE concept and combining CPU cores of different sizes. The multi-core benchmark evaluates the performance of all of the processor's CPU cores. Virtual thread improvements such as AMD SMT or Intel's Hyper-Threading have a positive impact on the benchmark result.
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Qualcomm Snapdragon 625
8C 8T @ 2.00 GHz |
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HiSilicon Kirin 970
8C 8T @ 2.40 GHz |
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Estimated results for PassMark CPU Mark
Some of the CPUs listed below have been benchmarked by CPU-monkey. However the majority of CPUs have not been tested and the results have been estimated by a CPU-monkey’s secret proprietary formula. As such they do not accurately reflect the actual Passmark CPU mark values and are not endorsed by PassMark Software Pty Ltd.
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Qualcomm Snapdragon 625
8C 8T @ 2.00 GHz |
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HiSilicon Kirin 970
8C 8T @ 2.40 GHz |
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Devices using this processor |
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| Qualcomm Snapdragon 625 | HiSilicon Kirin 970 |
| Unknown | Huawei Honor 10 Huawei Note 10 Huawei Play Huawei Honor View 10 Huawei Mate 10 Pro Huawei P20 Huawei Nova 3 Huawei Nova 4 |
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