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HiSilicon Kirin 970 | Qualcomm Snapdragon 865 | |
CPU comparisonHiSilicon Kirin 970 or Qualcomm Snapdragon 865 - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The HiSilicon Kirin 970 has 8 cores with 8 threads and clocks with a maximum frequency of 2.40 GHz. Up to 8 GB of memory is supported in 4 memory channels. The HiSilicon Kirin 970 was released in Q3/2017. The Qualcomm Snapdragon 865 has 8 cores with 8 threads and clocks with a maximum frequency of 2.84 GHz. The CPU supports up to 16 GB of memory in 4 memory channels. The Qualcomm Snapdragon 865 was released in Q4/2019. |
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HiSilicon Kirin | Family | Qualcomm Snapdragon |
HiSilicon Kirin 970 | CPU group | Qualcomm Snapdragon 865/870 |
6 | Generation | 7 |
Cortex-A73 / Cortex-A53 | Architecture | Kryo 585 |
Mobile | Segment | Mobile |
-- | Predecessor | -- |
-- | Successor | -- |
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CPU Cores and Base FrequencyThe HiSilicon Kirin 970 has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the HiSilicon Kirin 970 is 2.40 GHz while the Qualcomm Snapdragon 865 has 8 CPU cores and 8 threads can calculate simultaneously. The clock frequency of the Qualcomm Snapdragon 865 is at 1.84 GHz. |
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8 | Cores | 8 |
8 | Threads | 8 |
hybrid (big.LITTLE) | Core architecture | hybrid (Prime / big.LITTLE) |
No | Hyperthreading | No |
No | Overclocking ? | No |
2.40 GHz 4x Cortex-A73 |
A-Core | 2.84 GHz 1x Kryo 585 Prime |
1.84 GHz 4x Cortex-A53 |
B-Core | 2.42 GHz 3x Kryo 585 Gold |
-- | C-Core | 1.80 GHz 4x Kryo 585 Silver |
Internal GraphicsThe HiSilicon Kirin 970 or Qualcomm Snapdragon 865 has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
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ARM Mali-G72 MP12 | GPU | Qualcomm Adreno 650 |
0.75 GHz | GPU frequency | 0.25 GHz |
GPU (Turbo) | 0.59 GHz | |
Bifrost 2 | GPU Generation | 6 |
16 nm | Technology | 7 nm |
1 | Max. displays | 1 |
12 | Execution units | 2 |
192 | Shader | 512 |
2 GB | Max. GPU Memory | |
12 | DirectX Version | 12.0 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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Decode / Encode | Codec h265 / HEVC (8 bit) | Decode / Encode |
Decode / Encode | Codec h265 / HEVC (10 bit) | Decode / Encode |
Decode / Encode | Codec h264 | Decode / Encode |
Decode / Encode | Codec VP9 | Decode / Encode |
Decode / Encode | Codec VP8 | Decode / Encode |
No | Codec AV1 | No |
Decode / Encode | Codec AVC | Decode |
Decode / Encode | Codec VC-1 | Decode |
Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeThe HiSilicon Kirin 970 can use up to 8 GB of memory in 4 memory channels. The maximum memory bandwidth is --. The Qualcomm Snapdragon 865 supports up to 16 GB of memory in 4 memory channels and achieves a memory bandwidth of up to 71.3 GB/s. |
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LPDDR4X-2133 | Memory | LPDDR4X-4266, LPDDR5-5500 |
8 GB | Max. Memory | 16 GB |
4 (Quad Channel) | Memory channels | 4 (Quad Channel) |
-- | Bandwidth | 71.3 GB/s |
No | ECC | No |
L2 Cache | 1.75 MB | |
2.00 MB | L3 Cache | 4.00 MB |
PCIe version | ||
PCIe lanes | ||
Thermal ManagementThe thermal design power (TDP for short) of the HiSilicon Kirin 970 is 9 W, while the Qualcomm Snapdragon 865 has a TDP of 10 W. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. |
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9 W | TDP (PL1 / PBP) | 10 W |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe HiSilicon Kirin 970 is manufactured in 10 nm and has 2.00 MB cache. The Qualcomm Snapdragon 865 is manufactured in 7 nm and has a 2.00 MB cache. |
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10 nm | Technology | 7 nm |
Chiplet | Chip design | Chiplet |
ARMv8-A64 (64 bit) | Instruction set (ISA) | ARMv8-A64 (64 bit) |
ISA extensions | ||
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android | Operating systems | Android |
Q3/2017 | Release date | Q4/2019 |
-- | Release price | -- |
show more data | show more data | |
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HiSilicon Kirin 970
8C 8T @ 2.40 GHz |
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Qualcomm Snapdragon 865
8C 8T @ 2.84 GHz |
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HiSilicon Kirin 970
8C 8T @ 2.40 GHz |
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Qualcomm Snapdragon 865
8C 8T @ 2.84 GHz |
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HiSilicon Kirin 970
8C 8T @ 2.40 GHz |
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Qualcomm Snapdragon 865
8C 8T @ 2.84 GHz |
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HiSilicon Kirin 970
8C 8T @ 2.40 GHz |
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Qualcomm Snapdragon 865
8C 8T @ 2.84 GHz |
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HiSilicon Kirin 970
ARM Mali-G72 MP12 @ 0.75 GHz |
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Qualcomm Snapdragon 865
Qualcomm Adreno 650 @ 0.59 GHz |
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HiSilicon Kirin 970
8C 8T @ 2.40 GHz |
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Qualcomm Snapdragon 865
8C 8T @ 2.84 GHz |
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HiSilicon Kirin 970
8C 8T @ 2.40 GHz |
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Qualcomm Snapdragon 865
8C 8T @ 2.84 GHz |
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HiSilicon Kirin 970
8C 8T @ 2.40 GHz |
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Qualcomm Snapdragon 865
8C 8T @ 2.84 GHz |
Devices using this processor |
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HiSilicon Kirin 970 | Qualcomm Snapdragon 865 |
Huawei Honor 10 Huawei Note 10 Huawei Play Huawei Honor View 10 Huawei Mate 10 Pro Huawei P20 Huawei Nova 3 Huawei Nova 4 |
OnePlus 8 OnePlus 8 Pro Samsung Galaxy S20 5G Samsung Galaxy S20+ 5G Samsung Galaxy S20 Ultra 5G |