MediaTek Dimensity 8050 | Qualcomm Snapdragon 7c+ Gen 3 | |
CPU comparisonMediaTek Dimensity 8050 or Qualcomm Snapdragon 7c+ Gen 3 - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The MediaTek Dimensity 8050 has 8 cores with 8 threads and clocks with a maximum frequency of 3.00 GHz. Up to 16 GB of memory is supported in 4 memory channels. The MediaTek Dimensity 8050 was released in Q2/2023. The Qualcomm Snapdragon 7c+ Gen 3 has 8 cores with 8 threads and clocks with a maximum frequency of 2.40 GHz. The CPU supports up to 16 GB of memory in 2 memory channels. The Qualcomm Snapdragon 7c+ Gen 3 was released in Q1/2022. |
||
Mediatek Dimensity (36) | Family | Qualcomm Snapdragon (102) |
MediaTek Dimensity 8000 (4) | CPU group | Qualcomm Snapdragon 7c Plus (1) |
3 | Generation | 3 |
Cortex-A78 / Cortex-A55 | Architecture | Cortex-A78 / Cortex-A55 |
Mobile | Segment | Mobile |
-- | Predecessor | Qualcomm Snapdragon 7c Gen 2 |
-- | Successor | -- |
|
||
CPU Cores and Base FrequencyThe MediaTek Dimensity 8050 is a 8 core processor with a clock frequency of 3.00 GHz. The Qualcomm Snapdragon 7c+ Gen 3 has 8 CPU cores with a clock frequency of 2.40 GHz. |
||
MediaTek Dimensity 8050 | Characteristic | Qualcomm Snapdragon 7c+ Gen 3 |
8 | Cores | 8 |
8 | Threads | 8 |
hybrid (Prime / big.LITTLE) | Core architecture | hybrid (big.LITTLE) |
No | Hyperthreading | No |
No | Overclocking ? | No |
3.00 GHz 1x Cortex-A78 |
A-Core | 2.40 GHz 4x Cortex-A78 |
2.60 GHz 4x Cortex-A78 |
B-Core | 1.50 GHz 4x Cortex-A55 |
2.00 GHz 4x Cortex-A55 |
C-Core | -- |
Internal GraphicsThe integrated graphics unit of a processor is not only responsible for the pure image output on the system, but can also significantly increase the efficiency of the system with the support of modern video codecs. |
||
ARM Mali-G77 MP9 | GPU | Qualcomm Adreno 642L |
0.85 GHz | GPU frequency | 0.70 GHz |
-- | GPU (Turbo) | -- |
Vallhall 1 | GPU Generation | 5 |
7 nm | Technology | 6 nm |
1 | Max. displays | 1 |
9 | Compute units | 4 |
144 | Shader | 384 |
No | Hardware Raytracing | No |
No | Frame Generation | No |
4 GB | Max. GPU Memory | 4 GB |
12 | DirectX Version | 12.0 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
||
ARM Mali-G77 MP9 | GPU | Qualcomm Adreno 642L |
Decode / Encode | Codec h265 / HEVC (8 bit) | Decode |
Decode / Encode | Codec h265 / HEVC (10 bit) | Decode |
Decode / Encode | Codec h264 | Decode / Encode |
Decode / Encode | Codec VP9 | Decode |
Decode / Encode | Codec VP8 | Decode |
Decode | Codec AV1 | No |
Decode / Encode | Codec AVC | Decode |
Decode / Encode | Codec VC-1 | Decode |
Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeThe MediaTek Dimensity 8050 supports a maximum of 16 GB of memory in 4 memory channels. The Qualcomm Snapdragon 7c+ Gen 3 can connect up to 16 GB of memory in 2 memory channels. |
||
MediaTek Dimensity 8050 | Characteristic | Qualcomm Snapdragon 7c+ Gen 3 |
LPDDR4X-4266 | Memory | LPDDR5-6400, LPDDR4X-4266 |
16 GB | Max. Memory | 16 GB |
4 (Quad Channel) | Memory channels | 2 (Dual Channel) |
34.1 GB/s | Max. Bandwidth | 51.2 GB/s |
No | ECC | No |
-- | L2 Cache | -- |
-- | L3 Cache | -- |
-- | PCIe version | -- |
-- | PCIe lanes | -- |
-- | PCIe Bandwidth | -- |
Thermal ManagementThe TDP (Thermal Design Power) of a processor specifies the required cooling solution. The MediaTek Dimensity 8050 has a TDP of --, that of the Qualcomm Snapdragon 7c+ Gen 3 is --. |
||
MediaTek Dimensity 8050 | Characteristic | Qualcomm Snapdragon 7c+ Gen 3 |
-- | TDP (PL1 / PBP) | -- |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe MediaTek Dimensity 8050 has a 0.00 MB cache, while the Qualcomm Snapdragon 7c+ Gen 3 cache has a total of 0.00 MB. |
||
MediaTek Dimensity 8050 | Characteristic | Qualcomm Snapdragon 7c+ Gen 3 |
5 nm | Technology | 6 nm |
Chiplet | Chip design | Chiplet |
Armv8-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
-- | ISA extensions | -- |
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android | Operating systems | Android |
Q2/2023 | Release date | Q1/2022 |
-- | Release price | -- |
show more data | show more data | |
MediaTek Dimensity 8050
8C 8T @ 3.00 GHz |
|||
Qualcomm Snapdragon 7c+ Gen 3
8C 8T @ 2.40 GHz |
MediaTek Dimensity 8050
8C 8T @ 3.00 GHz |
|||
Qualcomm Snapdragon 7c+ Gen 3
8C 8T @ 2.40 GHz |
MediaTek Dimensity 8050
8C 8T @ 3.00 GHz |
|||
Qualcomm Snapdragon 7c+ Gen 3
8C 8T @ 2.40 GHz |
MediaTek Dimensity 8050
8C 8T @ 3.00 GHz |
|||
Qualcomm Snapdragon 7c+ Gen 3
8C 8T @ 2.40 GHz |
MediaTek Dimensity 8050
ARM Mali-G77 MP9 @ 0.85 GHz |
|||
Qualcomm Snapdragon 7c+ Gen 3
Qualcomm Adreno 642L @ 0.70 GHz |
Devices using this processor |
|
MediaTek Dimensity 8050 | Qualcomm Snapdragon 7c+ Gen 3 |
Unknown | Unknown |