Intel Xeon W-3275M | HiSilicon Kirin 9000 | |
CPU comparisonIntel Xeon W-3275M or HiSilicon Kirin 9000 - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The Intel Xeon W-3275M has 28 cores with 56 threads and clocks with a maximum frequency of 4.60 GHz. Up to 2048 GB of memory is supported in 6 memory channels. The Intel Xeon W-3275M was released in Q2/2019. The HiSilicon Kirin 9000 has 8 cores with 8 threads and clocks with a maximum frequency of 3.13 GHz. The CPU supports up to GB of memory in 4 memory channels. The HiSilicon Kirin 9000 was released in Q4/2020. |
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Intel Xeon W (83) | Family | HiSilicon Kirin (29) |
Intel Xeon W-2200/3200 (17) | CPU group | HiSilicon Kirin 9000 (2) |
7 | Generation | 9 |
Cascade Lake W | Architecture | Cortex-A77 / Cortex-A55 |
Desktop / Server | Segment | Mobile |
-- | Predecessor | -- |
-- | Successor | -- |
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CPU Cores and Base FrequencyThe Intel Xeon W-3275M has 28 CPU cores and can calculate 56 threads in parallel. The clock frequency of the Intel Xeon W-3275M is 2.50 GHz (4.60 GHz) while the HiSilicon Kirin 9000 has 8 CPU cores and 8 threads can calculate simultaneously. The clock frequency of the HiSilicon Kirin 9000 is at 3.13 GHz. |
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Intel Xeon W-3275M | Characteristic | HiSilicon Kirin 9000 |
28 | Cores | 8 |
56 | Threads | 8 |
normal | Core architecture | hybrid (Prime / big.LITTLE) |
Yes | Hyperthreading | No |
No | Overclocking ? | No |
2.50 GHz (4.60 GHz) | A-Core | 3.13 GHz 1x Cortex-A77 |
-- | B-Core | 2.54 GHz 3x Cortex-A77 |
-- | C-Core | 2.05 GHz 4x Cortex-A55 |
Internal GraphicsThe Intel Xeon W-3275M or HiSilicon Kirin 9000 has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
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no iGPU | GPU | ARM Mali-G78 MP24 |
GPU frequency | 0.76 GHz | |
-- | GPU (Turbo) | -- |
-- | GPU Generation | Vallhall 2 |
Technology | 5 nm | |
Max. displays | 1 | |
-- | Compute units | 24 |
-- | Shader | 384 |
No | Hardware Raytracing | No |
No | Frame Generation | No |
-- | Max. GPU Memory | -- |
-- | DirectX Version | 12 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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no iGPU | GPU | ARM Mali-G78 MP24 |
No | Codec h265 / HEVC (8 bit) | Decode / Encode |
No | Codec h265 / HEVC (10 bit) | Decode / Encode |
No | Codec h264 | Decode / Encode |
No | Codec VP9 | Decode / Encode |
No | Codec VP8 | Decode / Encode |
No | Codec AV1 | Decode |
No | Codec AVC | Decode / Encode |
No | Codec VC-1 | Decode / Encode |
No | Codec JPEG | Decode / Encode |
Memory & PCIeThe Intel Xeon W-3275M can use up to 2048 GB of memory in 6 memory channels. The maximum memory bandwidth is 140.7 GB/s. The HiSilicon Kirin 9000 supports up to GB of memory in 4 memory channels and achieves a memory bandwidth of up to --. |
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Intel Xeon W-3275M | Characteristic | HiSilicon Kirin 9000 |
DDR4-2933 | Memory | LPDDR5-2750, LPDDR4X-2133 |
2048 GB | Max. Memory | |
6 (Hexa Channel) | Memory channels | 4 (Quad Channel) |
140.7 GB/s | Max. Bandwidth | -- |
Yes | ECC | No |
-- | L2 Cache | -- |
38.50 MB | L3 Cache | -- |
3.0 | PCIe version | -- |
64 | PCIe lanes | -- |
63.0 GB/s | PCIe Bandwidth | -- |
Thermal ManagementThe thermal design power (TDP for short) of the Intel Xeon W-3275M is 205 W, while the HiSilicon Kirin 9000 has a TDP of --. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. |
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Intel Xeon W-3275M | Characteristic | HiSilicon Kirin 9000 |
205 W | TDP (PL1 / PBP) | -- |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe Intel Xeon W-3275M is manufactured in 14 nm and has 38.50 MB cache. The HiSilicon Kirin 9000 is manufactured in 5 nm and has a 0.00 MB cache. |
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Intel Xeon W-3275M | Characteristic | HiSilicon Kirin 9000 |
14 nm | Technology | 5 nm |
Monolithic | Chip design | Chiplet |
x86-64 (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
SSE4.1, SSE4.2, AVX2, AVX-512 | ISA extensions | -- |
LGA 3647 | Socket | -- |
VT-x, VT-x EPT, VT-d | Virtualization | None |
Yes | AES-NI | No |
Windows 10, Linux | Operating systems | Android |
Q2/2019 | Release date | Q4/2020 |
7450 $ | Release price | -- |
show more data | show more data | |
Intel Xeon W-3275M
28C 56T @ 4.60 GHz |
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HiSilicon Kirin 9000
8C 8T @ 3.13 GHz |
Intel Xeon W-3275M
28C 56T @ 3.40 GHz |
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HiSilicon Kirin 9000
8C 8T @ 3.13 GHz |
Intel Xeon W-3275M
28C 56T @ 4.60 GHz |
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HiSilicon Kirin 9000
8C 8T @ 3.13 GHz |
Intel Xeon W-3275M
28C 56T @ 3.40 GHz |
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HiSilicon Kirin 9000
8C 8T @ 3.13 GHz |
Intel Xeon W-3275M
28C 56T @ 4.60 GHz |
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HiSilicon Kirin 9000
8C 8T @ 3.13 GHz |
Intel Xeon W-3275M
28C 56T @ 3.40 GHz |
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HiSilicon Kirin 9000
8C 8T @ 3.13 GHz |
Intel Xeon W-3275M
28C 56T @ 4.60 GHz |
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HiSilicon Kirin 9000
8C 8T @ 3.13 GHz |
Intel Xeon W-3275M
28C 56T @ 3.40 GHz |
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HiSilicon Kirin 9000
8C 8T @ 3.13 GHz |
Intel Xeon W-3275M
@ 0.00 GHz |
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HiSilicon Kirin 9000
ARM Mali-G78 MP24 @ 0.76 GHz |
Intel Xeon W-3275M
28C 56T @ 2.50 GHz |
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HiSilicon Kirin 9000
8C 8T @ 3.13 GHz |
Intel Xeon W-3275M
28C 56T @ 3.40 GHz |
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HiSilicon Kirin 9000
8C 8T @ 3.13 GHz |
Intel Xeon W-3275M
28C 56T @ 3.40 GHz |
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HiSilicon Kirin 9000
8C 8T @ 3.13 GHz |
Devices using this processor |
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Intel Xeon W-3275M | HiSilicon Kirin 9000 |
Apple Mac Pro (2019) | Unknown |