HiSilicon Kirin 990 4G vs MediaTek Dimensity 8200
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CPU comparison with benchmarks
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| HiSilicon Kirin 990 4G | MediaTek Dimensity 8200 | |
CPU comparisonHiSilicon Kirin 990 4G or MediaTek Dimensity 8200 - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The HiSilicon Kirin 990 4G has 8 cores with 8 threads and clocks with a maximum frequency of 2.86 GHz. Up to 8 GB of memory is supported in 4 memory channels. The HiSilicon Kirin 990 4G was released in Q3/2019. The MediaTek Dimensity 8200 has 8 cores with 8 threads and clocks with a maximum frequency of 3.10 GHz. The CPU supports up to GB of memory in 4 memory channels. The MediaTek Dimensity 8200 was released in Q4/2022. |
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| HiSilicon Kirin (29) | Family | Mediatek Dimensity (36) |
| HiSilicon Kirin 990 (3) | CPU group | MediaTek Dimensity 8000 4nm (1) |
| 8 | Generation | 3 |
| Cortex-A76 / Cortex-A55 | Architecture | Cortex-A78 / -A78 / -A55 |
| Mobile | Segment | Mobile |
| -- | Predecessor | -- |
| -- | Successor | -- |
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CPU Cores and Base FrequencyThe HiSilicon Kirin 990 4G has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the HiSilicon Kirin 990 4G is 2.86 GHz while the MediaTek Dimensity 8200 has 8 CPU cores and 8 threads can calculate simultaneously. The clock frequency of the MediaTek Dimensity 8200 is at 3.10 GHz. |
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| HiSilicon Kirin 990 4G | Characteristic | MediaTek Dimensity 8200 |
| 8 | Cores | 8 |
| 8 | Threads | 8 |
| hybrid (Prime / big.LITTLE) | Core architecture | hybrid (big.LITTLE) |
| No | Hyperthreading | No |
| No | Overclocking ? | No |
| 2.86 GHz 2x Cortex-A76 |
A-Core | 3.10 GHz 1x Cortex-A78 |
| 2.09 GHz 2x Cortex-A76 |
B-Core | 3.00 GHz 3x Cortex-A78 |
| 1.86 GHz 4x Cortex-A55 |
C-Core | 2.00 GHz 4x Cortex-A55 |
Artificial Intelligence and Machine LearningProcessors with the support of artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. Algorithms for ML improve their performance the more data they have collected via software. ML tasks can be processed up to 10,000 times faster than with a classic processor. |
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| HiSilicon Kirin 990 4G | Characteristic | MediaTek Dimensity 8200 |
| HUAWEI HiAI 2.0 | AI hardware | -- |
| Da Vinci Architecture. 1x Ascend Lite + 1x Ascend Tiny | AI specifications | -- |
Internal GraphicsThe HiSilicon Kirin 990 4G or MediaTek Dimensity 8200 has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
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| ARM Mali-G76 MP16 | GPU | ARM Mali-G610 MP6 |
| 0.60 GHz | GPU frequency | -- |
| -- | GPU (Turbo) | -- |
| Bifrost 3 | GPU Generation | Vallhall 3 |
| 7 nm | Technology | 4 nm |
| 2 | Max. displays | 1 |
| 16 | Compute units | 6 |
| 256 | Shader | -- |
| No | Hardware Raytracing | No |
| No | Frame Generation | No |
| 4 GB | Max. GPU Memory | -- |
| 12 | DirectX Version | 12 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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| ARM Mali-G76 MP16 | GPU | ARM Mali-G610 MP6 |
| Decode / Encode | Codec h265 / HEVC (8 bit) | Decode / Encode |
| Decode / Encode | Codec h265 / HEVC (10 bit) | Decode / Encode |
| Decode / Encode | Codec h264 | Decode / Encode |
| Decode / Encode | Codec VP9 | Decode / Encode |
| Decode / Encode | Codec VP8 | Decode / Encode |
| No | Codec AV1 | Decode |
| Decode / Encode | Codec AVC | Decode / Encode |
| Decode / Encode | Codec VC-1 | Decode / Encode |
| Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeThe HiSilicon Kirin 990 4G can use up to 8 GB of memory in 4 memory channels. The maximum memory bandwidth is --. The MediaTek Dimensity 8200 supports up to GB of memory in 4 memory channels and achieves a memory bandwidth of up to 51.2 GB/s. |
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| HiSilicon Kirin 990 4G | Characteristic | MediaTek Dimensity 8200 |
| LPDDR4X-2133 | Memory | LPDDR5-6400 |
| 8 GB | Max. Memory | |
| 4 (Quad Channel) | Memory channels | 4 (Quad Channel) |
| -- | Max. Bandwidth | 51.2 GB/s |
| No | ECC | No |
| -- | L2 Cache | -- |
| 2.00 MB | L3 Cache | -- |
| -- | PCIe version | -- |
| -- | PCIe lanes | -- |
| -- | PCIe Bandwidth | -- |
Thermal ManagementThe thermal design power (TDP for short) of the HiSilicon Kirin 990 4G is 6 W, while the MediaTek Dimensity 8200 has a TDP of --. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. |
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| HiSilicon Kirin 990 4G | Characteristic | MediaTek Dimensity 8200 |
| 6 W | TDP (PL1 / PBP) | -- |
| -- | TDP (PL2) | -- |
| -- | TDP up | -- |
| -- | TDP down | -- |
| -- | Tjunction max. | -- |
Technical detailsThe HiSilicon Kirin 990 4G is manufactured in 7 nm and has 2.00 MB cache. The MediaTek Dimensity 8200 is manufactured in 4 nm and has a 0.00 MB cache. |
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| HiSilicon Kirin 990 4G | Characteristic | MediaTek Dimensity 8200 |
| 7 nm | Technology | 4 nm |
| Chiplet | Chip design | Chiplet |
| Armv8-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
| -- | ISA extensions | -- |
| -- | Socket | -- |
| None | Virtualization | None |
| No | AES-NI | No |
| Android | Operating systems | Android |
| Q3/2019 | Release date | Q4/2022 |
| -- | Release price | -- |
| show more data | show more data | |
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Rate these processors
Average performance in benchmarks
⌀ Single core performance in 2 CPU benchmarks
⌀ Multi core performance in 2 CPU benchmarks
Geekbench 5, 64bit (Single-Core)
Geekbench 5 is a cross plattform benchmark that heavily uses the systems memory. A fast memory will push the result a lot. The single-core test only uses one CPU core, the amount of cores or hyperthreading ability doesn't count.
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HiSilicon Kirin 990 4G
8C 8T @ 2.86 GHz |
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MediaTek Dimensity 8200
8C 8T @ 3.10 GHz |
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Geekbench 5, 64bit (Multi-Core)
Geekbench 5 is a cross plattform benchmark that heavily uses the systems memory. A fast memory will push the result a lot. The multi-core test involves all CPU cores and taks a big advantage of hyperthreading.
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HiSilicon Kirin 990 4G
8C 8T @ 2.86 GHz |
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MediaTek Dimensity 8200
8C 8T @ 3.10 GHz |
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Geekbench 6 (Single-Core)
Geekbench 6 is a benchmark for modern computers, notebooks and smartphones. What is new is an optimized utilization of newer CPU architectures, e.g. based on the big.LITTLE concept and combining CPU cores of different sizes. The single-core benchmark only evaluates the performance of the fastest CPU core, the number of CPU cores in a processor is irrelevant here.
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HiSilicon Kirin 990 4G
8C 8T @ 2.86 GHz |
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MediaTek Dimensity 8200
8C 8T @ 3.10 GHz |
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Geekbench 6 (Multi-Core)
Geekbench 6 is a benchmark for modern computers, notebooks and smartphones. What is new is an optimized utilization of newer CPU architectures, e.g. based on the big.LITTLE concept and combining CPU cores of different sizes. The multi-core benchmark evaluates the performance of all of the processor's CPU cores. Virtual thread improvements such as AMD SMT or Intel's Hyper-Threading have a positive impact on the benchmark result.
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HiSilicon Kirin 990 4G
8C 8T @ 2.86 GHz |
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MediaTek Dimensity 8200
8C 8T @ 3.10 GHz |
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iGPU - FP32 Performance (Single-precision GFLOPS)
The theoretical computing performance of the internal graphics unit of the processor with simple accuracy (32 bit) in GFLOPS. GFLOPS indicates how many billion floating point operations the iGPU can perform per second.
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HiSilicon Kirin 990 4G
ARM Mali-G76 MP16 @ 0.60 GHz |
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MediaTek Dimensity 8200
ARM Mali-G610 MP6 @ 0.00 GHz |
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Devices using this processor |
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| HiSilicon Kirin 990 4G | MediaTek Dimensity 8200 |
| Huawei Mate 30 Pro | Unknown |
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