HiSilicon Kirin 930 vs Intel Xeon W-1250TE

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CPU comparison with benchmarks


HiSilicon Kirin 930 CPU1 vs CPU2 Intel Xeon W-1250TE
HiSilicon Kirin 930 Intel Xeon W-1250TE

CPU comparison

HiSilicon Kirin 930 or Intel Xeon W-1250TE - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.

The HiSilicon Kirin 930 has 8 cores with 8 threads and clocks with a maximum frequency of 2.00 GHz. Up to GB of memory is supported in 2 memory channels. The HiSilicon Kirin 930 was released in Q1/2015.

The Intel Xeon W-1250TE has 6 cores with 12 threads and clocks with a maximum frequency of 3.80 GHz. The CPU supports up to 128 GB of memory in 2 memory channels. The Intel Xeon W-1250TE was released in Q2/2020.
HiSilicon Kirin (29) Family Intel Xeon W (83)
HiSilicon Kirin 930 (2) CPU group Intel Xeon W-1200 (13)
3 Generation 10
Cortex-A53 / Cortex-A53 Architecture Comet Lake W
Mobile Segment Desktop / Server
-- Predecessor --
-- Successor --

CPU Cores and Base Frequency

The HiSilicon Kirin 930 has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the HiSilicon Kirin 930 is 2.00 GHz while the Intel Xeon W-1250TE has 6 CPU cores and 12 threads can calculate simultaneously. The clock frequency of the Intel Xeon W-1250TE is at 2.40 GHz (3.80 GHz).

HiSilicon Kirin 930 Characteristic Intel Xeon W-1250TE
8 Cores 6
8 Threads 12
hybrid (big.LITTLE) Core architecture normal
No Hyperthreading Yes
No Overclocking ? No
2.00 GHz
4x Cortex-A53
A-Core 2.40 GHz (3.80 GHz)
1.50 GHz
4x Cortex-A53
B-Core --

Artificial Intelligence and Machine Learning

Processors with the support of artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. Algorithms for ML improve their performance the more data they have collected via software. ML tasks can be processed up to 10,000 times faster than with a classic processor.

HiSilicon Kirin 930 Characteristic Intel Xeon W-1250TE
-- AI hardware --
-- AI specifications --

Internal Graphics

The HiSilicon Kirin 930 or Intel Xeon W-1250TE has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die.

ARM Mali-T628 MP4 GPU Intel UHD Graphics P630
0.60 GHz GPU frequency 0.35 GHz
0.60 GHz GPU (Turbo) 1.20 GHz
Midgard 2 GPU Generation 9.5
32nm Technology 14 nm
1 Max. displays 3
4 Compute units 24
64 Shader 192
No Hardware Raytracing No
No Frame Generation No
-- Max. GPU Memory 64 GB
11 DirectX Version 12

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.

ARM Mali-T628 MP4 GPU Intel UHD Graphics P630
No Codec h265 / HEVC (8 bit) Decode / Encode
No Codec h265 / HEVC (10 bit) Decode / Encode
Decode / Encode Codec h264 Decode / Encode
No Codec VP9 Decode / Encode
Decode / Encode Codec VP8 Decode / Encode
No Codec AV1 No
No Codec AVC Decode / Encode
No Codec VC-1 Decode
No Codec JPEG Decode / Encode

Memory & PCIe

The HiSilicon Kirin 930 can use up to GB of memory in 2 memory channels. The maximum memory bandwidth is --. The Intel Xeon W-1250TE supports up to 128 GB of memory in 2 memory channels and achieves a memory bandwidth of up to 42.7 GB/s.

HiSilicon Kirin 930 Characteristic Intel Xeon W-1250TE
LPDDR3-1600 Memory DDR4-2666
Max. Memory 128 GB
2 (Dual Channel) Memory channels 2 (Dual Channel)
-- Max. Bandwidth 42.7 GB/s
No ECC Yes
-- L2 Cache 12.00 MB
-- L3 Cache --
-- PCIe version 3.0
-- PCIe lanes 16
-- PCIe Bandwidth 15.8 GB/s

Thermal Management

The thermal design power (TDP for short) of the HiSilicon Kirin 930 is --, while the Intel Xeon W-1250TE has a TDP of 35 W. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently.

HiSilicon Kirin 930 Characteristic Intel Xeon W-1250TE
-- TDP (PL1 / PBP) 35 W
-- TDP (PL2) --
-- TDP up --
-- TDP down --
-- Tjunction max. 100 °C

Technical details

The HiSilicon Kirin 930 is manufactured in 28 nm and has 0.00 MB cache. The Intel Xeon W-1250TE is manufactured in 14 nm and has a 12.00 MB cache.

HiSilicon Kirin 930 Characteristic Intel Xeon W-1250TE
28 nm Technology 14 nm
Chiplet Chip design Monolithic
Armv8-A (64 bit) Instruction set (ISA) x86-64 (64 bit)
-- ISA extensions SSE4.1, SSE4.2, AVX2
-- Socket LGA 1200
None Virtualization VT-x, VT-x EPT, VT-d
No AES-NI Yes
Android Operating systems Windows 10, Linux
Q1/2015 Release date Q2/2020
-- Release price 260 $
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iGPU - FP32 Performance (Single-precision GFLOPS)

The theoretical computing performance of the internal graphics unit of the processor with simple accuracy (32 bit) in GFLOPS. GFLOPS indicates how many billion floating point operations the iGPU can perform per second.
HiSilicon Kirin 930 HiSilicon Kirin 930
ARM Mali-T628 MP4 @ 0.60 GHz
77 (17%)
Intel Xeon W-1250TE Intel Xeon W-1250TE
Intel UHD Graphics P630 @ 1.20 GHz
461 (100%)

Devices using this processor

HiSilicon Kirin 930 Intel Xeon W-1250TE
Unknown Unknown

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