HiSilicon Kirin 9000E | Qualcomm QCM6490 | |
CPU comparisonHiSilicon Kirin 9000E or Qualcomm QCM6490 - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The HiSilicon Kirin 9000E has 8 cores with 8 threads and clocks with a maximum frequency of 3.13 GHz. Up to GB of memory is supported in 4 memory channels. The HiSilicon Kirin 9000E was released in Q4/2020. The Qualcomm QCM6490 has 8 cores with 8 threads and clocks with a maximum frequency of 2.71 GHz. The CPU supports up to GB of memory in 2 memory channels. The Qualcomm QCM6490 was released in Q4/2021. |
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HiSilicon Kirin (29) | Family | Qualcomm Snapdragon (102) |
HiSilicon Kirin 9000 (2) | CPU group | Qualcomm QCM6490 (1) |
9 | Generation | 9 |
Cortex-A77 / Cortex-A55 | Architecture | Kryo 670 |
Mobile | Segment | Mobile |
-- | Predecessor | -- |
-- | Successor | -- |
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CPU Cores and Base FrequencyThe HiSilicon Kirin 9000E has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the HiSilicon Kirin 9000E is 3.13 GHz while the Qualcomm QCM6490 has 8 CPU cores and 8 threads can calculate simultaneously. The clock frequency of the Qualcomm QCM6490 is at 2.71 GHz. |
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HiSilicon Kirin 9000E | Characteristic | Qualcomm QCM6490 |
8 | Cores | 8 |
8 | Threads | 8 |
hybrid (Prime / big.LITTLE) | Core architecture | hybrid (Prime / big.LITTLE) |
No | Hyperthreading | No |
No | Overclocking ? | No |
3.13 GHz 1x Cortex-A77 |
A-Core | 2.71 GHz 1x Cortex-A78 |
2.54 GHz 3x Cortex-A77 |
B-Core | 2.40 GHz 3x Cortex-A78 |
2.05 GHz 4x Cortex-A55 |
C-Core | 1.96 GHz 0x Cortex-A55 |
Artificial Intelligence and Machine LearningProcessors with the support of artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. Algorithms for ML improve their performance the more data they have collected via software. ML tasks can be processed up to 10,000 times faster than with a classic processor. |
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HiSilicon Kirin 9000E | Characteristic | Qualcomm QCM6490 |
-- | AI hardware | Qualcomm AI engine |
-- | AI specifications | -- |
Internal GraphicsThe HiSilicon Kirin 9000E or Qualcomm QCM6490 has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
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ARM Mali-G78 MP22 | GPU | Qualcomm Adreno 643L |
0.76 GHz | GPU frequency | 0.81 GHz |
-- | GPU (Turbo) | 0.81 GHz |
Vallhall 2 | GPU Generation | -- |
5 nm | Technology | 6 nm |
1 | Max. displays | 1 |
22 | Compute units | -- |
352 | Shader | 768 |
No | Hardware Raytracing | No |
No | Frame Generation | No |
-- | Max. GPU Memory | -- |
12 | DirectX Version | 12.0 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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ARM Mali-G78 MP22 | GPU | Qualcomm Adreno 643L |
Decode / Encode | Codec h265 / HEVC (8 bit) | Decode / Encode |
Decode / Encode | Codec h265 / HEVC (10 bit) | Decode / Encode |
Decode / Encode | Codec h264 | Decode / Encode |
Decode / Encode | Codec VP9 | Decode / Encode |
Decode / Encode | Codec VP8 | Decode / Encode |
Decode | Codec AV1 | No |
Decode / Encode | Codec AVC | Decode |
Decode / Encode | Codec VC-1 | Decode |
Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeThe HiSilicon Kirin 9000E can use up to GB of memory in 4 memory channels. The maximum memory bandwidth is --. The Qualcomm QCM6490 supports up to GB of memory in 2 memory channels and achieves a memory bandwidth of up to 44.0 GB/s. |
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HiSilicon Kirin 9000E | Characteristic | Qualcomm QCM6490 |
LPDDR5-2750, LPDDR4X-2133 | Memory | LPDDR5-6400, LPDDR4X-4266 |
Max. Memory | ||
4 (Quad Channel) | Memory channels | 2 (Dual Channel) |
-- | Max. Bandwidth | 44.0 GB/s |
No | ECC | No |
-- | L2 Cache | -- |
-- | L3 Cache | -- |
-- | PCIe version | -- |
-- | PCIe lanes | -- |
-- | PCIe Bandwidth | -- |
Thermal ManagementThe thermal design power (TDP for short) of the HiSilicon Kirin 9000E is --, while the Qualcomm QCM6490 has a TDP of --. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. |
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HiSilicon Kirin 9000E | Characteristic | Qualcomm QCM6490 |
-- | TDP (PL1 / PBP) | -- |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe HiSilicon Kirin 9000E is manufactured in 5 nm and has 0.00 MB cache. The Qualcomm QCM6490 is manufactured in 6 nm and has a 0.00 MB cache. |
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HiSilicon Kirin 9000E | Characteristic | Qualcomm QCM6490 |
5 nm | Technology | 6 nm |
Chiplet | Chip design | Chiplet |
Armv8-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
-- | ISA extensions | -- |
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android | Operating systems | Android |
Q4/2020 | Release date | Q4/2021 |
-- | Release price | -- |
show more data | show more data | |
HiSilicon Kirin 9000E
8C 8T @ 3.13 GHz |
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Qualcomm QCM6490
8C 8T @ 2.71 GHz |
HiSilicon Kirin 9000E
8C 8T @ 3.13 GHz |
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Qualcomm QCM6490
8C 8T @ 2.71 GHz |
HiSilicon Kirin 9000E
ARM Mali-G78 MP22 @ 0.76 GHz |
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Qualcomm QCM6490
Qualcomm Adreno 643L @ 0.81 GHz |
HiSilicon Kirin 9000E
8C 8T @ 3.13 GHz |
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Qualcomm QCM6490
8C 8T @ 2.71 GHz |
HiSilicon Kirin 9000E
8C 8T @ 3.13 GHz |
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Qualcomm QCM6490
8C 8T @ 2.71 GHz |
HiSilicon Kirin 9000E
8C 8T @ 3.13 GHz |
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Qualcomm QCM6490
8C 8T @ 2.71 GHz |
HiSilicon Kirin 9000E
8C 8T @ 3.13 GHz |
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Qualcomm QCM6490
8C 8T @ 2.71 GHz |
Devices using this processor |
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HiSilicon Kirin 9000E | Qualcomm QCM6490 |
Unknown | Fairphone 5 |