HiSilicon Kirin 9000E | Apple A10 Fusion | |
CPU comparisonHiSilicon Kirin 9000E or Apple A10 Fusion - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The HiSilicon Kirin 9000E has 8 cores with 8 threads and clocks with a maximum frequency of 3.13 GHz. Up to GB of memory is supported in 4 memory channels. The HiSilicon Kirin 9000E was released in Q4/2020. The Apple A10 Fusion has 4 cores with 4 threads and clocks with a maximum frequency of 2.34 GHz. The CPU supports up to 3 GB of memory in 1 memory channels. The Apple A10 Fusion was released in Q3/2016. |
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HiSilicon Kirin (29) | Family | Apple A series (22) |
HiSilicon Kirin 9000 (2) | CPU group | Apple A10/A10X (2) |
9 | Generation | 10 |
Cortex-A77 / Cortex-A55 | Architecture | A10 |
Mobile | Segment | Mobile |
-- | Predecessor | Apple A9 |
-- | Successor | Apple A11 Bionic |
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CPU Cores and Base FrequencyThe HiSilicon Kirin 9000E has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the HiSilicon Kirin 9000E is 3.13 GHz while the Apple A10 Fusion has 4 CPU cores and 4 threads can calculate simultaneously. The clock frequency of the Apple A10 Fusion is at 2.34 GHz. |
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HiSilicon Kirin 9000E | Characteristic | Apple A10 Fusion |
8 | Cores | 4 |
8 | Threads | 4 |
hybrid (Prime / big.LITTLE) | Core architecture | hybrid (big.LITTLE) |
No | Hyperthreading | No |
No | Overclocking ? | No |
3.13 GHz 1x Cortex-A77 |
A-Core | 2.34 GHz 2x Hurricane |
2.54 GHz 3x Cortex-A77 |
B-Core | 1.09 GHz 2x Zephyr |
2.05 GHz 4x Cortex-A55 |
C-Core | -- |
Internal GraphicsThe HiSilicon Kirin 9000E or Apple A10 Fusion has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
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ARM Mali-G78 MP22 | GPU | Apple A10 |
0.76 GHz | GPU frequency | 0.90 GHz |
-- | GPU (Turbo) | -- |
Vallhall 2 | GPU Generation | 7 |
5 nm | Technology | 16 nm |
1 | Max. displays | 1 |
22 | Compute units | 24 |
352 | Shader | 192 |
No | Hardware Raytracing | No |
No | Frame Generation | No |
-- | Max. GPU Memory | 4 GB |
12 | DirectX Version | -- |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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ARM Mali-G78 MP22 | GPU | Apple A10 |
Decode / Encode | Codec h265 / HEVC (8 bit) | Decode |
Decode / Encode | Codec h265 / HEVC (10 bit) | Decode |
Decode / Encode | Codec h264 | Decode / Encode |
Decode / Encode | Codec VP9 | Decode |
Decode / Encode | Codec VP8 | Decode |
Decode | Codec AV1 | No |
Decode / Encode | Codec AVC | Decode |
Decode / Encode | Codec VC-1 | Decode |
Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeThe HiSilicon Kirin 9000E can use up to GB of memory in 4 memory channels. The maximum memory bandwidth is --. The Apple A10 Fusion supports up to 3 GB of memory in 1 memory channels and achieves a memory bandwidth of up to 25.6 GB/s. |
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HiSilicon Kirin 9000E | Characteristic | Apple A10 Fusion |
LPDDR5-2750, LPDDR4X-2133 | Memory | LPDDR4-3200 |
Max. Memory | 3 GB | |
4 (Quad Channel) | Memory channels | 1 (Single Channel) |
-- | Max. Bandwidth | 25.6 GB/s |
No | ECC | No |
-- | L2 Cache | 3.00 MB |
-- | L3 Cache | 4.00 MB |
-- | PCIe version | -- |
-- | PCIe lanes | -- |
-- | PCIe Bandwidth | -- |
Thermal ManagementThe thermal design power (TDP for short) of the HiSilicon Kirin 9000E is --, while the Apple A10 Fusion has a TDP of 5 W. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. |
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HiSilicon Kirin 9000E | Characteristic | Apple A10 Fusion |
-- | TDP (PL1 / PBP) | 5 W |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe HiSilicon Kirin 9000E is manufactured in 5 nm and has 0.00 MB cache. The Apple A10 Fusion is manufactured in 10 nm and has a 7.00 MB cache. |
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HiSilicon Kirin 9000E | Characteristic | Apple A10 Fusion |
5 nm | Technology | 10 nm |
Chiplet | Chip design | Chiplet |
Armv8-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
-- | ISA extensions | -- |
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android | Operating systems | iOS |
Q4/2020 | Release date | Q3/2016 |
-- | Release price | -- |
show more data | show more data | |
HiSilicon Kirin 9000E
8C 8T @ 3.13 GHz |
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Apple A10 Fusion
4C 4T @ 2.34 GHz |
HiSilicon Kirin 9000E
8C 8T @ 3.13 GHz |
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Apple A10 Fusion
4C 4T @ 2.34 GHz |
HiSilicon Kirin 9000E
ARM Mali-G78 MP22 @ 0.76 GHz |
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Apple A10 Fusion
Apple A10 @ 0.90 GHz |
HiSilicon Kirin 9000E
8C 8T @ 3.13 GHz |
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Apple A10 Fusion
4C 4T @ 2.34 GHz |
HiSilicon Kirin 9000E
8C 8T @ 3.13 GHz |
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Apple A10 Fusion
4C 4T @ 2.34 GHz |
HiSilicon Kirin 9000E
8C 8T @ 3.13 GHz |
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Apple A10 Fusion
4C 4T @ 2.34 GHz |
Devices using this processor |
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HiSilicon Kirin 9000E | Apple A10 Fusion |
Unknown | Apple iPhone 7 Apple iPhone 7 Plus Apple iPad (6. Gen) |