HiSilicon Kirin 650 vs Intel Core i3-4112E

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CPU comparison with benchmarks


HiSilicon Kirin 650 CPU1 vs CPU2 Intel Core i3-4112E
HiSilicon Kirin 650 Intel Core i3-4112E

CPU comparison

HiSilicon Kirin 650 or Intel Core i3-4112E - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.

The HiSilicon Kirin 650 has 8 cores with 8 threads and clocks with a maximum frequency of 2.00 GHz. Up to GB of memory is supported in 2 memory channels. The HiSilicon Kirin 650 was released in Q2/2016.

The Intel Core i3-4112E has 2 cores with 4 threads and clocks with a maximum frequency of 1.80 GHz. The CPU supports up to 32 GB of memory in 2 memory channels. The Intel Core i3-4112E was released in Q2/2014.
HiSilicon Kirin (29) Family Intel Core i3 (205)
HiSilicon Kirin 650 (4) CPU group Intel Core i 4000 (64)
4 Generation 4
Cortex-A53 / Cortex-A53 Architecture Haswell S
Mobile Segment Desktop / Server
-- Predecessor --
-- Successor --

CPU Cores and Base Frequency

The HiSilicon Kirin 650 has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the HiSilicon Kirin 650 is 2.00 GHz while the Intel Core i3-4112E has 2 CPU cores and 4 threads can calculate simultaneously. The clock frequency of the Intel Core i3-4112E is at 1.80 GHz.

HiSilicon Kirin 650 Characteristic Intel Core i3-4112E
8 Cores 2
8 Threads 4
hybrid (big.LITTLE) Core architecture normal
No Hyperthreading Yes
No Overclocking ? No
2.00 GHz
4x Cortex-A53
A-Core 1.80 GHz
1.70 GHz
4x Cortex-A53
B-Core --

NPU AI performance

The performance values of the processor's AI unit. The isolated NPU performance is specified here, the total AI performance (NPU+CPU+iGPU) can be higher. Processors with support for artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors.

HiSilicon Kirin 650 Characteristic Intel Core i3-4112E
-- AI hardware --
-- AI specifications --
-- NPU + CPU + iGPU --

Integrated graphics (iGPU)

The HiSilicon Kirin 650 or Intel Core i3-4112E has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die.

ARM Mali-T830 MP2 GPU Intel HD Graphics 4600
0.90 GHz GPU frequency 0.40 GHz
-- GPU (Turbo) 0.90 GHz
Midgard 4 GPU Generation 7.5
28nm Technology 22 nm
2 Max. displays 3
2 Compute units 20
32 Shader 160
No Hardware Raytracing No
No Frame Generation No
-- Max. GPU Memory 2 GB
11 DirectX Version 11.1

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.

ARM Mali-T830 MP2 GPU Intel HD Graphics 4600
Decode / Encode Codec h265 / HEVC (8 bit) No
Decode Codec h265 / HEVC (10 bit) No
Decode / Encode Codec h264 Decode / Encode
No Codec VP9 No
Decode / Encode Codec VP8 No
No Codec AV1 No
No Codec AVC Decode / Encode
No Codec VC-1 Decode
Decode / Encode Codec JPEG Decode

Memory & PCIe

The HiSilicon Kirin 650 can use up to GB of memory in 2 memory channels. The maximum memory bandwidth is --. The Intel Core i3-4112E supports up to 32 GB of memory in 2 memory channels and achieves a memory bandwidth of up to 25.6 GB/s.

HiSilicon Kirin 650 Characteristic Intel Core i3-4112E
LPDDR3-933 Memory DDR3-1600
Max. Memory 32 GB
2 (Dual Channel) Memory channels 2 (Dual Channel)
-- Max. Bandwidth 25.6 GB/s
No ECC Yes
-- L2 Cache --
-- L3 Cache 3.00 MB
-- PCIe version 3.0
-- PCIe lanes 16
-- PCIe Bandwidth 15.8 GB/s

Thermal Management

The thermal design power (TDP for short) of the HiSilicon Kirin 650 is --, while the Intel Core i3-4112E has a TDP of 25 W. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently.

HiSilicon Kirin 650 Characteristic Intel Core i3-4112E
-- TDP (PL1 / PBP) 25 W
-- TDP (PL2) --
-- TDP up --
-- TDP down --
-- Tjunction max. 100 °C

Technical details

The HiSilicon Kirin 650 is manufactured in 16 nm and has 0.00 MB cache. The Intel Core i3-4112E is manufactured in 22 nm and has a 3.00 MB cache.

HiSilicon Kirin 650 Characteristic Intel Core i3-4112E
16 nm Technology 22 nm
Chiplet Chip design Monolithic
Armv8-A (64 bit) Instruction set (ISA) x86-64 (64 bit)
-- ISA extensions SSE4.1, SSE4.2, AVX2
-- Socket BGA 1364
None Virtualization VT-x, VT-x EPT, VT-d
No AES-NI Yes
Android Operating systems Windows 10, Linux
Q2/2016 Release date Q2/2014
-- Release price 225 $
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iGPU - FP32 Performance (Single-precision GFLOPS)

The theoretical computing performance of the internal graphics unit of the processor with simple accuracy (32 bit) in GFLOPS. GFLOPS indicates how many billion floating point operations the iGPU can perform per second.
HiSilicon Kirin 650 HiSilicon Kirin 650
ARM Mali-T830 MP2 @ 0.90 GHz
61 (21%)
Intel Core i3-4112E Intel Core i3-4112E
Intel HD Graphics 4600 @ 0.90 GHz
288 (100%)

Geekbench 5, 64bit (Single-Core)

Geekbench 5 is a cross plattform benchmark that heavily uses the systems memory. A fast memory will push the result a lot. The single-core test only uses one CPU core, the amount of cores or hyperthreading ability doesn't count.
HiSilicon Kirin 650 HiSilicon Kirin 650
8C 8T @ 2.00 GHz
163 (100%)
Intel Core i3-4112E Intel Core i3-4112E
2C 4T @ 1.80 GHz
0 (0%)

Geekbench 5, 64bit (Multi-Core)

Geekbench 5 is a cross plattform benchmark that heavily uses the systems memory. A fast memory will push the result a lot. The multi-core test involves all CPU cores and taks a big advantage of hyperthreading.
HiSilicon Kirin 650 HiSilicon Kirin 650
8C 8T @ 2.00 GHz
763 (100%)
Intel Core i3-4112E Intel Core i3-4112E
2C 4T @ 1.80 GHz
0 (0%)

Devices using this processor

HiSilicon Kirin 650 Intel Core i3-4112E
Unknown Unknown

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