AMD Ryzen Embedded V3C18I vs HiSilicon Kirin 650

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CPU comparison with benchmarks


AMD Ryzen Embedded V3C18I CPU1 vs CPU2 HiSilicon Kirin 650
AMD Ryzen Embedded V3C18I HiSilicon Kirin 650

CPU comparison

AMD Ryzen Embedded V3C18I or HiSilicon Kirin 650 - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.

The AMD Ryzen Embedded V3C18I has 8 cores with 16 threads and clocks with a maximum frequency of 3.80 GHz. Up to 64 GB of memory is supported in 2 memory channels. The AMD Ryzen Embedded V3C18I was released in Q3/2022.

The HiSilicon Kirin 650 has 8 cores with 8 threads and clocks with a maximum frequency of 2.00 GHz. The CPU supports up to GB of memory in 2 memory channels. The HiSilicon Kirin 650 was released in Q2/2016.
AMD Ryzen Embedded V (16) Family HiSilicon Kirin (29)
AMD Ryzen Embedded V3000 (5) CPU group HiSilicon Kirin 650 (4)
3 Generation 4
Rembrandt (Zen 3+) Architecture Cortex-A53 / Cortex-A53
Desktop / Server Segment Mobile
AMD Ryzen Embedded V2718 Predecessor --
-- Successor --

CPU Cores and Base Frequency

The AMD Ryzen Embedded V3C18I is a 8 core processor with a clock frequency of 1.90 GHz (3.80 GHz). The HiSilicon Kirin 650 has 8 CPU cores with a clock frequency of 2.00 GHz.

AMD Ryzen Embedded V3C18I Characteristic HiSilicon Kirin 650
8 Cores 8
16 Threads 8
normal Core architecture hybrid (big.LITTLE)
Yes Hyperthreading No
No Overclocking ? No
1.90 GHz (3.80 GHz)
8x Zen 3
A-Core 2.00 GHz
4x Cortex-A53
-- B-Core 1.70 GHz
4x Cortex-A53

NPU AI performance

The performance values of the processor's AI unit. The isolated NPU performance is specified here, the total AI performance (NPU+CPU+iGPU) can be higher. Processors with support for artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors.

AMD Ryzen Embedded V3C18I Characteristic HiSilicon Kirin 650
-- AI hardware --
-- AI specifications --
-- NPU + CPU + iGPU --

Integrated graphics (iGPU)

The integrated graphics unit of a processor is not only responsible for the pure image output on the system, but can also significantly increase the efficiency of the system with the support of modern video codecs.

no iGPU GPU ARM Mali-T830 MP2
GPU frequency 0.90 GHz
-- GPU (Turbo) --
-- GPU Generation Midgard 4
Technology 28nm
Max. displays 2
-- Compute units 2
-- Shader 32
No Hardware Raytracing No
No Frame Generation No
-- Max. GPU Memory --
-- DirectX Version 11

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.

no iGPU GPU ARM Mali-T830 MP2
No Codec h265 / HEVC (8 bit) Decode / Encode
No Codec h265 / HEVC (10 bit) Decode
No Codec h264 Decode / Encode
No Codec VP9 No
No Codec VP8 Decode / Encode
No Codec AV1 No
No Codec AVC No
No Codec VC-1 No
No Codec JPEG Decode / Encode

Memory & PCIe

The AMD Ryzen Embedded V3C18I supports a maximum of 64 GB of memory in 2 memory channels. The HiSilicon Kirin 650 can connect up to GB of memory in 2 memory channels.

AMD Ryzen Embedded V3C18I Characteristic HiSilicon Kirin 650
DDR5-4800 Memory LPDDR3-933
64 GB Max. Memory
2 (Dual Channel) Memory channels 2 (Dual Channel)
76.8 GB/s Max. Bandwidth --
Yes ECC No
4.00 MB L2 Cache --
16.00 MB L3 Cache --
4.0 PCIe version --
20 PCIe lanes --
39.4 GB/s PCIe Bandwidth --

Thermal Management

The TDP (Thermal Design Power) of a processor specifies the required cooling solution. The AMD Ryzen Embedded V3C18I has a TDP of 15 W, that of the HiSilicon Kirin 650 is --.

AMD Ryzen Embedded V3C18I Characteristic HiSilicon Kirin 650
15 W TDP (PL1 / PBP) --
-- TDP (PL2) --
25 W TDP up --
10 W TDP down --
105 °C Tjunction max. --

Technical details

The AMD Ryzen Embedded V3C18I has a 20.00 MB cache, while the HiSilicon Kirin 650 cache has a total of 0.00 MB.

AMD Ryzen Embedded V3C18I Characteristic HiSilicon Kirin 650
6 nm Technology 16 nm
Chiplet Chip design Chiplet
x86-64 (64 bit) Instruction set (ISA) Armv8-A (64 bit)
SSE4a, SSE4.1, SSE4.2, AVX2, FMA3 ISA extensions --
FP7r2 Socket --
AMD-V, SVM Virtualization None
Yes AES-NI No
Windows 10, Windows 11, Linux Operating systems Android
Q3/2022 Release date Q2/2016
-- Release price --
show more data show more data


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Geekbench 5, 64bit (Single-Core)

Geekbench 5 is a cross plattform benchmark that heavily uses the systems memory. A fast memory will push the result a lot. The single-core test only uses one CPU core, the amount of cores or hyperthreading ability doesn't count.
AMD Ryzen Embedded V3C18I AMD Ryzen Embedded V3C18I
8C 16T @ 3.80 GHz
0 (0%)
HiSilicon Kirin 650 HiSilicon Kirin 650
8C 8T @ 2.00 GHz
163 (100%)

Geekbench 5, 64bit (Multi-Core)

Geekbench 5 is a cross plattform benchmark that heavily uses the systems memory. A fast memory will push the result a lot. The multi-core test involves all CPU cores and taks a big advantage of hyperthreading.
AMD Ryzen Embedded V3C18I AMD Ryzen Embedded V3C18I
8C 16T @ 2.70 GHz
0 (0%)
HiSilicon Kirin 650 HiSilicon Kirin 650
8C 8T @ 2.00 GHz
763 (100%)

iGPU - FP32 Performance (Single-precision GFLOPS)

The theoretical computing performance of the internal graphics unit of the processor with simple accuracy (32 bit) in GFLOPS. GFLOPS indicates how many billion floating point operations the iGPU can perform per second.
AMD Ryzen Embedded V3C18I AMD Ryzen Embedded V3C18I
@ 0.00 GHz
0 (0%)
HiSilicon Kirin 650 HiSilicon Kirin 650
ARM Mali-T830 MP2 @ 0.90 GHz
61 (100%)

Devices using this processor

AMD Ryzen Embedded V3C18I HiSilicon Kirin 650
Unknown Unknown

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