AMD EPYC Embedded 3251 | MediaTek Dimensity 900 | |
CPU comparisonAMD EPYC Embedded 3251 or MediaTek Dimensity 900 - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The AMD EPYC Embedded 3251 has 8 cores with 16 threads and clocks with a maximum frequency of 3.10 GHz. Up to GB of memory is supported in 2 memory channels. The AMD EPYC Embedded 3251 was released in Q1/2018. The MediaTek Dimensity 900 has 8 cores with 8 threads and clocks with a maximum frequency of 2.40 GHz. The CPU supports up to 16 GB of memory in 4 memory channels. The MediaTek Dimensity 900 was released in Q2/2021. |
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AMD EPYC (129) | Family | Mediatek Dimensity (36) |
AMD EPYC Embedded 3000 (7) | CPU group | MediaTek Dimensity 900 (3) |
1 | Generation | 2 |
Snowy Owl (Zen) | Architecture | Cortex-A78 / Cortex-A55 |
Desktop / Server | Segment | Mobile |
-- | Predecessor | -- |
-- | Successor | -- |
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CPU Cores and Base FrequencyThe AMD EPYC Embedded 3251 has 8 CPU cores and can calculate 16 threads in parallel. The clock frequency of the AMD EPYC Embedded 3251 is 2.50 GHz (3.10 GHz) while the MediaTek Dimensity 900 has 8 CPU cores and 8 threads can calculate simultaneously. The clock frequency of the MediaTek Dimensity 900 is at 2.40 GHz. |
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AMD EPYC Embedded 3251 | Characteristic | MediaTek Dimensity 900 |
8 | Cores | 8 |
16 | Threads | 8 |
normal | Core architecture | hybrid (big.LITTLE) |
Yes | Hyperthreading | No |
Yes | Overclocking ? | No |
2.50 GHz (3.10 GHz) | A-Core | 2.40 GHz 2x Cortex-A78 |
-- | B-Core | 2.00 GHz 6x Cortex-A55 |
Internal GraphicsThe AMD EPYC Embedded 3251 or MediaTek Dimensity 900 has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
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no iGPU | GPU | ARM Mali-G68 MP4 |
GPU frequency | 0.85 GHz | |
-- | GPU (Turbo) | -- |
-- | GPU Generation | Vallhall 2 |
Technology | 6 nm | |
Max. displays | 1 | |
-- | Compute units | 4 |
-- | Shader | 64 |
No | Hardware Raytracing | No |
No | Frame Generation | No |
-- | Max. GPU Memory | -- |
-- | DirectX Version | 12 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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no iGPU | GPU | ARM Mali-G68 MP4 |
No | Codec h265 / HEVC (8 bit) | Decode / Encode |
No | Codec h265 / HEVC (10 bit) | Decode / Encode |
No | Codec h264 | Decode / Encode |
No | Codec VP9 | Decode / Encode |
No | Codec VP8 | Decode / Encode |
No | Codec AV1 | Decode |
No | Codec AVC | Decode / Encode |
No | Codec VC-1 | Decode / Encode |
No | Codec JPEG | Decode / Encode |
Memory & PCIeThe AMD EPYC Embedded 3251 can use up to GB of memory in 2 memory channels. The maximum memory bandwidth is 42.7 GB/s. The MediaTek Dimensity 900 supports up to 16 GB of memory in 4 memory channels and achieves a memory bandwidth of up to 44.0 GB/s. |
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AMD EPYC Embedded 3251 | Characteristic | MediaTek Dimensity 900 |
DDR4-2666 | Memory | LPDDR5-5500, LPDDR4X-4266 |
Max. Memory | 16 GB | |
2 (Dual Channel) | Memory channels | 4 (Quad Channel) |
42.7 GB/s | Max. Bandwidth | 44.0 GB/s |
Yes | ECC | No |
4.00 MB | L2 Cache | -- |
16.00 MB | L3 Cache | 2.00 MB |
3.0 | PCIe version | -- |
32 | PCIe lanes | -- |
31.5 GB/s | PCIe Bandwidth | -- |
Thermal ManagementThe thermal design power (TDP for short) of the AMD EPYC Embedded 3251 is 55 W, while the MediaTek Dimensity 900 has a TDP of 10 W. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. |
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AMD EPYC Embedded 3251 | Characteristic | MediaTek Dimensity 900 |
55 W | TDP (PL1 / PBP) | 10 W |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
105 °C | Tjunction max. | -- |
Technical detailsThe AMD EPYC Embedded 3251 is manufactured in 14 nm and has 20.00 MB cache. The MediaTek Dimensity 900 is manufactured in 6 nm and has a 2.00 MB cache. |
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AMD EPYC Embedded 3251 | Characteristic | MediaTek Dimensity 900 |
14 nm | Technology | 6 nm |
Chiplet | Chip design | Chiplet |
x86-64 (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
SSE4a, SSE4.1, SSE4.2, AVX2, FMA3 | ISA extensions | -- |
SP4r2 | Socket | -- |
AMD-V, SVM | Virtualization | None |
Yes | AES-NI | No |
Windows 10, Linux | Operating systems | Android |
Q1/2018 | Release date | Q2/2021 |
-- | Release price | -- |
show more data | show more data | |
AMD EPYC Embedded 3251
8C 16T @ 2.50 GHz |
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MediaTek Dimensity 900
8C 8T @ 2.40 GHz |
AMD EPYC Embedded 3251
8C 16T @ 3.10 GHz |
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MediaTek Dimensity 900
8C 8T @ 2.40 GHz |
AMD EPYC Embedded 3251
8C 16T @ 2.50 GHz |
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MediaTek Dimensity 900
8C 8T @ 2.40 GHz |
AMD EPYC Embedded 3251
8C 16T @ 3.10 GHz |
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MediaTek Dimensity 900
8C 8T @ 2.40 GHz |
AMD EPYC Embedded 3251
8C 16T @ 2.50 GHz |
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MediaTek Dimensity 900
8C 8T @ 2.40 GHz |
AMD EPYC Embedded 3251
8C 16T @ 2.50 GHz |
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MediaTek Dimensity 900
8C 8T @ 2.40 GHz |
Devices using this processor |
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AMD EPYC Embedded 3251 | MediaTek Dimensity 900 |
Unknown | Unknown |