MediaTek Dimensity 7030

MediaTek Dimensity 7030
Benchmarks & Specs

Last updated:
The MediaTek Dimensity 7030 provides a very reliable base. This processor was specifically developed for versatile mobile applications. It scores particularly well with its modern 6 nm manufacturing technology. This contributes significantly to excellent energy efficiency. The battery life of mobile devices benefits noticeably from this.

Inside the chip, a well-coordinated combination works. There are powerful Cortex-A78 cores for demanding tasks. These are joined by energy-efficient Cortex-A55 cores for everyday use. This balanced architecture always ensures smooth operation. It thus masters everyday applications confidently and without delays.

Even with several apps open in parallel, operation remains pleasantly responsive. The powerful, integrated ARM Mali-G610 MP3 graphics unit provides the visual representation. It delivers sufficient graphics performance for multimedia content. Even occasional gaming of current titles is easily possible with it.

MediaTek has created a chip here that offers broad usability. It represents a good choice for various mobile devices. We see solid overall performance for everyday use in this processor. It will remain relevant in the years to come.
  • Efficient 6 nm manufacturing
  • Balanced Cortex-A78 / Cortex-A55 architecture
  • Integrated ARM Mali-G610 MP3 graphics

Performance Overview
Average performance across multiple benchmarks

Single-core performance
Rank 75 / 176
In segment Smartphone / Tablet
Multi-core performance
Rank 80 / 177
In segment Smartphone / Tablet
Geekbench 6 Single-Core

Geekbench 6 Single-Core
Single-core performance

Qualcomm Snapdragon 6s Gen 3
8C / 8T · 2.30 GHz
935
MediaTek Dimensity 7020
8C / 8T · 2.20 GHz
914
MediaTek Dimensity 7030
8C / 8T · 2.50 GHz
895
Qualcomm Snapdragon 695 5G
8C / 8T · 2.20 GHz
894
Qualcomm Snapdragon 480 Plus 5G
8C / 8T · 2.20 GHz
892
Geekbench 6 Multi-Core

Geekbench 6 Multi-Core
Multi-core performance

MediaTek Dimensity 800
8C / 8T · 2.00 GHz
2,280
MediaTek Dimensity 900
8C / 8T · 2.40 GHz
2,279
MediaTek Dimensity 7030
8C / 8T · 2.50 GHz
2,219
Samsung Exynos 1330
8C / 8T · 2.40 GHz
2,118
Samsung Exynos 9820
8C / 8T · 2.70 GHz
2,075
Geekbench 5, 64bit Single-Core

Geekbench 5, 64bit Single-Core
Single-core performance

MediaTek Dimensity 7050
8C / 8T · 2.60 GHz
799
MediaTek Dimensity 1000
8C / 8T · 2.60 GHz
796
MediaTek Dimensity 7030
8C / 8T · 2.50 GHz
793
Qualcomm Snapdragon 7s Gen 2
8C / 8T · 2.40 GHz
789
Qualcomm Snapdragon 7 Gen 1
6C / 6T · 2.40 GHz
788
Geekbench 5, 64bit Multi-Core

Geekbench 5, 64bit Multi-Core
Multi-core performance

UNISOC T770
UNISOC T770 100 %
8C / 8T · 2.50 GHz
2,207
MediaTek Dimensity 7050
8C / 8T · 2.60 GHz
2,205
MediaTek Dimensity 7030
8C / 8T · 2.50 GHz
2,203
MediaTek Kompanio 828
8C / 8T · 2.60 GHz
2,198
MediaTek Dimensity 800
8C / 8T · 2.00 GHz
2,176
AnTuTu 9 Benchmark

AnTuTu 9 Benchmark
Multi-core performance

Qualcomm Snapdragon 7 Gen 1
6C / 6T · 2.40 GHz
536,422 pts
Samsung Exynos 1380
8C / 8T · 2.40 GHz
513,496 pts
MediaTek Dimensity 7030
8C / 8T · 2.50 GHz
512,674 pts
Qualcomm Snapdragon 778G
8C / 8T · 2.40 GHz
502,035 pts
Apple A10X Fusion
6C / 6T · 2.36 GHz
473,856 pts

More benchmarks

At a glance

PropertyValue
FamilyMediatek Dimensity (38)
CPU groupMediaTek Dimensity 7000 (3)
ArchitectureCortex-A78 / Cortex-A55
Technology6 nm
SegmentSmartphone / Tablet
Socket
Generation1
Predecessor
Successor

CPU Cores and Base Frequency

PropertyValue
CPU Cores / Threads8 / 8
Hyperthreading / SMT
Core architecturehybrid (big.LITTLE)
Core Cluster 1: 2x Cortex-A78
2.50 GHz
Core Cluster 2: 6x Cortex-A55
2.00 GHz
L2-Cache
L3-Cache
OverclockingNo

Integrated graphics (iGPU)

PropertyValue
GPU nameARM Mali-G610 MP3
GPU frequency
CUs / Shader3 /
Raytracing
Max. displays1
Max. GPU Memory
Technology4 nm
Release dateQ2/2021

NPU AI performance

PropertyValue
AI hardwareMediatek APU
AI specificationsMediaTek APU 550
NPU + CPU + iGPU

Memory & PCIe

Memory typeMemory bandwidth
LPDDR5
LPDDR4X
--
--
PropertyValue
Max. Memory
Memory channels0
ECC
PCIe
PCIe Bandwidth

Thermal Management

PropertyValue
TDP
TDP (PL2)
TDP up
TDP down
T. junction max.

Technical details

PropertyValue
Chip designChiplet
AES-NI
Operating systemsAndroid
Instruction setArmv8-A (64 bit)
ISA extensions
Release dateQ3/2023
Release price
DocumentsTechnical data sheet
MediaTek Dimensity 7030
MediaTek Dimensity 7030
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