Name: | Qualcomm Snapdragon 6s Gen 3 |
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Family: | Qualcomm Snapdragon (104) |
CPU group: | Qualcomm Snapdragon 6s Gen 3 (1) |
Architecture: | Kryo Gold / Kryo Silver |
Technology: | 6 nm |
Segment: | Smartphone / Tablet |
Generation: | 3 |
Predecessor: | -- |
Successor: | -- |
CPU Cores / Threads: | 8 / 8 |
---|---|
Core architecture: | hybrid (big.LITTLE) |
A-Core: | 2x Cortex-A78 |
B-Core: | 6x Cortex-A55 |
Hyperthreading / SMT: | No |
---|---|
Overclocking: | No |
A-Core Frequency: | 0.70 GHz (2.30 GHz) |
B-Core Frequency: | 0.70 GHz (2.00 GHz) |
AI hardware: | Qualcomm AI engine |
---|---|
AI specifications: | Hexagon NPU |
NPU + CPU + iGPU: | -- |
GPU name: | Qualcomm Adreno 619 (6nm) |
---|---|
GPU frequency: | 0.95 GHz |
GPU (Turbo): | No turbo |
Compute units: | -- |
Shader: | -- |
Hardware Raytracing: | No |
Release date: | Q1/2022 |
Max. displays: | 0 |
---|---|
Generation: | -- |
Direct X: | 12.1 |
Technology: | 6 nm |
Max. GPU Memory: | -- |
Frame Generation: | No |
h265 / HEVC (8 bit): | Decode |
---|---|
h265 / HEVC (10 bit): | Decode |
h264: | Decode / Encode |
VP8: | Decode |
VP9: | Decode |
AV1: | No |
---|---|
AVC: | Decode |
VC-1: | Decode |
JPEG: | Decode / Encode |
Memory & PCIeThe Qualcomm Snapdragon 6s Gen 3 supports up to 12 GB memory in up to 4 (Quad Channel) memory channels. This results in a maximum memory bandwidth of 17.1 GB/s. |
|
Memory type: | Memory bandwidth: |
---|---|
LPDDR4X-4266 | 17.1 GB/s |
Max. Memory: | 12 GB |
Memory channels: | 4 (Quad Channel) |
ECC: | No |
PCIe: | |
PCIe Bandwidth: | -- |
Thermal ManagementWith the TDP, the processor manufacturer specifies the cooling solution required for the processor. The Qualcomm Snapdragon 6s Gen 3 has a TDP of . |
|
---|---|
TDP (PL1 / PBP): | |
TDP (PL2): | -- |
TDP up: | -- |
TDP down: | -- |
Tjunction max.: | -- |
Technology: | 6 nm |
---|---|
Chip design: | Chiplet |
Socket: | -- |
L2-Cache: | -- |
L3-Cache: | -- |
AES-NI: | No |
Operating systems: | Android, Windows 10 (ARM) |
Virtualization: | None |
---|---|
Instruction set (ISA): | Armv8-A (64 bit) |
ISA extensions: | -- |
Release date: | Q2/2024 |
Release price: | -- |
Part Number: | SM6375-AC. SM6370 |
Documents: | Technical data sheet |
Qualcomm Snapdragon 855
8C 8T @ 2.84 GHz |
|||
Apple A10X Fusion
6C 6T @ 2.36 GHz |
|||
MediaTek Dimensity 7050
8C 8T @ 2.60 GHz |
|||
Qualcomm Snapdragon 6s Gen 3
8C 8T @ 2.30 GHz |
|||
MediaTek Dimensity 7020
8C 8T @ 2.20 GHz |
|||
MediaTek Dimensity 7030
8C 8T @ 2.50 GHz |
|||
Qualcomm Snapdragon 695 5G
8C 8T @ 2.20 GHz |
Apple A10X Fusion
6C 6T @ 2.36 GHz |
|||
Apple A12 Bionic
6C 6T @ 2.49 GHz |
|||
MediaTek Dimensity 7020
8C 8T @ 2.20 GHz |
|||
Qualcomm Snapdragon 6s Gen 3
8C 8T @ 0.70 GHz |
|||
MediaTek Dimensity 800
8C 8T @ 2.00 GHz |
|||
MediaTek Dimensity 900
8C 8T @ 2.40 GHz |
|||
MediaTek Dimensity 7030
8C 8T @ 2.50 GHz |
MediaTek MT8188J
8C 8T @ 2.20 GHz |
|||
Qualcomm Snapdragon 768G
8C 8T @ 2.80 GHz |
|||
MediaTek Dimensity 900
8C 8T @ 2.40 GHz |
|||
Qualcomm Snapdragon 6s Gen 3
8C 8T @ 2.30 GHz |
|||
MediaTek Dimensity 7020
8C 8T @ 2.20 GHz |
|||
HiSilicon Kirin 985 5G
8C 8T @ 2.58 GHz |
|||
HiSilicon Kirin 980
8C 8T @ 2.60 GHz |
MediaTek Dimensity 800
8C 8T @ 2.00 GHz |
|||
Samsung Exynos 1330
8C 8T @ 2.40 GHz |
|||
Qualcomm Snapdragon 845
8C 8T @ 2.80 GHz |
|||
Qualcomm Snapdragon 6s Gen 3
8C 8T @ 0.70 GHz |
|||
MediaTek Dimensity 1050
8C 8T @ 2.50 GHz |
|||
MediaTek Dimensity 900
8C 8T @ 2.40 GHz |
|||
Samsung Exynos 9825
8C 8T @ 2.73 GHz |