Qualcomm Snapdragon 860 | MediaTek Dimensity 7030 | |
CPU comparisonIn this CPU comparison, we compare the Qualcomm Snapdragon 860 and the MediaTek Dimensity 7030 and use benchmarks to check which processor is faster.
We compare the Qualcomm Snapdragon 860 8 core processor released in Q1/2021 with the MediaTek Dimensity 7030 which has 8 CPU cores and was introduced in Q3/2023. |
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Qualcomm Snapdragon (102) | Family | Mediatek Dimensity (36) |
Qualcomm Snapdragon 855/860 (3) | CPU group | MediaTek Dimensity 7000 (3) |
6 | Generation | 1 |
Kryo 485 | Architecture | Cortex-A78 / Cortex-A55 |
Mobile | Segment | Mobile |
Qualcomm Snapdragon 855 Plus | Predecessor | -- |
-- | Successor | -- |
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CPU Cores and Base FrequencyThe Qualcomm Snapdragon 860 is a 8 core processor with a clock frequency of 2.96 GHz. The processor can compute 8 threads at the same time. The MediaTek Dimensity 7030 clocks with 2.50 GHz, has 8 CPU cores and can calculate 8 threads in parallel. |
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Qualcomm Snapdragon 860 | Characteristic | MediaTek Dimensity 7030 |
8 | Cores | 8 |
8 | Threads | 8 |
hybrid (Prime / big.LITTLE) | Core architecture | hybrid (big.LITTLE) |
No | Hyperthreading | No |
No | Overclocking ? | No |
2.96 GHz 1x Kryo 485 Prime |
A-Core | 2.50 GHz 2x Cortex-A78 |
2.42 GHz 3x Kryo 485 Gold |
B-Core | 2.00 GHz 6x Cortex-A55 |
1.80 GHz 4x Kryo 485 Silver |
C-Core | -- |
Artificial Intelligence and Machine LearningProcessors with the support of artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. Algorithms for ML improve their performance the more data they have collected via software. ML tasks can be processed up to 10,000 times faster than with a classic processor. |
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Qualcomm Snapdragon 860 | Characteristic | MediaTek Dimensity 7030 |
Qualcomm AI engine | AI hardware | Mediatek APU |
Hexagon 690 @ 7 TOPS | AI specifications | MediaTek APU 550 |
Internal GraphicsGraphics (iGPU) integrated into the processor not only enable image output without having to rely on a dedicated graphics solution, but can also efficiently accelerate video playback. |
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Qualcomm Adreno 640 | GPU | ARM Mali-G610 MP3 |
0.25 GHz | GPU frequency | -- |
0.68 GHz | GPU (Turbo) | -- |
5 | GPU Generation | Vallhall 3 |
7 nm | Technology | 4 nm |
1 | Max. displays | 1 |
4 | Compute units | 3 |
384 | Shader | -- |
No | Hardware Raytracing | No |
No | Frame Generation | No |
4 GB | Max. GPU Memory | -- |
12.0 | DirectX Version | 12 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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Qualcomm Adreno 640 | GPU | ARM Mali-G610 MP3 |
Decode / Encode | Codec h265 / HEVC (8 bit) | Decode / Encode |
Decode / Encode | Codec h265 / HEVC (10 bit) | Decode / Encode |
Decode / Encode | Codec h264 | Decode / Encode |
Decode / Encode | Codec VP9 | Decode / Encode |
Decode / Encode | Codec VP8 | Decode / Encode |
No | Codec AV1 | Decode |
No | Codec AVC | Decode / Encode |
No | Codec VC-1 | Decode / Encode |
No | Codec JPEG | Decode / Encode |
Memory & PCIeUp to 16 GB of memory in a maximum of 4 memory channels is supported by the Qualcomm Snapdragon 860, while the MediaTek Dimensity 7030 supports a maximum of GB of memory with a maximum memory bandwidth of -- enabled. |
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Qualcomm Snapdragon 860 | Characteristic | MediaTek Dimensity 7030 |
LPDDR4X-4266 | Memory | LPDDR5, LPDDR4X |
16 GB | Max. Memory | |
4 (Quad Channel) | Memory channels | 0 |
34.1 GB/s | Max. Bandwidth | -- |
No | ECC | No |
2.00 MB | L2 Cache | -- |
3.00 MB | L3 Cache | -- |
-- | PCIe version | -- |
-- | PCIe lanes | -- |
-- | PCIe Bandwidth | -- |
Thermal ManagementThe Qualcomm Snapdragon 860 has a TDP of --. The TDP of the MediaTek Dimensity 7030 is --. System integrators use the TDP of the processor as a guide when dimensioning the cooling solution. |
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Qualcomm Snapdragon 860 | Characteristic | MediaTek Dimensity 7030 |
-- | TDP (PL1 / PBP) | -- |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe Qualcomm Snapdragon 860 has 5.00 MB cache and is manufactured in 7 nm. The cache of MediaTek Dimensity 7030 is at 0.00 MB. The processor is manufactured in 6 nm. |
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Qualcomm Snapdragon 860 | Characteristic | MediaTek Dimensity 7030 |
7 nm | Technology | 6 nm |
Chiplet | Chip design | Chiplet |
Armv8-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
-- | ISA extensions | -- |
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android | Operating systems | Android |
Q1/2021 | Release date | Q3/2023 |
-- | Release price | -- |
show more data | show more data | |
Qualcomm Snapdragon 860
8C 8T @ 2.96 GHz |
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MediaTek Dimensity 7030
8C 8T @ 2.50 GHz |
Qualcomm Snapdragon 860
8C 8T @ 2.96 GHz |
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MediaTek Dimensity 7030
8C 8T @ 2.50 GHz |
Qualcomm Snapdragon 860
8C 8T @ 2.96 GHz |
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MediaTek Dimensity 7030
8C 8T @ 2.50 GHz |
Qualcomm Snapdragon 860
8C 8T @ 2.96 GHz |
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MediaTek Dimensity 7030
8C 8T @ 2.50 GHz |
Qualcomm Snapdragon 860
8C 8T @ 2.96 GHz |
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MediaTek Dimensity 7030
8C 8T @ 2.50 GHz |
Qualcomm Snapdragon 860
Qualcomm Adreno 640 @ 0.68 GHz |
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MediaTek Dimensity 7030
ARM Mali-G610 MP3 @ 0.00 GHz |
Qualcomm Snapdragon 860
8C 8T @ 2.96 GHz |
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MediaTek Dimensity 7030
8C 8T @ 2.50 GHz |
Qualcomm Snapdragon 860
8C 8T @ 2.96 GHz |
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MediaTek Dimensity 7030
8C 8T @ 2.50 GHz |
Devices using this processor |
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Qualcomm Snapdragon 860 | MediaTek Dimensity 7030 |
Unknown | Unknown |