Qualcomm Snapdragon 435 | HiSilicon Kirin 650 | |
CPU comparisonIn this CPU comparison, we compare the Qualcomm Snapdragon 435 and the HiSilicon Kirin 650 and use benchmarks to check which processor is faster.
We compare the Qualcomm Snapdragon 435 8 core processor released in Q4/2016 with the HiSilicon Kirin 650 which has 8 CPU cores and was introduced in Q2/2016. |
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Qualcomm Snapdragon (103) | Family | HiSilicon Kirin (29) |
Qualcomm Snapdragon 430 (2) | CPU group | HiSilicon Kirin 650 (4) |
3 | Generation | 4 |
Cortex-A53 | Architecture | Cortex-A53 / Cortex-A53 |
Mobile | Segment | Mobile |
-- | Predecessor | -- |
-- | Successor | -- |
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CPU Cores and Base FrequencyThe Qualcomm Snapdragon 435 is a 8 core processor with a clock frequency of 1.40 GHz. The processor can compute 8 threads at the same time. The HiSilicon Kirin 650 clocks with 2.00 GHz, has 8 CPU cores and can calculate 8 threads in parallel. |
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Qualcomm Snapdragon 435 | Characteristic | HiSilicon Kirin 650 |
8 | Cores | 8 |
8 | Threads | 8 |
normal | Core architecture | hybrid (big.LITTLE) |
No | Hyperthreading | No |
No | Overclocking ? | No |
1.40 GHz 8x Cortex-A53 |
A-Core | 2.00 GHz 4x Cortex-A53 |
-- | B-Core | 1.70 GHz 4x Cortex-A53 |
NPU AI performanceThe performance values of the processor's AI unit. The isolated NPU performance is specified here, the total AI performance (NPU+CPU+iGPU) can be higher. Processors with support for artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. |
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Qualcomm Snapdragon 435 | Characteristic | HiSilicon Kirin 650 |
Qualcomm AI engine | AI hardware | -- |
Hexagon 536 | AI specifications | -- |
-- | NPU + CPU + iGPU | -- |
Integrated graphics (iGPU)Graphics (iGPU) integrated into the processor not only enable image output without having to rely on a dedicated graphics solution, but can also efficiently accelerate video playback. |
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Qualcomm Adreno 505 | GPU | ARM Mali-T830 MP2 |
0.45 GHz | GPU frequency | 0.90 GHz |
0.45 GHz | GPU (Turbo) | -- |
5 | GPU Generation | Midgard 4 |
28 nm | Technology | 28nm |
0 | Max. displays | 2 |
-- | Compute units | 2 |
48 | Shader | 32 |
No | Hardware Raytracing | No |
No | Frame Generation | No |
-- | Max. GPU Memory | -- |
11 | DirectX Version | 11 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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Qualcomm Adreno 505 | GPU | ARM Mali-T830 MP2 |
Decode | Codec h265 / HEVC (8 bit) | Decode / Encode |
No | Codec h265 / HEVC (10 bit) | Decode |
Decode / Encode | Codec h264 | Decode / Encode |
No | Codec VP9 | No |
No | Codec VP8 | Decode / Encode |
No | Codec AV1 | No |
No | Codec AVC | No |
Decode | Codec VC-1 | No |
Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeUp to 6 GB of memory in a maximum of 2 memory channels is supported by the Qualcomm Snapdragon 435, while the HiSilicon Kirin 650 supports a maximum of GB of memory with a maximum memory bandwidth of -- enabled. |
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Qualcomm Snapdragon 435 | Characteristic | HiSilicon Kirin 650 |
LPDDR3-1600 | Memory | LPDDR3-933 |
6 GB | Max. Memory | |
2 (Dual Channel) | Memory channels | 2 (Dual Channel) |
12.8 GB/s | Max. Bandwidth | -- |
No | ECC | No |
-- | L2 Cache | -- |
-- | L3 Cache | -- |
-- | PCIe version | -- |
-- | PCIe lanes | -- |
-- | PCIe Bandwidth | -- |
Thermal ManagementThe Qualcomm Snapdragon 435 has a TDP of --. The TDP of the HiSilicon Kirin 650 is --. System integrators use the TDP of the processor as a guide when dimensioning the cooling solution. |
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Qualcomm Snapdragon 435 | Characteristic | HiSilicon Kirin 650 |
-- | TDP (PL1 / PBP) | -- |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe Qualcomm Snapdragon 435 has 0.00 MB cache and is manufactured in 28 nm. The cache of HiSilicon Kirin 650 is at 0.00 MB. The processor is manufactured in 16 nm. |
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Qualcomm Snapdragon 435 | Characteristic | HiSilicon Kirin 650 |
28 nm | Technology | 16 nm |
Chiplet | Chip design | Chiplet |
Armv8-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
-- | ISA extensions | -- |
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android | Operating systems | Android |
Q4/2016 | Release date | Q2/2016 |
-- | Release price | -- |
show more data | show more data | |
Qualcomm Snapdragon 435
8C 8T @ 1.40 GHz |
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HiSilicon Kirin 650
8C 8T @ 2.00 GHz |
Qualcomm Snapdragon 435
8C 8T @ 1.40 GHz |
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HiSilicon Kirin 650
8C 8T @ 2.00 GHz |
Qualcomm Snapdragon 435
Qualcomm Adreno 505 @ 0.45 GHz |
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HiSilicon Kirin 650
ARM Mali-T830 MP2 @ 0.90 GHz |
Qualcomm Snapdragon 435
8C 8T @ 1.40 GHz |
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HiSilicon Kirin 650
8C 8T @ 2.00 GHz |
Devices using this processor |
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Qualcomm Snapdragon 435 | HiSilicon Kirin 650 |
Unknown | Unknown |