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Qualcomm Snapdragon 210 vs MediaTek Dimensity 9300+
Last updated:
Benchmarks
Performance Overview
Average performance across multiple benchmarks
Single-core performance
Multi-core performance
Geekbench 5, 64bit Single-Core
Single-core performance
4C / 4T · 1.10 GHz
MediaTek Dimensity 9300+
100 %
8C / 8T · 3.40 GHz
Geekbench 5, 64bit Multi-Core
Multi-core performance
4C / 4T · 1.10 GHz
MediaTek Dimensity 9300+
100 %
8C / 8T · 3.40 GHz
iGPU - FP32 Performance (Single-precision GFLOPS)
Qualcomm Adreno 304
MediaTek Dimensity 9300+
100 %
ARM Immortalis-G720 MC12
More benchmarks
Specifications
At a glance
|
Wischen
|
Qualcomm Snapdragon 210 | MediaTek Dimensity 9300+ |
|---|---|---|
| Family | Qualcomm Snapdragon (105) | Mediatek Dimensity (38) |
| CPU group | Qualcomm Snapdragon 205-212 (4) | MediaTek Dimensity 9300 (2) |
| Architecture | Cortex-A7 | Cortex-X4 / -A720 |
| Technology | 28 nm | 4 nm |
| Segment | Smartphone / Tablet | Smartphone / Tablet |
| Socket | ||
| Predecessor | MediaTek Dimensity 9300 | |
| Successor |
CPU Cores and Base Frequency
|
Wischen
|
Qualcomm Snapdragon 210 | MediaTek Dimensity 9300+ |
|---|---|---|
| CPU Cores / Threads | 4 / 4 | 8 / 8 |
| Hyperthreading / SMT | ✗ | ✗ |
| Core architecture | normal | hybrid (big.LITTLE) |
| Core Cluster 1: | 4x Cortex-A7 1.10 GHz |
1x Cortex-X4 3.40 GHz |
| Core Cluster 2: | 3x Cortex-X4 2.85 GHz |
|
| Core Cluster 3: | 4x Cortex-A720 1.60 - 2.00 GHz |
|
| L2-Cache | ||
| L3-Cache | 18.00 MB | |
| Overclocking | ✗ | ✗ |
Integrated graphics (iGPU)
|
Wischen
|
Qualcomm Snapdragon 210 | MediaTek Dimensity 9300+ |
|---|---|---|
| GPU name | Qualcomm Adreno 304 | ARM Immortalis-G720 MC12 |
| GPU frequency | 0.40 - 0.40 GHz | 1.00 GHz |
| CUs / Shader | / 24 | 12 / |
| Raytracing | ✗ | ✗ |
| Max. displays | 0 | 0 |
| Max. GPU Memory | ||
| Technology | 28 nm | 4 nm |
| Release date | Q3/2015 | Q4/2023 |
NPU AI performance
|
Wischen
|
Qualcomm Snapdragon 210 | MediaTek Dimensity 9300+ |
|---|---|---|
| AI hardware | Qualcomm AI engine | Mediatek APU |
| AI specifications | QDSP6 DSP | MediaTek APU 790 @ 33 TOPS |
| NPU + CPU + iGPU |
Memory & PCIe
|
Wischen
|
Qualcomm Snapdragon 210 | MediaTek Dimensity 9300+ |
|---|---|---|
| Memory | LPDDR3-1066 (8.5 GB/s) LPDDR2-1066 (8.5 GB/s) | LPDDR5X-9600 (76.8 GB/s) |
| Max. Memory | 4 GB | 16 GB |
| Memory channels | 2 | 4 |
| ECC | No | No |
| PCIe | ||
| PCIe Bandwidth |
Thermal Management
|
Wischen
|
Qualcomm Snapdragon 210 | MediaTek Dimensity 9300+ |
|---|---|---|
| TDP | 12.5 W | |
| TDP (PL2) | ||
| TDP up | ||
| TDP down | ||
| T. junction max. |
Technical details
|
Wischen
|
Qualcomm Snapdragon 210 | MediaTek Dimensity 9300+ |
|---|---|---|
| Chip design | Chiplet | Chiplet |
| AES-NI | ✗ | ✗ |
| Operating systems | Android | Android |
| Instruction set | Armv7-A (32 bit) | Armv9-A (64 bit) |
| ISA extensions | ||
| Release date | 2014 | Q4/2023 |
| Release price | ||
| Documents | Technical data sheet |
User Reviews
Your rating
Here you can rate one or both of the processors. The average rating of Qualcomm Snapdragon 210 is 3.0 stars (6 ratings), while MediaTek Dimensity 9300+ has received 4.5 stars (60 ratings).
Click on the stars to rate one or both processors.
Most popular CPUs in both categories
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MediaTek Dimensity 8300
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Qualcomm Snapdragon 210
4C / 4T · 0.00 GHz
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