Microsoft XBox Series X | HiSilicon Kirin 810 | |
CPU comparisonMicrosoft XBox Series X or HiSilicon Kirin 810 - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The Microsoft XBox Series X has 8 cores with 16 threads and clocks with a maximum frequency of 3.80 GHz. Up to 16 GB of memory is supported in 2 memory channels. The Microsoft XBox Series X was released in Q3/2020. The HiSilicon Kirin 810 has 8 cores with 8 threads and clocks with a maximum frequency of 2.20 GHz. The CPU supports up to 6 GB of memory in 4 memory channels. The HiSilicon Kirin 810 was released in Q2/2019. |
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AMD Ryzen 7 (68) | Family | HiSilicon Kirin (29) |
AMD Ryzen 4000G (22) | CPU group | HiSilicon Kirin 810/820 (3) |
3 | Generation | 6 |
Renoir (Zen 2) | Architecture | Cortex-A76 / Cortex-A55 |
Desktop / Server | Segment | Mobile |
-- | Predecessor | -- |
-- | Successor | -- |
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CPU Cores and Base FrequencyThe Microsoft XBox Series X has 8 CPU cores and can calculate 16 threads in parallel. The clock frequency of the Microsoft XBox Series X is 3.20 GHz (3.80 GHz) while the HiSilicon Kirin 810 has 8 CPU cores and 8 threads can calculate simultaneously. The clock frequency of the HiSilicon Kirin 810 is at 2.20 GHz. |
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Microsoft XBox Series X | Characteristic | HiSilicon Kirin 810 |
8 | Cores | 8 |
16 | Threads | 8 |
normal | Core architecture | hybrid (big.LITTLE) |
Yes | Hyperthreading | No |
No | Overclocking ? | No |
3.20 GHz (3.80 GHz) 8x Zen 2 |
A-Core | 2.20 GHz 2x Cortex-A76 |
-- | B-Core | 1.90 GHz 6x Cortex-A55 |
Internal GraphicsThe Microsoft XBox Series X or HiSilicon Kirin 810 has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
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AMD Custom Radeon Graphics (XBox Series X) | GPU | ARM Mali-G52 MP6 |
1.83 GHz | GPU frequency | 0.85 GHz |
-- | GPU (Turbo) | -- |
1 | GPU Generation | Bifrost 2 |
7 nm | Technology | 12 nm |
1 | Max. displays | 2 |
52 | Compute units | 16 |
3328 | Shader | 288 |
No | Hardware Raytracing | No |
No | Frame Generation | No |
10 GB | Max. GPU Memory | 4 GB |
12 | DirectX Version | 12 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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AMD Custom Radeon Graphics (XBox Series X) | GPU | ARM Mali-G52 MP6 |
Decode / Encode | Codec h265 / HEVC (8 bit) | Decode / Encode |
Decode / Encode | Codec h265 / HEVC (10 bit) | Decode / Encode |
Decode / Encode | Codec h264 | Decode / Encode |
Decode / Encode | Codec VP9 | Decode / Encode |
Decode / Encode | Codec VP8 | Decode / Encode |
No | Codec AV1 | No |
Decode / Encode | Codec AVC | Decode / Encode |
Decode | Codec VC-1 | Decode / Encode |
Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeThe Microsoft XBox Series X can use up to 16 GB of memory in 2 memory channels. The maximum memory bandwidth is 560.0 GB/s. The HiSilicon Kirin 810 supports up to 6 GB of memory in 4 memory channels and achieves a memory bandwidth of up to --. |
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Microsoft XBox Series X | Characteristic | HiSilicon Kirin 810 |
GDDR6 | Memory | LPDDR4X-2133 |
16 GB | Max. Memory | 6 GB |
2 (Dual Channel) | Memory channels | 4 (Quad Channel) |
560.0 GB/s | Max. Bandwidth | -- |
No | ECC | No |
-- | L2 Cache | -- |
8.00 MB | L3 Cache | 1.00 MB |
4.0 | PCIe version | -- |
12 | PCIe lanes | -- |
23.6 GB/s | PCIe Bandwidth | -- |
Thermal ManagementThe thermal design power (TDP for short) of the Microsoft XBox Series X is 65 W, while the HiSilicon Kirin 810 has a TDP of 5 W. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. |
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Microsoft XBox Series X | Characteristic | HiSilicon Kirin 810 |
65 W | TDP (PL1 / PBP) | 5 W |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
100 °C | Tjunction max. | -- |
Technical detailsThe Microsoft XBox Series X is manufactured in 7 nm and has 8.00 MB cache. The HiSilicon Kirin 810 is manufactured in 7 nm and has a 1.00 MB cache. |
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Microsoft XBox Series X | Characteristic | HiSilicon Kirin 810 |
7 nm | Technology | 7 nm |
Monolithic | Chip design | Chiplet |
x86-64 (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
SSE4a, SSE4.1, SSE4.2, AVX2, FMA3 | ISA extensions | -- |
BGA | Socket | -- |
AMD-V, SVM | Virtualization | None |
Yes | AES-NI | No |
Windows 10, Windows 11, Linux | Operating systems | Android |
Q3/2020 | Release date | Q2/2019 |
-- | Release price | -- |
show more data | show more data | |
Microsoft XBox Series X
8C 16T @ 3.80 GHz |
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HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
Microsoft XBox Series X
8C 16T @ 3.66 GHz |
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HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
Microsoft XBox Series X
AMD Custom Radeon Graphics (XBox Series X) @ 1.83 GHz |
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HiSilicon Kirin 810
ARM Mali-G52 MP6 @ 0.85 GHz |
Microsoft XBox Series X
8C 16T @ 3.80 GHz |
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HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
Microsoft XBox Series X
8C 16T @ 3.66 GHz |
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HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
Microsoft XBox Series X
8C 16T @ 3.80 GHz |
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HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
Microsoft XBox Series X
8C 16T @ 3.66 GHz |
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HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
Microsoft XBox Series X
8C 16T @ 3.80 GHz |
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HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
Microsoft XBox Series X
8C 16T @ 3.66 GHz |
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HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
Microsoft XBox Series X
8C 16T @ 3.20 GHz |
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HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
Microsoft XBox Series X
8C 16T @ 3.20 GHz |
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HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
Microsoft XBox Series X
8C 16T @ 3.66 GHz |
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HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
Devices using this processor |
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Microsoft XBox Series X | HiSilicon Kirin 810 |
Unknown | Huawei Honor 9X Pro Huawei Honor Play 4T Pro Huawei MatePad 10.4 Huawei Nova 5i Pro Huawei P40 Lite |