MediaTek Dimensity 9200+ | HiSilicon Kirin 980 | |
CPU comparisonMediaTek Dimensity 9200+ or HiSilicon Kirin 980 - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The MediaTek Dimensity 9200+ has 8 cores with 8 threads and clocks with a maximum frequency of 3.35 GHz. Up to GB of memory is supported in 4 memory channels. The MediaTek Dimensity 9200+ was released in Q2/2023. The HiSilicon Kirin 980 has 8 cores with 8 threads and clocks with a maximum frequency of 2.60 GHz. The CPU supports up to 8 GB of memory in 4 memory channels. The HiSilicon Kirin 980 was released in Q4/2018. |
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Mediatek Dimensity (36) | Family | HiSilicon Kirin (29) |
MediaTek Dimensity 9200 (2) | CPU group | HiSilicon Kirin 980 (2) |
4 | Generation | 7 |
Cortex-X3 / -A715 / -A510 | Architecture | Cortex-A76 / Cortex-A55 |
Mobile | Segment | Mobile |
MediaTek Dimensity 9000+ | Predecessor | -- |
MediaTek Dimensity 9300 | Successor | -- |
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CPU Cores and Base FrequencyThe MediaTek Dimensity 9200+ has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the MediaTek Dimensity 9200+ is 3.35 GHz while the HiSilicon Kirin 980 has 8 CPU cores and 8 threads can calculate simultaneously. The clock frequency of the HiSilicon Kirin 980 is at 2.60 GHz. |
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MediaTek Dimensity 9200+ | Characteristic | HiSilicon Kirin 980 |
8 | Cores | 8 |
8 | Threads | 8 |
hybrid (Prime / big.LITTLE) | Core architecture | hybrid (Prime / big.LITTLE) |
No | Hyperthreading | No |
No | Overclocking ? | No |
3.35 GHz 1x Cortex-X3 |
A-Core | 2.60 GHz 2x Cortex-A76 |
3.00 GHz 3x Cortex-A715 |
B-Core | 1.92 GHz 2x Cortex-A76 |
2.00 GHz 4x Cortex-A510 |
C-Core | 1.80 GHz 4x Cortex-A55 |
Internal GraphicsThe MediaTek Dimensity 9200+ or HiSilicon Kirin 980 has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
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ARM Immortalis-G715 MP11 | GPU | ARM Mali-G76 MP10 |
0.98 GHz | GPU frequency | 0.72 GHz |
-- | GPU (Turbo) | -- |
Vallhall | GPU Generation | Bifrost 3 |
4 nm | Technology | 7 nm |
0 | Max. displays | 2 |
11 | Compute units | 10 |
-- | Shader | 160 |
No | Hardware Raytracing | No |
No | Frame Generation | No |
-- | Max. GPU Memory | 4 GB |
12 | DirectX Version | 12 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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ARM Immortalis-G715 MP11 | GPU | ARM Mali-G76 MP10 |
Decode / Encode | Codec h265 / HEVC (8 bit) | Decode / Encode |
Decode / Encode | Codec h265 / HEVC (10 bit) | Decode / Encode |
Decode / Encode | Codec h264 | Decode / Encode |
Decode / Encode | Codec VP9 | Decode / Encode |
Decode / Encode | Codec VP8 | Decode / Encode |
Decode | Codec AV1 | No |
Decode / Encode | Codec AVC | Decode / Encode |
Decode / Encode | Codec VC-1 | Decode / Encode |
Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeThe MediaTek Dimensity 9200+ can use up to GB of memory in 4 memory channels. The maximum memory bandwidth is 68.3 GB/s. The HiSilicon Kirin 980 supports up to 8 GB of memory in 4 memory channels and achieves a memory bandwidth of up to --. |
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MediaTek Dimensity 9200+ | Characteristic | HiSilicon Kirin 980 |
LPDDR5X-8533 | Memory | LPDDR4X-2133 |
Max. Memory | 8 GB | |
4 (Quad Channel) | Memory channels | 4 (Quad Channel) |
68.3 GB/s | Max. Bandwidth | -- |
No | ECC | No |
-- | L2 Cache | -- |
-- | L3 Cache | 2.00 MB |
-- | PCIe version | -- |
-- | PCIe lanes | -- |
-- | PCIe Bandwidth | -- |
Thermal ManagementThe thermal design power (TDP for short) of the MediaTek Dimensity 9200+ is --, while the HiSilicon Kirin 980 has a TDP of 6 W. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. |
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MediaTek Dimensity 9200+ | Characteristic | HiSilicon Kirin 980 |
-- | TDP (PL1 / PBP) | 6 W |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe MediaTek Dimensity 9200+ is manufactured in 4 nm and has 0.00 MB cache. The HiSilicon Kirin 980 is manufactured in 7 nm and has a 2.00 MB cache. |
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MediaTek Dimensity 9200+ | Characteristic | HiSilicon Kirin 980 |
4 nm | Technology | 7 nm |
Chiplet | Chip design | Chiplet |
Armv9-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
-- | ISA extensions | -- |
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android | Operating systems | Android |
Q2/2023 | Release date | Q4/2018 |
-- | Release price | -- |
show more data | show more data | |
MediaTek Dimensity 9200+
8C 8T @ 3.35 GHz |
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HiSilicon Kirin 980
8C 8T @ 2.60 GHz |
MediaTek Dimensity 9200+
8C 8T @ 3.35 GHz |
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HiSilicon Kirin 980
8C 8T @ 2.60 GHz |
MediaTek Dimensity 9200+
8C 8T @ 3.35 GHz |
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HiSilicon Kirin 980
8C 8T @ 2.60 GHz |
MediaTek Dimensity 9200+
8C 8T @ 3.35 GHz |
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HiSilicon Kirin 980
8C 8T @ 2.60 GHz |
MediaTek Dimensity 9200+
ARM Immortalis-G715 MP11 @ 0.98 GHz |
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HiSilicon Kirin 980
ARM Mali-G76 MP10 @ 0.72 GHz |
MediaTek Dimensity 9200+
8C 8T @ 3.35 GHz |
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HiSilicon Kirin 980
8C 8T @ 2.60 GHz |
Devices using this processor |
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MediaTek Dimensity 9200+ | HiSilicon Kirin 980 |
Unknown | Huawei P30 Huawei P30 Pro Huawei Honor 20 Huawei Honor 20 Pro Huawei Mate 20 Huawei Mate 20 Pro Huawei Nova 5T |