MediaTek Dimensity 9000+ | HiSilicon Kirin 710 | |
CPU comparisonMediaTek Dimensity 9000+ or HiSilicon Kirin 710 - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The MediaTek Dimensity 9000+ has 8 cores with 8 threads and clocks with a maximum frequency of 3.20 GHz. Up to GB of memory is supported in 4 memory channels. The MediaTek Dimensity 9000+ was released in Q3/2022. The HiSilicon Kirin 710 has 8 cores with 8 threads and clocks with a maximum frequency of 2.20 GHz. The CPU supports up to 6 GB of memory in 2 memory channels. The HiSilicon Kirin 710 was released in Q3/2018. |
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Mediatek Dimensity (36) | Family | HiSilicon Kirin (29) |
MediaTek Dimensity 9000 (2) | CPU group | HiSilicon Kirin 710 (1) |
3 | Generation | 5 |
Cortex-X2 / -A710 / -A510 | Architecture | Cortex-A73 / Cortex-A53 |
Mobile | Segment | Mobile |
-- | Predecessor | -- |
MediaTek Dimensity 9200 | Successor | -- |
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CPU Cores and Base FrequencyThe MediaTek Dimensity 9000+ has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the MediaTek Dimensity 9000+ is 3.20 GHz while the HiSilicon Kirin 710 has 8 CPU cores and 8 threads can calculate simultaneously. The clock frequency of the HiSilicon Kirin 710 is at 2.20 GHz. |
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MediaTek Dimensity 9000+ | Characteristic | HiSilicon Kirin 710 |
8 | Cores | 8 |
8 | Threads | 8 |
hybrid (Prime / big.LITTLE) | Core architecture | hybrid (big.LITTLE) |
No | Hyperthreading | No |
No | Overclocking ? | No |
3.20 GHz 1x Cortex-X2 |
A-Core | 2.20 GHz 4x Cortex-A73 |
2.85 GHz 3x Cortex-A710 |
B-Core | 1.70 GHz 4x Cortex-A53 |
1.80 GHz 4x Cortex-A510 |
C-Core | -- |
Internal GraphicsThe MediaTek Dimensity 9000+ or HiSilicon Kirin 710 has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
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ARM Mali-G710 MP10 | GPU | ARM Mali-G51 MP4 |
0.90 GHz | GPU frequency | 0.65 GHz |
-- | GPU (Turbo) | 1.00 GHz |
Vallhall 3 | GPU Generation | Bifrost 1 |
4 nm | Technology | 12 nm |
1 | Max. displays | 2 |
10 | Compute units | 8 |
-- | Shader | 128 |
No | Hardware Raytracing | No |
No | Frame Generation | No |
-- | Max. GPU Memory | 4 GB |
12 | DirectX Version | 11 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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ARM Mali-G710 MP10 | GPU | ARM Mali-G51 MP4 |
Decode / Encode | Codec h265 / HEVC (8 bit) | Decode / Encode |
Decode / Encode | Codec h265 / HEVC (10 bit) | No |
Decode / Encode | Codec h264 | Decode / Encode |
Decode / Encode | Codec VP9 | Decode / Encode |
Decode / Encode | Codec VP8 | Decode / Encode |
Decode | Codec AV1 | No |
Decode / Encode | Codec AVC | Decode / Encode |
Decode / Encode | Codec VC-1 | Decode / Encode |
Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeThe MediaTek Dimensity 9000+ can use up to GB of memory in 4 memory channels. The maximum memory bandwidth is 60.0 GB/s. The HiSilicon Kirin 710 supports up to 6 GB of memory in 2 memory channels and achieves a memory bandwidth of up to --. |
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MediaTek Dimensity 9000+ | Characteristic | HiSilicon Kirin 710 |
LPDDR5-6400, LPDDR5-7500 | Memory | LPDDR4, LPDDR3 |
Max. Memory | 6 GB | |
4 (Quad Channel) | Memory channels | 2 (Dual Channel) |
60.0 GB/s | Max. Bandwidth | -- |
No | ECC | No |
-- | L2 Cache | -- |
-- | L3 Cache | 1.00 MB |
-- | PCIe version | -- |
-- | PCIe lanes | -- |
-- | PCIe Bandwidth | -- |
Thermal ManagementThe thermal design power (TDP for short) of the MediaTek Dimensity 9000+ is --, while the HiSilicon Kirin 710 has a TDP of 5 W. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. |
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MediaTek Dimensity 9000+ | Characteristic | HiSilicon Kirin 710 |
-- | TDP (PL1 / PBP) | 5 W |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe MediaTek Dimensity 9000+ is manufactured in 4 nm and has 0.00 MB cache. The HiSilicon Kirin 710 is manufactured in 12 nm and has a 1.00 MB cache. |
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MediaTek Dimensity 9000+ | Characteristic | HiSilicon Kirin 710 |
4 nm | Technology | 12 nm |
Chiplet | Chip design | Chiplet |
Armv9-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
-- | ISA extensions | -- |
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android | Operating systems | Android |
Q3/2022 | Release date | Q3/2018 |
-- | Release price | -- |
show more data | show more data | |
MediaTek Dimensity 9000+
8C 8T @ 3.20 GHz |
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HiSilicon Kirin 710
8C 8T @ 2.20 GHz |
MediaTek Dimensity 9000+
8C 8T @ 3.20 GHz |
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HiSilicon Kirin 710
8C 8T @ 2.20 GHz |
MediaTek Dimensity 9000+
8C 8T @ 3.20 GHz |
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HiSilicon Kirin 710
8C 8T @ 2.20 GHz |
MediaTek Dimensity 9000+
8C 8T @ 3.20 GHz |
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HiSilicon Kirin 710
8C 8T @ 2.20 GHz |
MediaTek Dimensity 9000+
ARM Mali-G710 MP10 @ 0.90 GHz |
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HiSilicon Kirin 710
ARM Mali-G51 MP4 @ 1.00 GHz |
MediaTek Dimensity 9000+
8C 8T @ 3.20 GHz |
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HiSilicon Kirin 710
8C 8T @ 2.20 GHz |
MediaTek Dimensity 9000+
8C 8T @ 3.20 GHz |
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HiSilicon Kirin 710
8C 8T @ 2.20 GHz |
Devices using this processor |
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MediaTek Dimensity 9000+ | HiSilicon Kirin 710 |
Unknown | Huawei Honor 8X Huawei P30 lite |