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HiSilicon Kirin 710 | Qualcomm Snapdragon 778G | |
CPU comparisonHiSilicon Kirin 710 or Qualcomm Snapdragon 778G - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The HiSilicon Kirin 710 has 8 cores with 8 threads and clocks with a maximum frequency of 2.20 GHz. Up to 6 GB of memory is supported in 2 memory channels. The HiSilicon Kirin 710 was released in Q3/2018. The Qualcomm Snapdragon 778G has 8 cores with 8 threads and clocks with a maximum frequency of 2.40 GHz. The CPU supports up to GB of memory in 2 memory channels. The Qualcomm Snapdragon 778G was released in Q2/2021. |
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HiSilicon Kirin | Family | Qualcomm Snapdragon |
HiSilicon Kirin 710 | CPU group | Qualcomm Snapdragon 778 |
5 | Generation | 4 |
Cortex-A73 / Cortex-A53 | Architecture | Kryo 670 |
Mobile | Segment | Mobile |
-- | Predecessor | -- |
-- | Successor | -- |
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CPU Cores and Base FrequencyIn addition to the number of CPU cores and threads, you can see here whether the HiSilicon Kirin 710 or Qualcomm Snapdragon 778G can be overclocked. You will also find the clock frequencies of the processor (single-core and multi-core) here. The number of CPU cores greatly affects the speed of the processor. |
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8 | Cores | 8 |
8 | Threads | 8 |
hybrid (big.LITTLE) | Core architecture | hybrid (Prime / big.LITTLE) |
No | Hyperthreading | No |
No | Overclocking ? | No |
2.20 GHz 4x Cortex-A73 |
A-Core | 2.40 GHz 1x Kryo 670 Prime |
1.70 GHz 4x Cortex-A53 |
B-Core | 2.20 GHz 3x Kryo 670 Gold |
-- | C-Core | 1.90 GHz 4x Kryo 670 Silver |
Internal GraphicsThe HiSilicon Kirin 710 or Qualcomm Snapdragon 778G has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. A processor with integrated graphics is also called APU (Accelerated Processing Unit). |
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ARM Mali-G51 MP4 | GPU | Qualcomm Adreno 642L |
0.65 GHz | GPU frequency | |
1.00 GHz | GPU (Turbo) | |
Bifrost 1 | GPU Generation | 5 |
12 nm | Technology | 6 nm |
2 | Max. displays | 1 |
8 | Execution units | 4 |
128 | Shader | 384 |
4 GB | Max. GPU Memory | 4 GB |
11 | DirectX Version | 12.0 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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Decode / Encode | Codec h265 / HEVC (8 bit) | Decode / Encode |
No | Codec h265 / HEVC (10 bit) | Decode / Encode |
Decode / Encode | Codec h264 | Decode / Encode |
Decode / Encode | Codec VP9 | Decode / Encode |
Decode / Encode | Codec VP8 | Decode / Encode |
No | Codec AV1 | No |
Decode / Encode | Codec AVC | Decode |
Decode / Encode | Codec VC-1 | Decode |
Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeThe memory type as well as the amount of memory can greatly affect the speed of the processor. The memory bandwidth depends on several factors and is given in gigabytes per second. |
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LPDDR3, LPDDR4 | Memory | LPDDR5-3200 |
6 GB | Max. Memory | |
2 (Dual Channel) | Memory channels | 2 (Dual Channel) |
-- | Bandwidth | -- |
No | ECC | No |
L2 Cache | ||
1.00 MB | L3 Cache | 2.00 MB |
PCIe version | ||
PCIe lanes | ||
Thermal ManagementThe Thermal Design Power (TDP for short) specifies the necessary cooling solution to cool the processor sufficiently. The TDP usually only gives a rough idea of the real consumption of a CPU. |
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5 W | TDP (PL1 / PBP) | -- |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsHere you will find information on the size of the level 2 and level 3 cache of the HiSilicon Kirin 710 or Qualcomm Snapdragon 778G as well as a list of the processors ISA extensions. We have documented the architecture and the manufacturing technology for you as well as the release date. |
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12 nm | Technology | 6 nm |
Chiplet | Chip design | Chiplet |
ARMv8-A64 (64 bit) | Instruction set (ISA) | ARMv8-A64 (64 bit) |
ISA extensions | ||
N/A | Socket | N/A |
None | Virtualization | None |
No | AES-NI | No |
Android | Operating systems | Android |
Q3/2018 | Release date | Q2/2021 |
-- | Release price | -- |
show more data | show more data | |
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HiSilicon Kirin 710
8C 8T @ 2.20 GHz |
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Qualcomm Snapdragon 778G
8C 8T @ 2.40 GHz |
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HiSilicon Kirin 710
8C 8T @ 2.20 GHz |
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Qualcomm Snapdragon 778G
8C 8T @ 2.40 GHz |
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HiSilicon Kirin 710
8C 8T @ 2.20 GHz |
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Qualcomm Snapdragon 778G
8C 8T @ 2.40 GHz |
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HiSilicon Kirin 710
8C 8T @ 2.20 GHz |
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Qualcomm Snapdragon 778G
8C 8T @ 2.40 GHz |
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HiSilicon Kirin 710
ARM Mali-G51 MP4 @ 1.00 GHz |
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Qualcomm Snapdragon 778G
Qualcomm Adreno 642L @ 0.00 GHz |
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HiSilicon Kirin 710
8C 8T @ 2.20 GHz |
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Qualcomm Snapdragon 778G
8C 8T @ 2.40 GHz |
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HiSilicon Kirin 710
8C 8T @ 2.20 GHz |
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Qualcomm Snapdragon 778G
8C 8T @ 2.40 GHz |
Devices using this processor |
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HiSilicon Kirin 710 | Qualcomm Snapdragon 778G |
Huawei Honor 8X Huawei P30 lite |
Samsung Galaxy A73 5G Xiaomi Civi S1 Oppo Reno7 5G |