MediaTek Dimensity 9000+ | AMD Ryzen Embedded V3C48 | |
CPU comparisonMediaTek Dimensity 9000+ or AMD Ryzen Embedded V3C48 - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The MediaTek Dimensity 9000+ has 8 cores with 8 threads and clocks with a maximum frequency of 3.20 GHz. Up to GB of memory is supported in 4 memory channels. The MediaTek Dimensity 9000+ was released in Q3/2022. The AMD Ryzen Embedded V3C48 has 8 cores with 16 threads and clocks with a maximum frequency of 3.80 GHz. The CPU supports up to 64 GB of memory in 2 memory channels. The AMD Ryzen Embedded V3C48 was released in Q3/2022. |
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Mediatek Dimensity (36) | Family | AMD Ryzen Embedded V (16) |
MediaTek Dimensity 9000 (2) | CPU group | AMD Ryzen Embedded V3000 (5) |
3 | Generation | 3 |
Cortex-X2 / -A710 / -A510 | Architecture | Rembrandt (Zen 3+) |
Mobile | Segment | Desktop / Server |
-- | Predecessor | AMD Ryzen Embedded V2748 |
MediaTek Dimensity 9200 | Successor | -- |
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CPU Cores and Base FrequencyThe MediaTek Dimensity 9000+ has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the MediaTek Dimensity 9000+ is 3.20 GHz while the AMD Ryzen Embedded V3C48 has 8 CPU cores and 16 threads can calculate simultaneously. The clock frequency of the AMD Ryzen Embedded V3C48 is at 3.30 GHz (3.80 GHz). |
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MediaTek Dimensity 9000+ | Characteristic | AMD Ryzen Embedded V3C48 |
8 | Cores | 8 |
8 | Threads | 16 |
hybrid (Prime / big.LITTLE) | Core architecture | normal |
No | Hyperthreading | Yes |
No | Overclocking ? | No |
3.20 GHz 1x Cortex-X2 |
A-Core | 3.30 GHz (3.80 GHz) 8x Zen 3 |
2.85 GHz 3x Cortex-A710 |
B-Core | -- |
1.80 GHz 4x Cortex-A510 |
C-Core | -- |
Internal GraphicsThe MediaTek Dimensity 9000+ or AMD Ryzen Embedded V3C48 has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
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ARM Mali-G710 MP10 | GPU | no iGPU |
0.90 GHz | GPU frequency | -- |
-- | GPU (Turbo) | -- |
Vallhall 3 | GPU Generation | -- |
4 nm | Technology | |
1 | Max. displays | |
10 | Compute units | -- |
-- | Shader | -- |
No | Hardware Raytracing | No |
No | Frame Generation | No |
-- | Max. GPU Memory | -- |
12 | DirectX Version | -- |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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ARM Mali-G710 MP10 | GPU | no iGPU |
Decode / Encode | Codec h265 / HEVC (8 bit) | No |
Decode / Encode | Codec h265 / HEVC (10 bit) | No |
Decode / Encode | Codec h264 | No |
Decode / Encode | Codec VP9 | No |
Decode / Encode | Codec VP8 | No |
Decode | Codec AV1 | No |
Decode / Encode | Codec AVC | No |
Decode / Encode | Codec VC-1 | No |
Decode / Encode | Codec JPEG | No |
Memory & PCIeThe MediaTek Dimensity 9000+ can use up to GB of memory in 4 memory channels. The maximum memory bandwidth is 60.0 GB/s. The AMD Ryzen Embedded V3C48 supports up to 64 GB of memory in 2 memory channels and achieves a memory bandwidth of up to 76.8 GB/s. |
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MediaTek Dimensity 9000+ | Characteristic | AMD Ryzen Embedded V3C48 |
LPDDR5-6400, LPDDR5-7500 | Memory | DDR5-4800 |
Max. Memory | 64 GB | |
4 (Quad Channel) | Memory channels | 2 (Dual Channel) |
60.0 GB/s | Max. Bandwidth | 76.8 GB/s |
No | ECC | Yes |
-- | L2 Cache | 4.00 MB |
-- | L3 Cache | 16.00 MB |
-- | PCIe version | 4.0 |
-- | PCIe lanes | 20 |
-- | PCIe Bandwidth | 39.4 GB/s |
Thermal ManagementThe thermal design power (TDP for short) of the MediaTek Dimensity 9000+ is --, while the AMD Ryzen Embedded V3C48 has a TDP of 45 W. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. |
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MediaTek Dimensity 9000+ | Characteristic | AMD Ryzen Embedded V3C48 |
-- | TDP (PL1 / PBP) | 45 W |
-- | TDP (PL2) | -- |
-- | TDP up | 54 W |
-- | TDP down | 35 W |
-- | Tjunction max. | 105 °C |
Technical detailsThe MediaTek Dimensity 9000+ is manufactured in 4 nm and has 0.00 MB cache. The AMD Ryzen Embedded V3C48 is manufactured in 6 nm and has a 20.00 MB cache. |
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MediaTek Dimensity 9000+ | Characteristic | AMD Ryzen Embedded V3C48 |
4 nm | Technology | 6 nm |
Chiplet | Chip design | Chiplet |
Armv9-A (64 bit) | Instruction set (ISA) | x86-64 (64 bit) |
-- | ISA extensions | SSE4a, SSE4.1, SSE4.2, AVX2, FMA3 |
-- | Socket | FP7r2 |
None | Virtualization | AMD-V, SVM |
No | AES-NI | Yes |
Android | Operating systems | Windows 10, Windows 11, Linux |
Q3/2022 | Release date | Q3/2022 |
-- | Release price | -- |
show more data | show more data | |
MediaTek Dimensity 9000+
8C 8T @ 3.20 GHz |
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AMD Ryzen Embedded V3C48
8C 16T @ 3.80 GHz |
MediaTek Dimensity 9000+
8C 8T @ 3.20 GHz |
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AMD Ryzen Embedded V3C48
8C 16T @ 3.50 GHz |
MediaTek Dimensity 9000+
8C 8T @ 3.20 GHz |
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AMD Ryzen Embedded V3C48
8C 16T @ 3.80 GHz |
MediaTek Dimensity 9000+
8C 8T @ 3.20 GHz |
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AMD Ryzen Embedded V3C48
8C 16T @ 3.50 GHz |
MediaTek Dimensity 9000+
ARM Mali-G710 MP10 @ 0.90 GHz |
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AMD Ryzen Embedded V3C48
@ 0.00 GHz |
MediaTek Dimensity 9000+
8C 8T @ 3.20 GHz |
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AMD Ryzen Embedded V3C48
8C 16T @ 3.30 GHz |
Devices using this processor |
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MediaTek Dimensity 9000+ | AMD Ryzen Embedded V3C48 |
Unknown | Unknown |