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MediaTek Dimensity 810 vs MediaTek Helio G70
Last updated:
Benchmarks
Performance Overview
Average performance across multiple benchmarks
Single-core performance
Multi-core performance
Geekbench 5, 64bit Single-Core
Single-core performance
MediaTek Dimensity 810
100 %
8C / 8T · 2.40 GHz
MediaTek Helio G70
65 %
8C / 8T · 2.00 GHz
Geekbench 5, 64bit Multi-Core
Multi-core performance
MediaTek Dimensity 810
100 %
8C / 8T · 2.40 GHz
MediaTek Helio G70
69 %
8C / 8T · 2.00 GHz
iGPU - FP32 Performance (Single-precision GFLOPS)
MediaTek Dimensity 810
100 %
ARM Mali-G57 MP2
MediaTek Helio G70
22 %
ARM Mali-G52 MP2
More benchmarks
Specifications
At a glance
|
Wischen
|
MediaTek Dimensity 810 | MediaTek Helio G70 |
|---|---|---|
| Family | Mediatek Dimensity (38) | Mediatek Helio (37) |
| CPU group | MediaTek Dimensity 810 (1) | MediaTek Helio G70/G80 (4) |
| Architecture | Cortex-A76 / Cortex-A55 | Cortex-A75 / Cortex-A55 |
| Technology | 6 nm | 12 nm |
| Segment | Smartphone / Tablet | Smartphone / Tablet |
| Socket | ||
| Predecessor | ||
| Successor |
CPU Cores and Base Frequency
|
Wischen
|
MediaTek Dimensity 810 | MediaTek Helio G70 |
|---|---|---|
| CPU Cores / Threads | 8 / 8 | 8 / 8 |
| Hyperthreading / SMT | ✗ | ✗ |
| Core architecture | hybrid (big.LITTLE) | hybrid (big.LITTLE) |
| Core Cluster 1: | 4x Cortex-A76 2.40 GHz |
2x Cortex-A75 2.00 GHz |
| Core Cluster 2: | 4x Cortex-A55 2.00 GHz |
6x Cortex-A55 1.70 GHz |
| L2-Cache | ||
| L3-Cache | ||
| Overclocking | ✗ | ✗ |
Integrated graphics (iGPU)
|
Wischen
|
MediaTek Dimensity 810 | MediaTek Helio G70 |
|---|---|---|
| GPU name | ARM Mali-G57 MP2 | ARM Mali-G52 MP2 |
| GPU frequency | 0.25 - 0.95 GHz | 0.82 GHz |
| CUs / Shader | 2 / 32 | 2 / 32 |
| Raytracing | ✗ | ✗ |
| Max. displays | 2 | 2 |
| Max. GPU Memory | 4 GB | |
| Technology | 7 nm | 16 nm |
| Release date | Q2/2020 | Q3/2020 |
NPU AI performance
|
Wischen
|
MediaTek Dimensity 810 | MediaTek Helio G70 |
|---|---|---|
| AI hardware | ||
| AI specifications | ||
| NPU + CPU + iGPU |
Memory & PCIe
|
Wischen
|
MediaTek Dimensity 810 | MediaTek Helio G70 |
|---|---|---|
| Memory | LPDDR4X-4266 (17.2 GB/s) | LPDDR4X-1800 (14.4 GB/s) |
| Max. Memory | 16 GB | 8 GB |
| Memory channels | 2 | 4 |
| ECC | No | No |
| PCIe | ||
| PCIe Bandwidth |
Thermal Management
|
Wischen
|
MediaTek Dimensity 810 | MediaTek Helio G70 |
|---|---|---|
| TDP | ||
| TDP (PL2) | ||
| TDP up | ||
| TDP down | ||
| T. junction max. |
Technical details
|
Wischen
|
MediaTek Dimensity 810 | MediaTek Helio G70 |
|---|---|---|
| Chip design | Chiplet | Chiplet |
| AES-NI | ✗ | ✗ |
| Operating systems | Android | Android |
| Instruction set | Armv8-A (64 bit) | Armv8-A (64 bit) |
| ISA extensions | ||
| Release date | Q3/2021 | Q1/2020 |
| Release price | ||
| Documents | Technical data sheet | Technical data sheet |
User Reviews
Your rating
Here you can rate one or both of the processors. The average rating of MediaTek Dimensity 810 is 4.1 stars (11 ratings), while MediaTek Helio G70 has received 3.9 stars (8 ratings).
Click on the stars to rate one or both processors.
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