MediaTek Dimensity 810 | HiSilicon Kirin 960 | |
CPU comparisonMediaTek Dimensity 810 or HiSilicon Kirin 960 - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The MediaTek Dimensity 810 has 8 cores with 8 threads and clocks with a maximum frequency of 2.40 GHz. Up to 16 GB of memory is supported in 2 memory channels. The MediaTek Dimensity 810 was released in Q3/2021. The HiSilicon Kirin 960 has 8 cores with 8 threads and clocks with a maximum frequency of 2.40 GHz. The CPU supports up to 6 GB of memory in 2 memory channels. The HiSilicon Kirin 960 was released in Q4/2016. |
||
Mediatek Dimensity (36) | Family | HiSilicon Kirin (29) |
MediaTek Dimensity 810 (1) | CPU group | HiSilicon Kirin 960 (2) |
2 | Generation | 5 |
Cortex-A76 / Cortex-A55 | Architecture | Cortex-A73 / Cortex-A53 |
Mobile | Segment | Mobile |
-- | Predecessor | -- |
-- | Successor | -- |
|
||
CPU Cores and Base FrequencyThe MediaTek Dimensity 810 has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the MediaTek Dimensity 810 is 2.40 GHz while the HiSilicon Kirin 960 has 8 CPU cores and 8 threads can calculate simultaneously. The clock frequency of the HiSilicon Kirin 960 is at 2.40 GHz. |
||
MediaTek Dimensity 810 | Characteristic | HiSilicon Kirin 960 |
8 | Cores | 8 |
8 | Threads | 8 |
hybrid (big.LITTLE) | Core architecture | hybrid (big.LITTLE) |
No | Hyperthreading | No |
No | Overclocking ? | No |
2.40 GHz 4x Cortex-A76 |
A-Core | 2.40 GHz 4x Cortex-A73 |
2.00 GHz 4x Cortex-A55 |
B-Core | 1.80 GHz 4x Cortex-A53 |
Internal GraphicsThe MediaTek Dimensity 810 or HiSilicon Kirin 960 has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
||
ARM Mali-G57 MP2 | GPU | ARM Mali-G71 MP8 |
0.25 GHz | GPU frequency | 0.90 GHz |
0.95 GHz | GPU (Turbo) | -- |
Vallhall 1 | GPU Generation | Bifrost 1 |
7 nm | Technology | 16 nm |
2 | Max. displays | 2 |
2 | Compute units | 8 |
32 | Shader | 256 |
No | Hardware Raytracing | No |
No | Frame Generation | No |
4 GB | Max. GPU Memory | 2 GB |
12 | DirectX Version | 11 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
||
ARM Mali-G57 MP2 | GPU | ARM Mali-G71 MP8 |
Decode / Encode | Codec h265 / HEVC (8 bit) | Decode / Encode |
Decode / Encode | Codec h265 / HEVC (10 bit) | Decode |
Decode / Encode | Codec h264 | Decode / Encode |
Decode / Encode | Codec VP9 | No |
Decode / Encode | Codec VP8 | Decode / Encode |
Decode | Codec AV1 | No |
Decode / Encode | Codec AVC | Decode / Encode |
Decode / Encode | Codec VC-1 | No |
Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeThe MediaTek Dimensity 810 can use up to 16 GB of memory in 2 memory channels. The maximum memory bandwidth is 17.2 GB/s. The HiSilicon Kirin 960 supports up to 6 GB of memory in 2 memory channels and achieves a memory bandwidth of up to 12.8 GB/s. |
||
MediaTek Dimensity 810 | Characteristic | HiSilicon Kirin 960 |
LPDDR4X-4266 | Memory | LPDDR4-1600 |
16 GB | Max. Memory | 6 GB |
2 (Dual Channel) | Memory channels | 2 (Dual Channel) |
17.2 GB/s | Max. Bandwidth | 12.8 GB/s |
No | ECC | No |
-- | L2 Cache | -- |
-- | L3 Cache | 4.00 MB |
-- | PCIe version | -- |
-- | PCIe lanes | -- |
-- | PCIe Bandwidth | -- |
Thermal ManagementThe thermal design power (TDP for short) of the MediaTek Dimensity 810 is --, while the HiSilicon Kirin 960 has a TDP of 5 W. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. |
||
MediaTek Dimensity 810 | Characteristic | HiSilicon Kirin 960 |
-- | TDP (PL1 / PBP) | 5 W |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe MediaTek Dimensity 810 is manufactured in 6 nm and has 0.00 MB cache. The HiSilicon Kirin 960 is manufactured in 16 nm and has a 4.00 MB cache. |
||
MediaTek Dimensity 810 | Characteristic | HiSilicon Kirin 960 |
6 nm | Technology | 16 nm |
Chiplet | Chip design | Chiplet |
Armv8-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
-- | ISA extensions | -- |
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android | Operating systems | Android |
Q3/2021 | Release date | Q4/2016 |
-- | Release price | -- |
show more data | show more data | |
MediaTek Dimensity 810
8C 8T @ 2.40 GHz |
|||
HiSilicon Kirin 960
8C 8T @ 2.40 GHz |
MediaTek Dimensity 810
8C 8T @ 2.40 GHz |
|||
HiSilicon Kirin 960
8C 8T @ 2.40 GHz |
MediaTek Dimensity 810
8C 8T @ 2.40 GHz |
|||
HiSilicon Kirin 960
8C 8T @ 2.40 GHz |
MediaTek Dimensity 810
8C 8T @ 2.40 GHz |
|||
HiSilicon Kirin 960
8C 8T @ 2.40 GHz |
MediaTek Dimensity 810
ARM Mali-G57 MP2 @ 0.95 GHz |
|||
HiSilicon Kirin 960
ARM Mali-G71 MP8 @ 0.90 GHz |
MediaTek Dimensity 810
8C 8T @ 2.40 GHz |
|||
HiSilicon Kirin 960
8C 8T @ 2.40 GHz |
MediaTek Dimensity 810
8C 8T @ 2.40 GHz |
|||
HiSilicon Kirin 960
8C 8T @ 2.40 GHz |
Devices using this processor |
|
MediaTek Dimensity 810 | HiSilicon Kirin 960 |
Unknown | Huawei Honor 8 Pro Huawei Honor 9 Huawei Mate 9 Huawei Mate 9 Pro Huawei Mate 9 Porsche Huawei MediaPad M5 Huawei Nova 2s Huawei P10 |