MediaTek Dimensity 7030 | Qualcomm Snapdragon 888+ | |
CPU comparisonMediaTek Dimensity 7030 or Qualcomm Snapdragon 888+ - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The MediaTek Dimensity 7030 has 8 cores with 8 threads and clocks with a maximum frequency of 2.50 GHz. Up to GB of memory is supported in 0 memory channels. The MediaTek Dimensity 7030 was released in Q3/2023. The Qualcomm Snapdragon 888+ has 8 cores with 8 threads and clocks with a maximum frequency of 3.00 GHz. The CPU supports up to 16 GB of memory in 4 memory channels. The Qualcomm Snapdragon 888+ was released in Q3/2021. |
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Mediatek Dimensity (36) | Family | Qualcomm Snapdragon (102) |
MediaTek Dimensity 7000 (3) | CPU group | Qualcomm Snapdragon 888 (2) |
1 | Generation | 8 |
Cortex-A78 / Cortex-A55 | Architecture | Kryo 680 |
Mobile | Segment | Mobile |
-- | Predecessor | -- |
-- | Successor | -- |
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CPU Cores and Base FrequencyThe MediaTek Dimensity 7030 is a 8 core processor with a clock frequency of 2.50 GHz. The Qualcomm Snapdragon 888+ has 8 CPU cores with a clock frequency of 3.00 GHz. |
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MediaTek Dimensity 7030 | Characteristic | Qualcomm Snapdragon 888+ |
8 | Cores | 8 |
8 | Threads | 8 |
hybrid (big.LITTLE) | Core architecture | hybrid (Prime / big.LITTLE) |
No | Hyperthreading | No |
No | Overclocking ? | No |
2.50 GHz 2x Cortex-A78 |
A-Core | 3.00 GHz 1x Kryo 680 Prime |
2.00 GHz 6x Cortex-A55 |
B-Core | 1.80 GHz 3x Kryo 680 Gold |
-- | C-Core | -- 4x Kryo 680 Silver |
Artificial Intelligence and Machine LearningProcessors with the support of artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. Algorithms for ML improve their performance the more data they have collected via software. ML tasks can be processed up to 10,000 times faster than with a classic processor. |
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MediaTek Dimensity 7030 | Characteristic | Qualcomm Snapdragon 888+ |
Mediatek APU | AI hardware | Qualcomm AI engine |
MediaTek APU 550 | AI specifications | Hexagon 780 @ 32 TOPS |
Internal GraphicsThe integrated graphics unit of a processor is not only responsible for the pure image output on the system, but can also significantly increase the efficiency of the system with the support of modern video codecs. |
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ARM Mali-G610 MP3 | GPU | Qualcomm Adreno 660 AV1 |
GPU frequency | 0.84 GHz | |
-- | GPU (Turbo) | -- |
Vallhall 3 | GPU Generation | 6 |
4 nm | Technology | 5 nm |
1 | Max. displays | 0 |
3 | Compute units | -- |
-- | Shader | -- |
No | Hardware Raytracing | No |
No | Frame Generation | No |
-- | Max. GPU Memory | -- |
12 | DirectX Version | 12.1 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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ARM Mali-G610 MP3 | GPU | Qualcomm Adreno 660 AV1 |
Decode / Encode | Codec h265 / HEVC (8 bit) | Decode / Encode |
Decode / Encode | Codec h265 / HEVC (10 bit) | Decode / Encode |
Decode / Encode | Codec h264 | Decode / Encode |
Decode / Encode | Codec VP9 | Decode / Encode |
Decode / Encode | Codec VP8 | Decode / Encode |
Decode | Codec AV1 | Decode |
Decode / Encode | Codec AVC | Decode |
Decode / Encode | Codec VC-1 | Decode |
Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeThe MediaTek Dimensity 7030 supports a maximum of GB of memory in 0 memory channels. The Qualcomm Snapdragon 888+ can connect up to 16 GB of memory in 4 memory channels. |
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MediaTek Dimensity 7030 | Characteristic | Qualcomm Snapdragon 888+ |
LPDDR5, LPDDR4X | Memory | LPDDR5-6400 |
Max. Memory | 16 GB | |
0 | Memory channels | 4 (Quad Channel) |
-- | Max. Bandwidth | 51.2 GB/s |
No | ECC | No |
-- | L2 Cache | 4.00 MB |
-- | L3 Cache | 4.00 MB |
-- | PCIe version | -- |
-- | PCIe lanes | -- |
-- | PCIe Bandwidth | -- |
Thermal ManagementThe TDP (Thermal Design Power) of a processor specifies the required cooling solution. The MediaTek Dimensity 7030 has a TDP of --, that of the Qualcomm Snapdragon 888+ is --. |
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MediaTek Dimensity 7030 | Characteristic | Qualcomm Snapdragon 888+ |
-- | TDP (PL1 / PBP) | -- |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe MediaTek Dimensity 7030 has a 0.00 MB cache, while the Qualcomm Snapdragon 888+ cache has a total of 8.00 MB. |
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MediaTek Dimensity 7030 | Characteristic | Qualcomm Snapdragon 888+ |
6 nm | Technology | 5 nm |
Chiplet | Chip design | Chiplet |
Armv8-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
-- | ISA extensions | -- |
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android | Operating systems | Android |
Q3/2023 | Release date | Q3/2021 |
-- | Release price | -- |
show more data | show more data | |
MediaTek Dimensity 7030
8C 8T @ 2.50 GHz |
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Qualcomm Snapdragon 888+
8C 8T @ 3.00 GHz |
MediaTek Dimensity 7030
8C 8T @ 2.50 GHz |
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Qualcomm Snapdragon 888+
8C 8T @ 3.00 GHz |
MediaTek Dimensity 7030
8C 8T @ 2.50 GHz |
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Qualcomm Snapdragon 888+
8C 8T @ 3.00 GHz |
MediaTek Dimensity 7030
8C 8T @ 2.50 GHz |
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Qualcomm Snapdragon 888+
8C 8T @ 3.00 GHz |
MediaTek Dimensity 7030
8C 8T @ 2.50 GHz |
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Qualcomm Snapdragon 888+
8C 8T @ 3.00 GHz |
MediaTek Dimensity 7030
ARM Mali-G610 MP3 @ 0.00 GHz |
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Qualcomm Snapdragon 888+
Qualcomm Adreno 660 AV1 @ 0.84 GHz |
MediaTek Dimensity 7030
8C 8T @ 2.50 GHz |
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Qualcomm Snapdragon 888+
8C 8T @ 3.00 GHz |
MediaTek Dimensity 7030
8C 8T @ 2.50 GHz |
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Qualcomm Snapdragon 888+
8C 8T @ 3.00 GHz |
MediaTek Dimensity 7030
8C 8T @ 2.50 GHz |
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Qualcomm Snapdragon 888+
8C 8T @ 3.00 GHz |
Devices using this processor |
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MediaTek Dimensity 7030 | Qualcomm Snapdragon 888+ |
Unknown | Unknown |